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Transactions of Nonferrous metals Society of China 2015年第6期25卷 1961-1967页

作者： R.SEKAR K.K.JAGADESH G.N.K.RAMESH BAPU electroplating and metal finishing technology division CSIR-Central Electrochemical Research Institute

The electrodeposition of black Ni-Co alloy film from Watts nickel solution and the effects of benzotriaozole and imidazole as the additives were studied. The electrolyte consists of NiSO4, NiC12, H3BO3, COSO4 and KNO3. The cathode current efficiency and the throwing power of the solution and the film adhesion to the mild steel metallic foil were determined by standard methods. The crystal structure, lattice parameter, crystal orientation and crystal size were analyzed by X-ray diffraction （XRD）. Moreover, the surface morphology and elemental composition of the black Ni-Co alloy films were analyzed by scanning electron microscopy （SEM） and energy dispersive X-ray spectroscopy （EDX） techniques. The darkness of the black films increases with increasing the incorporation of Co ion into the films. The XRD studies reveal that the black Ni-Co alloy films exhibit Ni （11 l） as the preferred orientation.

关键词： additive electrodeposition black Ni-Co alloy adhesion

Autocatalytic deposition of copper from modified electrolytes and its characteristics

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Transactions of Nonferrous metals Society of China 2015年第11期25卷 3791-3801页

作者： R.SEKAR K.K.JAGADESH G.N.K.RAMESH BAPU electroplating and metal finishing technology division Council of Scientific and Industrial Research-Central Electrochemical Research Institute

The electroless deposition process of copper plating consisting of TEA and EDTA as complexing agents,paraformaldehyde as reducing agent,and 2-mercaptobenzothiozole as stabilizer and gelatin and animal glue as additives was *** stability of the electroless copper solution was monitored by measuring the absorbance of the solution with a UV-Visible spectrophotometer and the solution was quite stable up to 15 *** adhesion of copper films on mild steel foil was assessed by standard bend test and exhibited good *** XRD results indicate that the copper films have a(111) ***,the additives suppress the predominant(111) plane crystal growth and increase the rate of(220) texture crystal *** crystal size of the copper films was calculated using the Scherrer formula from the predominant *** and AFM studies reveal that these two additives modify the crystal structure,grain size and surface morphology of the copper *** cyclic voltammetry studies reveal that the additives are adsorbed on the electrode surface and inhibit the rate of *** polarization and electrochemical impedance studies reveal that the deposits produced in the presence of additives display higher corrosion resistance.

关键词： electroless copper additives potentiodynamic polarization electrochemical impedance spectroscopy

Synergistic effect of additives on electrodeposition of copper from cyanide-free electrolytes and its structural and morphological characteristics

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Transactions of Nonferrous metals Society of China 2017年第7期27卷 1665-1676页

作者： R.SEKAR electroplating and metal finishing technology division Central Electro Chemical Research InstituteKaraikudi 630006Tamil NaduIndia

Electrodeposition of acid copper plating on mild steel substrate is tedious due to the galvanic displacement reaction ofcopper on mild *** can be avoided by using a proper complexing agent,because the complexing agent tuned the potential ofnoble direction to less noble direction by complex *** this paper,environment friendly electrodeposition of copper fromnon-cyanide electrolyte using sodium gluconate as complexing agent was investigated in alkaline *** effects of additivessuch as1,2,3-benzotriazole,sodium lauryl sulphate,PEG8000and saccharin were *** additives are found to reduce thegrain size,grain boundaries and improve surface morphology of the copper *** they improve the throwing power of thedepositing electrolytes and hardness of *** electrodeposited copper coatings were characterized by X-ray *** results indicate that the electrodeposited copper shows polycrystalline and face centered cubic *** crystalsize was calculated by XRD and AFM *** these additives studied,the mixture of benzotriazole and sodium laurylsulphate acts as the best additive.A uniform pore-free surface observed under SEM and AFM results reveal the grain refining broughtabout by the additives.

