Localized CO_2 laser bonding process for MEMS packaging
Localized CO_2 laser bonding process for MEMS packaging作者机构：Department of Mechanical Engineering University of Arkansas Fayetteville AR 72701 USA wiSpry Inc. Irvine CA 92618 USA wiSpry Inc. Cary NC 27513 USA
出 版 物：《中国有色金属学会会刊：英文版》 (Transactions of Nonferrous Metals Society of China)
年 卷 期：2006年第16卷第B02期
页 面：577-581页
核心收录：
学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学]
基 金：ECS-NSF, (050 1597) WiSpry Inc
主 题：微电子机械系统 MEMS 封装 局部激光焊接过程 有限元分析
摘 要：The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered performance of the MEMS device after packaging caused by thermal exposure. The localized laser bonding technique for ceramic MEMS packaging to address above-mentioned challenges was investigated. A continuous wave CO2 laser was used to locally heat sealing material for ceramic MEMS package lid to substrate bonding. To determine the laser power density and scanning speed, finite element analysis thermal models were constructed to simulate the localized laser bonding process. Further, the effect of external pressure at sealing ring on the bonding formation was studied. Pull testing results show that the scanning speed and external pressure have significant influence on the pull strength at the bonding interface. Cross-sectional microscopy of the bonding interface indicates that the packages bonded with relatively low scanning speed and external pressure conditions have higher bonding quality. This research demonstrates the potential of localized laser bonding process for ceramic MEMS packaging.
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