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STCF conceptual design report (Volume 1): Physics & detector

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Frontiers of physics 2024年第1期19卷 1-154页

作者： M.Achasov X.C.Ai L.P.An R.Aliberti q.An X.Z.Bai Y.Bai O.Bakina A.Barnyakov V.Blinov V.Bobrovnikov D.Bodrov A.Bogomyagkov A.Bondar I.Boyko Z.H.Bu F.M.Cai H.Cai J.J.Cao q.H.Cao X.Cao Z.Cao q.Chang K.T.Chao D.Y.Chen H.Chen H.X.Chen J.F.Chen K.Chen L.L.Chen P.Chen S.L.Chen S.M.Chen S.Chen S.P.Chen W.Chen X.Chen X.F.Chen X.R.Chen Y.Chen Y.q.Chen H.Y.Cheng J.Cheng S.Cheng T.g.Cheng J.P.Dai L.Y.Dai X.C.Dai D.Dedovich A.Denig I.Denisenko J.M.Dias D.Z.Ding L.Y.Dong W.H.Dong V.Druzhinin D.S.Du Y.J.Du Z.g.Du L.M.Duan D.Epifanov Y.L.Fan S.S.Fang Z.J.Fang g.Fedotovich C.q.Feng X.Feng Y.T.Feng J.L.Fu J.gao Y.N.gao P.S.ge C.q.geng L.S.geng A.gilman L.gong T.gong B.gou W.gradl J.L.gu A.guevara L.C.gui A.q.guo F.K.guo J.C.guo J.guo Y.P.guo Z.H.guo A.guskov K.L.Han L.Han M.Han X.q.Hao J.B.He S.q.He X.g.He Y.L.He Z.B.He Z.X.Heng B.L.Hou T.J.Hou Y.R.Hou C.Y.Hu H.M.Hu K.Hu R.J.Hu W.H.Hu X.H.Hu Y.C.Hu J.Hua g.S.Huang J.S.Huang M.Huang q.Y.Huang W.q.Huang X.T.Huang X.J.Huang Y.B.Huang Y.S.Huang N.Hüsken V.Ivanov q.P.Ji J.J.Jia S.Jia Z.K.Jia H.B.Jiang J.Jiang S.Z.Jiang J.B.Jiao Z.Jiao H.J.Jing X.L.Kang X.S.Kang B.C.Ke M.Kenzie A.Khoukaz I.Koop E.Kravchenko A.Kuzmin Y.Lei E.Levichev C.H.Li C.Li D.Y.Li F.Li g.Li g.Li H.B.Li H.Li H.N.Li H.J.Li H.L.Li J.M.Li J.Li L.Li L.Li L.Y.Li N.Li P.R.Li R.H.Li S.Li T.Li W.J.Li X.Li X.H.Li X.q.Li X.H.Li Y.Li Y.Y.Li Z.J.Li H.Liang J.H.Liang Y.T.Liang g.R.Liao L.Z.Liao Y.Liao C.X.Lin D.X.Lin X.S.Lin B.J.Liu C.W.Liu D.Liu F.Liu g.M.Liu H.B.Liu J.Liu J.J.Liu J.B.Liu K.Liu K.Y.Liu K.Liu L.Liu q.Liu S.B.Liu T.Liu X.Liu Y.W.Liu Y.Liu Y.L.Liu Z.q.Liu Z.Y.Liu Z.W.Liu I.Logashenko Y.Long C.g.Lu J.X.Lu N.Lu q.F.Lü Y.Lu Y.Lu Z.Lu P.Lukin F.J.Luo T.Luo X.F.Luo Y.H.Luo H.J.Lyu X.R.Lyu J.P.Ma P.Ma Y.Ma Y.M.Ma F.Maas S.Malde D.Matvienko Z.X.Meng R.Mitchell A.Nefediev Y.Nefedov S.L.Olsen q.Ouyang P.Pakhlov g.Pakhlova X.Pan Y.Pan E.Passemar Y.P.Pei H.P.Peng L.Peng X.Y.Peng X.J.Peng K.Peters S.Pivovarov E.Pyata B.B.qi Y.q.qi W.B.qian Y.qian C.F.qiao J.J.qin J.J.qin L.q.qin X.S.qin T.L.qiu J.Rademacker C.F.Redmer H.Y.Sang Anhui University Hefei 230039China Beihang University Beijing 100191China Budker Institute of Nuclear Physics Novosibirsk 630090Russia CAS Key Laboratory of Theoretical Physics Institute of Theoretical PhysicsChinese Academy of SciencesBeijing 100190China Cavendish Laboratory University of CambridgeJJ Thomson AveCambridge CB30HEUnited Kingdom Central China Normal University Wuhan 430079China Central South University Changsha 410083China China University of geosciences Wuhan 430074China China University of Mining and Technology Xuzhou 221116China École Polytechnique Fédérale de Lausanne(EPFL) LausanneSwitzerland Fudan University Shanghai 200433China goethe University Frankfurt D-60325 Frankfurt am MainGermany guangxi Normal University Guilin 541004China guangxi Uninversity Nanning 530004China Hangzhou Institute for Advanced Study UCASHangzhou 310024China Hebei Normal University Shijiazhuang 050024China Hebei University Baoding 071002China Hefei University of Technology Hefei 230601China Helmholtz Institute Mainz Staudinger Weg 18D-55099 MainzGermany Henan Normal University Xinxiang 453007China Henan University Kaifeng 475004China High Energy Physics Center Chung-Ang UniversitySeoul 06974Korea Higher School of Economy 11 Pokrovsky Bulvar Moscow 109028Russia Huangshan University Huangshan 245000China Hubei University of Automotive Technology Shiyan 442002China Hunan Normal University Changsha 410081China Hunan University of Science and Technology Xiangtan 411201China Hunan University Changsha 410082China Indiana University BloomingtonIndiana 47405USA Inner Mongolia University Hohhot 010021China Institute of Advanced Science Facilities Shenzhen 518107China Institute of High Energy Physics Chinese Academy of SciencesBeijing 100049China Institute of Modern Physics Chinese Academy of SciencesLanzhou 730000China Institute of Physics Academia SinicaTaipeiTaiwan 11529China Institute of Theoretical Physics Chinese Academy of SciencesBeijing 100190China Jilin University Changch

