咨询与建议

看过本文的还看了

相关文献

该作者的其他文献

文献详情 >Cu(In,Ga)Se_(2)based ultrathin... 收藏

Cu(In,Ga)Se_(2)based ultrathin solar cells the pathway from lab rigid to large scale flexible technology

作     者:T.S.Lopes J.P.Teixeira M.A.Curado B.R.Ferreira A.J.N.Oliveira J.M.V.Cunha M.Monteiro A.Violas J.R.S.Barbosa P.C.Sousa I.Çaha J.Borme K.Oliveira J.Ring W.C.Chen Y.Zhou K.Takei E.Niemi F.L.Deepak M.Edoff G.Brammertz P.A.Fernandes B.Vermang P.M.P.Salomé 

作者机构:INL-International Iberian Nanotechnology LaboratoryAvenida Mestre JoséVeiga4715-330 BragaPortugal Hasselt Universityimo-imomecMartelarenlaan 423500 HasseltBelgium Imecimo-imomecThor Park 83203600 GenkBelgium EnergyVilleimo-imecThorPark 83203600 GenkBelgium CFisUCDepartment of PhysicsUniversity of CoimbraP-3004-516 CoimbraPortugal Departamento de FísicaUniversidade de AveiroCampus Universitário de Santiago3810-193 AveiroPortugal i3NUniversidade de AveiroCampus Universitário de Santiago3810-193 AveiroPortugal Obducat ABMedicon Village22363 LundSweden Ångström LaboratoryDepartment of Engineering SciencesUppsala University75121 UppsalaSweden Midsummer ABElektronikhõjden 6SE-17543 JãrfãllaSweden CIETIDepartamento de FísicaInstituto Superior de Engenharia do PortoInstituto Politécnico do Porto4200-072 PortoPortugal 

出 版 物:《npj Flexible Electronics》 (npj-柔性电子(英文))

年 卷 期:2023年第7卷第1期

页      面:524-534页

核心收录:

学科分类:080903[工学-微电子学与固体电子学] 0808[工学-电气工程] 0809[工学-电子科学与技术(可授工学、理学学位)] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学] 

基  金:InovSolarCells(PTDC/FISMAC/29696/2017)co-funded by FCT and the ERDF through COMPETE2020 And by the European Union’s Horizon 2020 research and innovation programme under the grants agreements N°.720887(ARCIGS-M project) grand agreement N°.715027(Uniting PV) P.M.P.S.and P.A.F.would like to acknowledge FCT for the support of the project FCT UIDB/04730/2020 This work was developed within the scope of the project i3N,UIDB/50025/2020&UIDP/50025/2020,financed by national funds through the FCT/MEC 

主  题:lithography ultrathin rigid 

摘      要:The incorporation of interface passivation structures in ultrathin Cu(In,Ga)Se_(2)based solar cells is *** fabrication used an industry scalable lithography technique—nanoimprint lithography(NIL)—for a 15×15 cm^(2)dielectric layer *** with a NIL nanopatterned dielectric layer are benchmarked against electron-beam lithography(EBL)patterning,using rigid *** NIL patterned device shows similar performance to the EBL patterned *** impact of the lithographic processes in the rigid solar cells’performance were evaluated via X-ray Photoelectron Spectroscopy and through a Solar Cell Capacitance *** device on stainless-steel showed a slightly lower performance than the rigid approach,due to additional challenges of processing steel substrates,even though scanning transmission electron microscopy did not show clear evidence of impurity ***,time-resolved photoluminescence results strongly suggested elemental diffusion from the flexible ***,bending tests on the stainless-steel device demonstrated the mechanical stability of the CIGS-based device.

读者评论 与其他读者分享你的观点

用户名:未登录
我的评分