Synergistic effect of additives on electrodeposition of copper from cyanide-free electrolytes and its structural and morphological characteristics

作     者：R.SEKAR R. SEKAR

作者机构：Electroplating and Metal Finishing Technology DivisionCentral Electro Chemical Research InstituteKaraikudi 630006Tamil NaduIndia 

出 版 物：《Transactions of Nonferrous Metals Society of China》 (中国有色金属学报（英文版）)

年 卷 期：2017年第27卷第7期

页      面：1665-1676页

核心收录：

学科分类：081702[工学-化学工艺] 08[工学] 0817[工学-化学工程与技术] 

主　　题：synergistic effect gluconate additive atomic force microscopy electrodeposition copper 

摘      要：Electrodeposition of acid copper plating on mild steel substrate is tedious due to the galvanic displacement reaction ofcopper on mild *** can be avoided by using a proper complexing agent,because the complexing agent tuned the potential ofnoble direction to less noble direction by complex *** this paper,environment friendly electrodeposition of copper fromnon-cyanide electrolyte using sodium gluconate as complexing agent was investigated in alkaline *** effects of additivessuch as1,2,3-benzotriazole,sodium lauryl sulphate,PEG8000and saccharin were *** additives are found to reduce thegrain size,grain boundaries and improve surface morphology of the copper *** they improve the throwing power of thedepositing electrolytes and hardness of *** electrodeposited copper coatings were characterized by X-ray *** results indicate that the electrodeposited copper shows polycrystalline and face centered cubic *** crystalsize was calculated by XRD and AFM *** these additives studied,the mixture of benzotriazole and sodium laurylsulphate acts as the best additive.A uniform pore-free surface observed under SEM and AFM results reveal the grain refining broughtabout by the additives.