Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys

作     者：M. A. Wadud M. A. Gafur M. R. Qadir M. O. Rahman 

作者机构：Department of Physics Jahangirnagar University Savar Bangladesh PP&PDC BCSIR Dhaka Bangladesh 

出 版 物：《Materials Sciences and Applications》 (材料科学与应用期刊（英文）)

年 卷 期：2015年第6卷第11期

页      面：1008-1013页

学科分类：08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

主　　题：Lead Free Solder Alloy Eutectic Alloy DTA TMA Conductivity 

摘      要：Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties. Thermo-mechanical Analysis and Differential Thermal Analysis were used to investigate thermal properties. Microstructural study is carried out with Scanning Electron Microscope. The alloys have single melting point. The co-efficient of thermal expansion and co-efficient of thermal contraction varies with alloy composition and temperature range. Electrical conductivity changes with Bi addition.