Multi-LED package design,fabrication and thermal analysis

作     者：R.H.Poelma S.Tarashioon H.W.van Zeijl S.Goldbach J.L.J.Zijl G.Q.Zhang 

作者机构：Delft University of TechnologyDelftThe Netherlands Philips LightingEindhovenThe Netherlands Fico/BesiDuivenThe Netherlands 

出 版 物：《Journal of Semiconductors》 (半导体学报（英文版）)

年 卷 期：2013年第34卷第5期

页      面：54-58页

核心收录：

学科分类：08[工学] 0803[工学-光学工程] 

基　　金：CATRENE L Project CA502 SEEL-Solutions for Energy-Efficient Lighting for financial support 

主　　题：LED packaging optics molding high-resolution thermal imaging thermal modeling and measure-ments 

摘      要：An ultra-thin multi-LED package is designed, manufactured and its thermal performance is character- ized. The objective of this study is to develop an efficient thermal modelling approach for this system which can be used for optimization of the thermal-performance of future ultra-thin designs. A high-resolution thermal imaging camera and thermocouples were used to measure the temperature distribution of the multi-LED package and the LED-die temperature for different operating powers. Finally, we compare the thermal measurements with the finite element simulation results. It is concluded that the modelling approach can assist in the thermal optimization of future multi-LED package designs.