The superτ-charm facility(STCF)is an electron–positron collider proposed by the Chinese particle physics *** is designed to operate in a center-of-mass energy range from 2 to 7 geV with a peak luminosity of 0.5×10^(35) cm^(–2)·s^(–1) or *** STCF will produce a data sample about a factor of 100 larger than that of the presentτ-charm factory—the BEPCII,providing a unique platform for exploring the asymmetry of matter-antimatter(charge-parity violation),in-depth studies of the internal structure of hadrons and the nature of non-perturbative strong interactions,as well as searching for exotic hadrons and physics beyond the Standard *** STCF project in China is under development with an extensive R&D *** document presents the physics opportunities at the STCF,describes conceptual designs of the STCF detector system,and discusses future plans for detector R&D and physics case studies.

关键词： electron–positron collider tau-charm region high luminosity STCF detector conceptual design

Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability

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Engineering 2015年第3期1卷 384-390页

作者： Xuejun Fan Liangbiao Chen C.P.Wong Hsing-Wei Chu g.q.zhang Department of Mechanical Engineering Lamar University State Key Laboratory of Solid State Lighting School of Materials Science and Engineering Georgia Tech Delft University of Technology Institute of Semiconductors Chinese Academy of Sciences

Modeling vapor pressure is crucial for studying the moisture reliability of microelectronics, as high vapor pressure can cause device failures in environments with high temperature and humidity. To minimize the impact of vapor pressure, a super-hydrophobic(SH) coating can be applied on the exterior surface of devices in order to prevent moisture penetration. The underlying mechanism of SH coating for enhancing device reliability, however, is still not fully understood. In this paper, we present several existing theories for predicting vapor pressure within microelectronic materials. In addition, we discuss the mechanism and effectiveness of SH coating in preventing water vapor from entering a device, based on experimental results. Two theoretical models, a micro-mechanics-based whole-field vapor pressure model and a convection-diffusion model, are described for predicting vapor pressure. Both methods have been successfully used to explain experimental results on uncoated samples. However, when a device was coated with an SH nanocomposite, weight gain was still observed, likely due to vapor penetration through the SH surface. This phenomenon may cast doubt on the effectiveness of SH coatings in microelectronic devices. Based on current theories and the available experimental results, we conclude that it is necessary to develop a new theory to understand how water vapor penetrates through SH coatings and impacts the materials underneath. Such a theory could greatly improve microelectronics reliability.

关键词： vapor pressure moisture semiconductor reliability microelectromechanical systems (MEMS) superhydrophobic nanocomposite coating

Multi-LED package design,fabrication and thermal analysis

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Journal of Semiconductors 2013年第5期34卷 54-58页

作者： R.H.Poelma S.Tarashioon H.W.van Zeijl S.goldbach J.L.J.Zijl g.q.zhang Delft University of Technology DelftThe Netherlands Philips Lighting EindhovenThe Netherlands Fico/Besi DuivenThe Netherlands

An ultra-thin multi-LED package is designed, manufactured and its thermal performance is character- ized. The objective of this study is to develop an efficient thermal modelling approach for this system which can be used for optimization of the thermal-performance of future ultra-thin designs. A high-resolution thermal imaging camera and thermocouples were used to measure the temperature distribution of the multi-LED package and the LED-die temperature for different operating powers. Finally, we compare the thermal measurements with the finite element simulation results. It is concluded that the modelling approach can assist in the thermal optimization of future multi-LED package designs.