关键词： synergistic effect gluconate additive atomic force microscopy electrodeposition copper

Microstructure and crystallographic characteristics of nanocrystalline copper prepared from acetate solutions by electrodeposition technique

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Transactions of Nonferrous metals Society of China 2017年第6期27卷 1423-1430页

作者： R.SEAKR electroplating and metal finishing technology division Central Electrochemical Research InstituteKaraikudi-630 006Tamil NaduIndia

Methane sulphonic acid is an alternative electrolyte for conventional sulphuric acid for copper *** of copper from eco-friendly acetate-based electrolytes consisting of copper acetate,sodium acetate and methanesulphonic acid was *** hydrochloride(THC),saccharin and4-amino-3-hydroxynaphthalene1-suphonic acid were used asadditives in depositing *** cathode current efficiency was calculated using the Faraday’s *** distrbution ratio ofthe solutions was determined using Haring?Blum *** additives impact the surface morphology of deposited copper films bydowngrading,the grain size was analyzed by scanning electron microscopy(SEM)and X-ray diffiraction *** patternacquired for electrodeposited copper film shows polycrystalline and face centered cubic structure(FCC).The crystal size of thecopper film was calculated using the Debye?Scherrer’s *** crystal size revealed that deposits produced from additivecontaining electrolytes exhibited the lowest grain *** coefficient analysis studies revealed that all copper film deposits arepolycrystalline and the crystals are preferentially oriented and parallel to the surface.A uniform and pin-hole free surfacemorphology and grain refining were brought about by the additives.

关键词： acetate copper electrodeposition additives

Effect of dietary supplementation with sugar cane extract on meat quality and oxidative stability in finishing pigs

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Animal Nutrition 2017年第3期3卷 295-299页

作者： Yangchun Xia Yansen Li Xiangxing Shen Massami Mizu Toma Furuta Chunmei Li College of Animal Science and technology Nanjing Agricultural University Product Development division Mitsui Sugar Co.Ltd.

The aim of the present study was to investigate the effect of dietary supplementation with sugar cane extract(SCE) on meat quality and oxidative stability of Longissimus dorsi muscle in finishing *** barrows(Duroc × Landrace × Jiaxing Black), with an average initial body weight of 62.1 ± 5.0 kg,were randomly allotted to 1 of 3 diets with 6 replicates per treatment for 42 days. The diets comprised a normal diet and the normal diets supplemented with 5 and 25 g/kg SCE. The results showed that SCE supplementation did not affect final body weight of finishing pigs. Dietary SCE supplementation significantly increased(P < 0.05) Longissimus dorsi muscle pH_(24 h),and tended to reduce(P < 0.1) and significantly decreased(P < 0.05) shear force, drip loss, myofiber cross sectional area and lactate dehydrogenase activity at 5 and 25 g/kg, respectively. Meanwhile, dietary SCE treatments significantly decreased(P < 0.05) malonaldehyde content and total superoxide dismutase activity in Longissimus dorsi muscle, and tended to reduce(P < 0.1) malonaldehyde content in serum. Altogether, these data indicate that SCE is an effective feed additive to improve pork meat quality, and the underlying mechanism may be partly due to the improved oxidative stability induced by dietary SCE supplementation.

关键词： Sugar cane extract Feed additive Meat quality Oxidative stability finishing pigs

Direct Synthesis of Amides via Catalytic Coupling of Alcohols and Amines in a Membrane Reactor

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Direct Synthesis of Amides via Catalytic Coupling of Alcohol...

Catalytic effect of platinum and silver in a hydrogen peroxide monopropellant ceramic microthruster

中国化学会第九届全国有机化学学术会议

作者： Tao Chen Xinyin Wang Gaofeng Zeng Zhiping Lai Kuo-Wei Huang Key Laboratory of Advanced Textile Materials & Manufacturing technology Ministry of EducationEngineering Research Center for Eco-Dyeing & Finishing of TextilesMinistry of Educationand National Base for International Science and Technology Cooperation in Textiles and Consumer-Goods ChemistryZhejiang Sci-Tech University division of Physical Science and Engineering King Abdullah University of Science and Technology

＜正＞The amide linkage is a common and very important functional group which contributes to the special properties of peptides,proteins,beta-lactam antibiotics,and numerous synthetic *** methods of preparing amides m...

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Propulsion and Power Research 2020年第3期9卷 216-224页

作者： Zahra Khaji Lena Klintberg Kristoffer Palmer Greger Thornell Angstrom Space technology Centre.Department of Engineering Sciences Uppsala University.Box 35Uppsala.75103Sweden division of Microsystems technology Department of Engineering SciencesUppsala UniversityBox 35.Uppsala.75103Sweden Nanospace AB Ulis Tag 29A.Uppsala75651Sweden

Ceramic microthrusters with an embedded Pt resistive heater,two temperature sensors,and a Pt or Ag catalytic bed were made of high-temperature co-fired alumina *** increase the surface area by a factor of 1.21,and so the catalytic effect,the Pt catalytic bed was made porous by mixing the Pt paste with 15—20vol.%graphite sacrificial paste before screen printing *** was in-situ electroplated on the porous Pt surface after *** of 50wt.%hydrogen peroxide as a monopropellant was studied both qualitatively and quantitatively by changing the catalyst(between Ag and Pt),flow rate(15—55 μl/min),and operating temperature(115—300℃).A reference device without catalyst exhibited an unstable behavior as a result of no,or vety little,decomposition,whereas the Ag catalyst was more stable,and the Pt one even more ***,Pt was found to be slightly more ***,there were small differences between Pt and Ag in the power needed to maintain the *** inventive methods to make the Pt bed porous as well as in-situ electroplating Ag were success-fully demonstrated.

