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Laser-driven programmable non-contact transfer printing of objects onto arbitrary receivers via an active elastomeric microstructured stamp

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National Science Review 2020年第2期7卷 296-304页

作者： Hongyu Luo Chengjun Wang Changhong Linghu Kaixin Yu Chao Wang jizhou song Department of Engineering Mechanics Soft Matter Research Center and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province Zhejiang University

Transfer printing, as an important assembly technique, has attracted much attention due to its valuable merits to develop novel forms of electronics such as stretchable inorganic electronics requiring the heterogeneous integration of inorganic materials with soft elastomers. Here, we report on a laser-driven programmable non-contact transfer printing technique via a simple yet robust design of active elastomeric microstructured stamp that features cavities filled with air and embedded under the contacting surface, a micro-patterned surface membrane that encapsulates the air cavities and a metal layer on the inner-cavity surfaces serving as the laser-absorbing layer. The micro-patterned surface membrane can be inflated dynamically to control the interfacial adhesion, which can be switched from strong state to weak state by more than three orders of magnitude by local laser heating of the air in the cavity with a temperature increase below 100℃. Theoretical and experimental studies reveal the fundamental aspects of the design and fabrication of the active elastomeric microstructured stamp and the operation of non-contact transfer printing. Demonstrations in the programmable transfer printing of micro-scale silicon platelets and micro-scale LED chips onto various challenging receivers illustrate the extraordinary capabilities for deterministic assembly that are difficult to address by existing printing schemes, thereby creating engineering opportunities in areas requiring the heterogeneous integration of diverse materials such as curvilinear electronics and Micro LED displays.

关键词： tunable adhesion transfer printing heterogeneous integration laser-driven

Recent advances on thermal analysis of stretchable electronics

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Theoretical & Applied Mechanics Letters 2016年第1期6卷 32-37页

作者： Yuhang Li Yuyan Gao jizhou song Institute of Solid Mechanics Beihang University (BUAA) Department of Engineering Mechanics Zhejiang University Soft Matter Research Center Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceZhejiang University

Stretchable electronics, which offers the performance of conventional wafer-based devices and mechan- ical properties of a rubber band, enables many novel applications that are not possible through conven- tional electronics due to its brittle nature. One effective strategy to realize stretchable electronics is to design the inorganic semiconductor material in a stretchable format on a compliant elastomeric substrate. Engineering thermal management is essential for the development of stretchable electronics to avoid adverse thermal effects on its performance as well as in applications involving human body and biological tissues where even 1-2℃ temperature increase is not allowed. This article reviews the recent advances in thermal management of stretchable inorganic electronics with focuses on the thermal models and their comparisons to experiments and finite element simulations.

关键词： Stretchable electronics Thermal analysis Scaling law

Implantable Thermal Therapeutic Device with Precise Temperature Control Enabled by Foldable Electronics and Heat-Insulating Pads

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Research 2022年第3期2022卷 297-307页

作者： Min Cai Huang Yang Liyin Shen Shuang Nie Zhengwei Mao Changyou Gao Yang Zhu jizhou song Department of Rehabilitation Medicine the First Affiliated Hospital College of MedicineZhejiang UniversityHangzhou 310003China Department of Engineering Mechanics Soft Matter Research Centerand Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceZhejiang UniversityHangzhou 310027China MOE Key Laboratory of Macromolecular Synthesis and Functionalization Department of Polymer Science and EngineeringZhejiang UniversityHangzhou 310027China State Key Laboratory of Fluid Power and Mechatronic Systems Zhejiang UniversityHangzhou 310027China

Thermal therapy has continued to attract the attention of researchers and clinicians due to its important applications in tumor ablation,wound management,and drug release.The lack of precise temperature control capability in traditional thermal treatment may cause the decrease of therapeutic effect and thermal damage to normal tissues.Here,we report an implantable thermal therapeutic device(ITTD),which offers precise closed loop heating,in situ temperature monitoring,and thermal protection.The ITTD features a multifunctional foldable electronics device wrapped on a heat-insulating composite pad.Experimental and numerical studies reveal the fundamental aspects of the design,fabrication,and operation of the ITTD.In vivo experiments of the ITTD in thermal ablation for antitumor demonstrate that the proposed ITTD is capable of controlling the ablation temperature precisely in real time with a precision of at least 0.7℃ and providing effective thermal protection to normal tissues.This proof-of-concept research creates a promising route to develop ITTD with precise temperature control capability,which is highly desired in thermal therapy and other disease diagnosis and treatments.

