A thermal actuated switchable dry adhesive with high reversibility for transfer printing

作     者：Shun Zhang Hongyu Luo Suhao Wang Zhou Chen Shuang Nie Changying Liu Jizhou Song Shun Zhang;Hongyu Luo;Suhao Wang;Zhou Chen;Shuang Nie;Changying Liu;Jizhou Song

作者机构：Department of Engineering MechanicsSoft Matter Research Centerand Key Laboratory of Soft Machines and Smart Devices of Zhejiang ProvinceZhejiang UniversityHangzhou 310027People’s Republic of China State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou 310027People’s Republic of China 

出 版 物：《International Journal of Extreme Manufacturing》 (极端制造（英文）)

年 卷 期：2021年第3卷第3期

页      面：74-82页

核心收录：

学科分类：08[工学] 0822[工学-轻工技术与工程] 

基　　金：financial support from the National Natural Science Foundation of China(Grant Nos.11872331 and U20A6001) the Zhejiang University K P Chao’s High Technology Development Foundation 

主　　题：switchable adhesive reversible adhesive transfer printing flexible electronics 

摘      要：Transfer printing based on switchable adhesive that heterogeneously integrates materials is essential to develop novel electronic systems,such as flexible electronics and micro LED ***,we report a robust design of a thermal actuated switchable dry adhesive,which features a stiff sphere embedded in a thermally responsive shape memory polymer(SMP)substrate and encapsulated by an elastomeric *** construct bypasses the unfavorable micro-and nano-fabrication processes and yields an adhesion switchability of over1000 by combining the peel-rate dependent effect of the elastomeric membrane and the thermal actuation of the sub-surface embedded stiff *** and numerical studies reveal the underlying thermal actuated mechanism and provide insights into the design and operation of the switchable *** of this concept in stamps for transfer printing of fragile objects,such as silicon wafers,silicon chips,and inorganic micro-LED chips,onto challenging non-adhesive surfaces illustrate its potential in heterogeneous material integration applications,such as flexible electronics manufacturing and deterministic assembly.