关键词： Monopropellant microthruster HTCC Catalytic bed Platinum Silver Hydrogen peroxide electroplating

Significantly enhanced corrosion resistance of Ni-Cu coating modified by minor cerium

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腐蚀学报（英文） 2021年第2期2卷 72-81页

作者： Pengyuan Zhang Guozhe Meng Yanqiu Wang Bing Lei Fuhui Wang Corrosion and Protection Laboratory Key Laboratory of Superlight Materials and Surface Technology(Harbin Engineering University)Ministry of EducationHarbin 150001China Corrosion and Protection Laboratory Key Laboratory of Superlight Materials and Surface Technology(Harbin Engineering University)Ministry of EducationHarbin 150001China Corrosion and Protection Institute School of Chemical Engineering and TechnologySun Yat-sen UniversityZhuhai 519082China Corrosion and Protection Institute School of Chemical Engineering and TechnologySun Yat-sen UniversityZhuhai 519082China Corrosion and Protection Laboratory Key Laboratory of Superlight Materials and Surface Technology(Harbin Engineering University)Ministry of EducationHarbin 150001China Corrosion and Protection division Shenyang National Laboratory for Material ScienceNortheastern UniversityShenyang 110819China

Ni-Cu coatings were obtained through direct current electrodeposition in electroplating bath with ceric sulfate in varying concentration(0-1.2 g/L),*** of ceric sulfate on microstructure and corrosion resis-tance of the coatings were analyzed through high-resolution transmission electron microscopy,potentiodynamic polarization,and localized electrochemical impedance *** performance of a passive film formed on the Ni-Cu coatings was characterized by the Mott-Schottky *** demonstrated that Ce was co-deposited in the Ni-Cu coating obtained in the ceric sulfate containing electroplating *** trace addition of Ce distinctly improved corrosion resistance of the Ni-Cu coatings,which is ascribed to that the interfacial reactions between Ni-Cu coating and the passive film were suppressed by the reduction of the point defect diffusivity after the formation of a dense cerium oxide film.

关键词： Ni-Cu coating Corrosion resistance Passive film Semi-conductive property

Low-valence ion addition induced more compact passive films on nickel-copper nano-coatings

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Journal of Materials Science & technology 2019年第10期35卷 2144-2155页

作者： Quangquan Do Hongze An Guozhe Meng Weihua Li Lai-Chang Zhang Yangqiu Wang Bin Liu Junyi Wang Fuhui Wang Corrosion and Protection Laboratory Key Laboratory of Superlight Materials and Surface Technology(Harbin Engineering University)Ministry of EducationHarbin150001China Corrosion and Protection Institute School of Chemical Engineering and TechnologySun Yat-Sen UniversityZhuhai519082China Corrosion and Protection division Shenyang National Laboratory for Material ScienceNortheastern UniversityShenyang110819China School of Engineering Edith Cowan University270 Joondalup DriveJoondalupPerthWA6027Australia Shipbuilding Faculty Viet Nam Maritime UniversityHaiphongViet Nam

Ni-Cu nano-coatings were prepared by pulsed electroplating technique in the baths containing various amount of boric acid. Their microstructure, morphologies and corrosion resistance were characterized in detail. The addition of boric acid strongly influences on the microstructure of the Ni-Cu *** coating with a grain size of 130 nm, obtained from the bath containing 35 g L^-1 boric acid, shows the highest corrosion resistance. This is attributed to the low-valence Cu ion(Cu^+) additions in nickel oxide, which could significantly decrease the oxygen ion vacancy density in the passive film to form a more compact passive film. The higher Cu^+ additions and the lower diffusivity of point defects(D0) are responsible for the formation of more compact passive film on the coating obtained from the bath with 35 g L^-1 boric acid.

关键词： Passive film Point defect Corrosion electroplating Coating

Electrodeposition of Semiconductor Wafer Bumps

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Electrodeposition of Semiconductor Wafer Bumps