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Multi-LED package design,fabrication and thermal analysis

Journal of Semiconductors 2013年第5期34卷 54-58页

作者： r.h.poelma S.Tarashioon h.W.van Zeijl S.Goldbach J.L.J.Zijl G.Q.Zhang Delft University of Technology DelftThe Netherlands Philips Lighting EindhovenThe Netherlands Fico/Besi DuivenThe Netherlands

An ultra-thin multi-LED package is designed, manufactured and its thermal performance is character- ized. The objective of this study is to develop an efficient thermal modelling approach for this system which can be used for optimization of the thermal-performance of future ultra-thin designs. A high-resolution thermal imaging camera and thermocouples were used to measure the temperature distribution of the multi-LED package and the LED-die temperature for different operating powers. Finally, we compare the thermal measurements with the finite element simulation results. It is concluded that the modelling approach can assist in the thermal optimization of future multi-LED package designs.

关键词： LED packaging optics molding high-resolution thermal imaging thermal modeling and measure-ments

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high-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout

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Microsystems & Nanoengineering 2019年第1期5卷 24-37页

作者： Brahim El Mansouri Luke M.Middelburg rene h.poelma Guo Qi Zhang henk Wvan Zeijl Jia Wei hui Jiang Johan G.Vogel Willem Dvan Driel Electronic Components Technology and MaterialsFaculty of Electrical EngineeringDelft University of TechnologyMekelweg 42628CD DelftThe Netherlands Else Kooi Laboratory Feldmannweg 172628CT DelftThe Netherlands Electronic Instrumentation Faculty of Electrical EngineeringDelft University of TechnologyMekelweg 42628CD DelftThe Netherlands Signify High Tech Campus 485656AE EindhovenThe Netherlands

Commercially available gravimeters and seismometers can be used for measuring Earth’s acceleration at resolution levels in the order of ng/√hz(where g represents earth’s gravity)but they are typically high-cost and *** this work the design of a bulk micromachined MEMS device exploiting non-linear buckling behaviour is described,aiming for ng/√hz resolution by maximising mechanical and capacitive *** mechanical sensitivity is obtained through low structural ***-zero stiffness is achieved through geometric design and large deformation into a region where the mechanism is statically balanced or neutrally ***,the device has an integrated capacitive comb transducer and makes use of a high-resolution impedance readout *** sensitivity from displacement to a change in capacitance was maximised within the design and process boundaries given,by making use of a trench isolation technique and exploiting the large-displacement behaviour of the *** measurement results demonstrate that the resonance frequency can be tuned from 8.7 hz–18.7 hz,depending on the process parameters and the tilt of the *** this system,which combines an integrated capacitive transducer with a sensitivity of 2.55 aF/nm and an impedance readout chip,the theoretically achievable system resolution equals 17.02 ng/√*** small size of the device and the use of integrated readout electronics allow for a wide range of practical applications for data collection aimed at the internet of things.

关键词： behaviour displacement resolution

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