关键词： LED packaging optics molding high-resolution thermal imaging thermal modeling and measure-ments

INVESTIgATION INTO HOT DEFORMATION BEHAVIOR OF SPRAY FORMED SUPERALLOY gH742

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Acta Metallurgica Sinica(English Letters) 2004年第2期17卷 205-209页

作者： Z.Li g.q.zhang Z.H.zhang S.F.Tian National Key Lab.of High Temperature Structural Materials,Beijing Institute of Aeronautical Materials,Beijing 100095,China National Key Lab. of High Temperature Structural Materials Beijing Institute of Aeronautical MaterialsBeijing 100095China

In order to evaluate the deformation characteristics of spray formed superalloy gH742and determine the appropriate forging procedure of the alloy on this basis, the influenceof deformation temperature and strain rate on the ductility of spray formed gH742was investigated by using the gleeble-3500 thermal-mechanical testing machine. It isshown that the forgeability of spray formed gH742 is better than conventional gH742by ingot metallurgy because of refined grain structure and enhanced chemical homo-geneity of spray formed gH742. In the temperature range of 1020 to 1100℃, theductility of spray formed gH742 is dependent on the deformation temperature and isincreased linearly in proportion to the increment of deformation temperature, whichis more than 40% at 1020℃ and more than 60% at the temperature between 1100and 1140℃. Furthermore, the results indicate the flow stress is affected considerablyby the deformation temperature and strain rate. In the temperature range of 1020 to1140℃, the maximum flow stress of spray formed gH742 increases with the incrementof strain rate and decreases with the increment of the deformation temperature.

关键词： spray forming superalloy gH742 hot deformation physical simulation

D.C measurements and ion transport properties on multi-ion system

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D.C measurements and ion transport properties on multi-ion s...

Location of Asymmetric ground Fault Using Virtual Injected Current Ratio and Two-stage Recovery Strategy in Distribution Networks

第九届全国氢能学术会议

作者： g.q.zhang~1,C.Y.Wang~1,B.Zhu~2 1 Tianjin University,China 2 Royal Institutef Technology,Sweden

＜正＞Ionic and proton/oxygen ion conductivity and transport properties of composites consisting of samaria-doped ceria（SDC） by carbonate co-precipitation and sodium-lithium-carbonate（NL） were investigated at the temperature of 400-600℃.Direct current conductivity measurement was first put forwards by using Wagner polarization in

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来源： cnki会议评论

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CSEE Journal of Power and Energy Systems 2024年第1期10卷 151-161页

作者： Haiting Shan Luliang zhang q.H.Wu Mengshi Li School of Electric Power Engineering South China University of Technology(SCUT)Guangzhou 510641China

Sparse measurements challenge fault location in distribution *** paper proposes a method for asymmetric ground fault location in distribution networks with limited measurements.A virtual injected current vector is formulated to estimate the fault line,which can be reconstructed from voltage sags measured at a few buses using compressive sensing(CS).The relationship between the virtual injected current ratio(VICR)and fault position is deduced from circuit analysis to pinpoint the ***,a two-stage recovery strategy is proposed for improving reconstruction accuracy of the current vector,where two different sensing matrixes are utilized to improve the *** proposed method is validated in IEEE 34 node test *** results show asymmetric ground fault type,resistance,fault position and access of distributed generators(Dgs)do not significantly influence performance of our *** addition,it works effectively under various scenarios of noisy measurement and line parameter *** on 134 node test feeders prove the proposed method is also suitable for systems with more complex structure.

