Overview of Computational Modeling in Nano/Micro Scaled Thin Films Mechanical Properties and Its Applications

作     者：Chang-Chun Lee Pei-Chen Huang 

作者机构：Department of Power Mechanical EngineeringNational Tsing Hua UniversityNo.101Section 2Kuang-Fu RoadHsinchu 30013Taiwan 

出 版 物：《Computer Modeling in Engineering & Sciences》 (工程与科学中的计算机建模（英文）)

年 卷 期：2019年第120卷第8期

页      面：239-260页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 0835[工学-软件工程] 0811[工学-控制科学与工程] 0701[理学-数学] 0812[工学-计算机科学与技术（可授工学、理学学位）] 

基　　金：Ministry of Science and Technology  Taiwan  MOST  (106-2221-E-007-126-MY3  MOST 107-2622-E-007-010-CC3) 

主　　题：Computational mechanics mechanical responses nano/micro thin films 

摘      要：This research reviews the application of computational mechanics on the properties of nano/micro scaled thin films,in which the application of different computational methods is *** concept and fundamental theories of concerned applications,material behavior estimations,interfacial delamination behavior,strain engineering,and multilevel modeling are thoroughly ***,an example of an interfacial adhesion estimation is presented to systematically estimate the related mechanical reliability issue in the microelectronic *** presented results show that the peeled mode fracture is the dominant delamination behavior of layered material system,with high stiffness along the bonding ***,the shear mode fracture being dominated as the polymer cover plate with low moduli is *** occurrence of crack advance is also significantly influenced by the interfacial crack length and applied ***,this paper could serve as a guideline of several engineering cases with the assistance of computational mechanics.