关键词： composite precise treatment

Transfer printing techniques for flexible and stretchable inorganic electronics

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npj Flexible Electronics 2018年第1期2卷 199-212页

作者： Changhong Linghu Shun Zhang Chengjun Wang jizhou song Department of Engineering Mechanics Soft Matter Research Centerand Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceZhejiang University310027 HangzhouChina

Transfer printing is an emerging deterministic assembly technique for micro-fabrication and nano-fabrication,which enables the heterogeneous integration of classes of materials into desired functional layouts.It creates engineering opportunities in the area of flexible and stretchable inorganic electronics with equal performance to conventional wafer-based devices but the ability to be deformed like a rubber,where prefabricated inorganic semiconductor materials or devices on the donor wafer are required to be transfer-printed onto unconventional flexible substrates.This paper provides a brief review of recent advances on transfer printing techniques for flexible and stretchable inorganic electronics.The basic concept for each transfer printing technique is overviewed.The performances of these transfer printing techniques are summarized and compared followed by the discussions of perspectives and challenges for future developments and applications.

关键词： printing inorganic discussions

A thermal actuated switchable dry adhesive with high reversibility for transfer printing

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International Journal of Extreme Manufacturing 2021年第3期3卷 74-82页

作者： Shun Zhang Hongyu Luo Suhao Wang Zhou Chen Shuang Nie Changying Liu jizhou song Department of Engineering Mechanics Soft Matter Research Centerand Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceZhejiang UniversityHangzhou 310027People’s Republic of China State Key Laboratory of Fluid Power and Mechatronic Systems Zhejiang UniversityHangzhou 310027People’s Republic of China

Transfer printing based on switchable adhesive that heterogeneously integrates materials is essential to develop novel electronic systems,such as flexible electronics and micro LED displays.Here,we report a robust design of a thermal actuated switchable dry adhesive,which features a stiff sphere embedded in a thermally responsive shape memory polymer(SMP)substrate and encapsulated by an elastomeric membrane.This construct bypasses the unfavorable micro-and nano-fabrication processes and yields an adhesion switchability of over1000 by combining the peel-rate dependent effect of the elastomeric membrane and the thermal actuation of the sub-surface embedded stiff sphere.Experimental and numerical studies reveal the underlying thermal actuated mechanism and provide insights into the design and operation of the switchable adhesive.Demonstrations of this concept in stamps for transfer printing of fragile objects,such as silicon wafers,silicon chips,and inorganic micro-LED chips,onto challenging non-adhesive surfaces illustrate its potential in heterogeneous material integration applications,such as flexible electronics manufacturing and deterministic assembly.

关键词： switchable adhesive reversible adhesive transfer printing flexible electronics

Switchable dry adhesive based on shape memory polymer with hemispherical indenters for transfer printing

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Theoretical & Applied Mechanics Letters 2021年第6期11卷 375-379页

作者： Hongyu Luo Chenglong Li Chuanqian Shi Shuang Nie jizhou song Department of Engineering Mechanics Soft Matter Research Centerand Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceZhejiang UniversityHangzhou 310027China State Key Laboratory of Fluid Power and Mechatronic Systems Zhejiang UniversityHangzhou 310027China

Transfer printing based on switchable adhesive is essential for developing unconventional systems,including flexible electronics,stretchable electronics,and micro light-emitting diode(LED)displays.Here we report a design of switchable dry adhesive based on shape memory polymer(SMP)with hemispherical indenters,which offers a continuously tunable and reversible adhesion through the combination of the preloading effect and the thermal actuation of SMP.Experimental and numerical studies reveal the fundamental aspects of design,fabrication,and operation of the switchable dry adhesive.Demonstrations of this adhesive concept in transfer printing of flat objects(e.g.,silicon wafers),three-dimensional(3D)objects(e.g.,stainless steel balls),and rough objects(e.g.,frosted glasses)in two-dimensional(2D)or 3D layouts illustrate its unusual manipulation capabilities in heterogeneous material integration applications.