关键词： Distribution networks fault location reconstruction accuracy two-stage recovery virtual injected current ratio

APSO-CNN-SE: An Adaptive Convolutional Neural Network Approach for IoT Intrusion Detection

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Computers, Materials and Continua 2024年第1期81卷 567-601页

作者： Ban Y. zhang D. He q. Shen q. College of Big Data and Information Engineering Guizhou University Guizhou 550025 China

The surge in connected devices and massive data aggregation has expanded the scale of the Internet of Things (IoT) networks. The proliferation of unknown attacks and related risks, such as zero-day attacks and Distributed Denial of Service (DDoS) attacks triggered by botnets, have resulted in information leakage and property damage. Therefore, developing an efficient and realistic intrusion detection system (IDS) is critical for ensuring IoT network security. In recent years, traditional machine learning techniques have struggled to learn the complex associations between multidimensional features in network traffic, and the excellent performance of deep learning techniques, as an advanced version of machine learning, has led to their widespread application in intrusion detection. In this paper, we propose an Adaptive Particle Swarm Optimization Convolutional Neural Network Squeeze-and-Excitation (APSO-CNN-SE) model for implementing IoT network intrusion detection. A 2D CNN backbone is initially constructed to extract spatial features from network traffic. Subsequently, a squeeze-and-excitation channel attention mechanism is introduced and embedded into the CNN to focus on critical feature channels. Lastly, the weights and biases in the CNN-SE are extracted to initialize the population individuals of the APSO. As the number of iterations increases, the population’s position vector is continuously updated, and the cross-entropy loss function value is minimized to produce the ideal network architecture. We evaluated the models experimentally using binary and multiclassification on the UNSW-NB15 and NSL-KDD datasets, comparing and analyzing the evaluation metrics derived from each model. Compared to the base CNN model, the results demonstrate that APSO-CNN-SE enhances the binary classification detection accuracy by 1.84% and 3.53% and the multiclassification detection accuracy by 1.56% and 2.73% on the two datasets, respectively. Additionally, the model outperforms the

关键词： adaptive particle swarm optimization channel attention mechanism convolutional neural network internet of things Intrusion detection system

Seismic and geological evidence of hidden faults in the Yinpan Reservoir area based on a dense seismic array

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Science China Earth Sciences 2024年第7期67卷 2401-2407页

作者： guangyao YIN Huai zhang Liwen gONg q ipeng BAI Yicun gUO Bing zhang Yaolin SHI Key Laboratoryof Earth System Numerical Modeling and Application(Chinese Academyof Sciences) College of Earth and Planetary SciencesUniversity of Chinese Academy of SciencesBeijing 100049China Key Laboratory of Computational geodynamics Chinese Academy of SciencesBeijing 100049China Southern Marine Science and Engineering guangdong Laboratory(Zhuhai) Zhuhai 519080China Beijing Yanshan Critical Zone National Field Scientific Observation and Research Station Beijing 101408China Chongqing Earthquake Agency Chongqing 401147 China Institute of Earthquake Forecasting China Earthquake AdministrationBeijing 100036China Hangzhou Applied Acoustics Research Institute Hangzhou 311100China State Key Laboratory of geodesy and Earths Dynamics Innovation Academy for Precision Measurement Science and TechnologyCASWuhan 430077China

*** November 23,2017,an M_(S)5.0 earthquake occurred in Wulong,Chongqing,China,resulting in tens of casualties and considerable economic ***,the epicenter of this earthquake was located in the transition zone from the... 详细信息

关键词： earthquake southeast seismic

在跌落撞击负载条件下的键合互连可靠性测试(英文)

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电子工业专用设备 2008年第1期37卷 1-9页

作者： J.J.M. Zaal W.D. van Driel H.P.Hochstenbachl g.q.zhang NXP Semiconductors The NetherlandsThe Netherlands Gerstweg 26534AE Nijmegen The Netherlands Delft University of Technology The Netherlands Gerstweg 2 6534AE Nijmegen The Netherlands

在大多数移动通信装置的寿命中最常见的故障是通过跌落撞击产生的。这是当今通过跌落撞击测试的方法测得的,该方法已经通过了JEDEC标准。然而这种方法相当耗时,且复验性方面还存在着一些问题。报道的研究是在与焊凸冷拉相关联的跌落撞... 详细信息

在大多数移动通信装置的寿命中最常见的故障是通过跌落撞击产生的。这是当今通过跌落撞击测试的方法测得的,该方法已经通过了JEDEC标准。然而这种方法相当耗时,且复验性方面还存在着一些问题。报道的研究是在与焊凸冷拉相关联的跌落撞击测试情况下完成的,这两者之间可以替代。本研究方法旨在了解引起故障的机械负载,并不仅仅是适合于数据。因此,跌落撞击测试便成为一种模式并备用来验证这一模式的试验,它将成为未来的处理方式。完成的焊凸冷拉测试研究证实,该测试未将焊凸偏移至一种确定的故障模式,测试研究的结果以及有关焊凸的模拟情况一并作了阐述。两种测试似乎是测试了相同的现象,根据来自CBP(cold bump pull)的结果表明与跌落撞击测试的情况相同,但由于模拟和试验工作尚未完全结束,其中的详情暂无法提供。

关键词：互连可靠性 PCB 跌落撞击测试焊凸冷拉测试