关键词： Switchable dry adhesive Shape memory polymer Transfer printing

Transient thermo-mechanical analysis for bimorph soft robot based on thermally responsive liquid crystal elastomers

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Applied Mathematics and Mechanics(English Edition) 2019年第7期40卷 943-952页

作者： Yun CUI Yafei YIN Chengjun WANG K. SIM Yuhang LI Cunjiang YU jizhou song Institute of Solid Mechanics Beihang University Beijing 100191 China Department of Engineering Mechanics Soft Matter Research Center Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province Zhejiang University Hangzhou 310027 China Materials Science and Engineering Program University of Houston Houston TX 77204 U. S.A. State Key Laboratory of Strength and Vibration of Mechanical Structures School of Aerospace Engineering Xi’an Jiaotong University Xi’an 710049 China Department of Mechanical Engineering University of Houston Houston TX 77204 U. S.A. Department of Electrical and Computer Engineering University of Houston Houston TX 77204 U. S.A. Department of Biomedical Engineering Texas Center for Superconductivity University of Houston Houston TX 77204 U. S.A.

Thermally responsive liquid crystal elastomers (LCEs) hold great promise in applications of soft robots and actuators because of the induced size and shape change with temperature. Experiments have successfully demonstrated that the LCE based bimorphs can be effective soft robots once integrated with soft sensors and thermal actuators. Here, we present an analytical transient thermo-mechanical model for a bimorph structure based soft robot, which consists of a strip of LCE and a thermal inert polymer actuated by an ultra-thin stretchable open-mesh shaped heater to mimic the unique locomotion behaviors of an inchworm. The coupled mechanical and thermal analysis based on the thermo-mechanical theory is carried out to underpin the transient bending behavior, and a systematic understanding is therefore achieved. The key analytical results reveal that the thickness and the modulus ratio of the LCE and the inert polymer layer dominate the transient bending deformation. The analytical results will not only render fundamental understanding of the actuation of bimorph structures, but also facilitate the rational design of soft robotics.

关键词： transient thermo-mechanical analysis soft robot thermal-responsive liq- uid crystal elastomer (LCE)

Vibration analysis of fluid-conveying nanotubes embedded in an elastic medium considering surface effects

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Theoretical & Applied Mechanics Letters 2012年第3期2卷 41-44页

作者： Yuhang Li Bo Fang Jiazhong Zhang jizhou song School of Astronautics Harbin Institute of Technology Harbin 150001 China Department of Mechanical and Aerospace Engineering University of Miami Coral Gables FL 33146 USA

An analytical model is developed to study the surface effects on the vibration behavior including the natural frequency and the critical flow velocity of fluid-conveying nanotubes embedded in an elastic medium. The effects of surface elasticity and residual surface stress are accounted through the surface elasticity model and the Young-Laplace equation. A Winkler-type foundation is employed to model the interaction of nanotubes and the surrounding medium. The results show that the surface effects have more prominent influences on the nature frequency with smaller nanotube thickness, larger aspect ratio and larger elastic medium constants. Both surface layers and the elastic medium enhance the stability of nanotubes. This study might be helpful for designing the fluid-conveying nanotube devices in NEMS and MEMS systems.

关键词： surface effect fluid-conveying nanotube vibration stability

Editorial: Thermal Stresses

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Theoretical & Applied Mechanics Letters 2019年第5期9卷 277-278页

作者： jizhou song Weiqiu Chen the Department of Engineering Mechanics at Zhejiang University

Thermomechanical properties of materials have significant influences on the normal operation and service life of devices and structures.It is therefore of crucial importance to analyze their thermomechanical responses in numerous application areas such as mechanical engineering,civil engineering,electronic technology,and machine manufacturing.Demands on thermomechanical analyses or thermal stress analysis of materials and structures subject to various thermal loads are growing with the expanding of novel materials(e.g.,graphene,phononic crystals),new technologies(e.g.,three-dimensional printing,transfer printing),and new devices(e.g.,flexible electronics,stretchable electronics).In the last few decades,thermal stress analyses have attracted much attention from academia and industry with not only Journal of Thermal Stresses for publishing novel and cutting edge researches,but also series of International Congress on Thermal Stresses to exchange ideas and extend further collaborations for scientists and engineers who are involved in the field of thermal stresses.

关键词： printing expanding electronics