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Friction 2017年第1期5卷 99-107页

作者： Aibin ZHU Dayong HE Shengli HE Wencheng LUO Key Laboratory of Education Ministry for Modern Design and Rotor-Bearing System Xi'an Jiaotong University Xi'an 710049 China

In this paper,the material removal mechanism of copper chemical mechanical polishing was studied by the quasicontinuum method that integrated molecular dynamics and the finite element *** analyzing the abrasive process of different particle sizes on single crystal copper,we investigated the internal material deformation,the formation of chips,the stress distribution,and the change of cutting *** showed that shear band deformation was generated along the cutting direction at approximately 45° inside the workpiece *** deformation was accompanied by dislocations and sliding phenomena in the shear band *** abrasive particle size led to poor quality of the workpiece,while a larger particle size led to better ***,larger particle size resulted in greater plastic deformation and deeper residual stress inside the *** change of abrasive particles had little effect on the tangential cutting force.

关键词： chemical mechanical polishing material removal mechanism particle size quasi-continuum single crystal copper

Study of the material removal mechanism of glass-ceramics based on consecutive incremental loading in ductile-regime grinding

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Nanotechnology and Precision Engineering 2020年第2期3卷 88-95页

作者： Xue Li State Key Laboratory of Precision Measuring Technology&Instruments Tianjin UniversityTianjin 300072China

Glass-ceramics have many excellent properties and are widely used in various fields. During the grinding process,the workpiece surface is typically subject to material removal by grit of incremental heights, which has rarely been the focus of research. As such, it is necessary to study the material removal mechanism of glass-ceramics under consecutive incremental loading, which more closely reflects the actual grinding process. In this paper,to analyze the plastic deformation and residual stress of lithium aluminosilicate(LAS) glass-ceramics, a finite element model is established based on the Drucker–Prager yield criterion for ductile regimes. A nano-scratch test was also conducted and the test results show that both the residual depth and residual stress increase with an increase in the number of increments, and that consecutive incremental loading promotes the plastic deformation of glass-ceramics and increases the residual stress of the material in the ductile-regime process. These findings provide guidance for achieving higher dimensional accuracy in the actual grinding of glass-ceramics parts.

关键词： Grinding Glass-ceramics Scratch tests material removal mechanism Consecutive incremental loading

Modeling and analysis for material removal and surface roughness in fluid jet polishing of optical glass

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Friction 2024年第7期12卷 1548-1563页

作者： Zhongchen CAO Ming WANG Haitao LIU Tian HUANG Key Laboratory of mechanism Theory and Equipment Design of Ministry of Education Tianjin UniversityTianjin 300072China School of Engineering The University of WarwickCoventry CV47ALUK

luid jet polishing(FJP)is a non-contact polishing technology that can fabricate free-form optical surfaces with sub-micron-level form accuracy and nano-level surface roughness,especially for hard and brittle *** surface generation model of FJP can be used to guide the determination and optimization of process parameters and is of great significance for understanding the evolution mechanism of surface ***,predictive models for the microscopic topography of polished surfaces are still *** study established a macroscopic surface profile model for predicting 3D material removal characteristics and surface texture by combining the 3D computer fluid dynamics(CFD)simulation model and single-particle erosion mechanism.A fractal theory-based erosion model has been built to calculate the material removal caused by the erosion of a single abrasive particle on the rough surface;thus,it predicts the micro-topography and surface roughness of the polished samples.A series of polishing experiments were conducted to analyze the feasibility and accuracy of the model quantitatively and study the influence mechanism of process parameters on the material removal characteristics and surface *** indicated that the models could well predict material removal and surface *** prediction accuracy of the surface roughness Ra and maximum removal depth is better than 91.6%and 90%,*** is also found that the material removal rate of FJP could reach 0.517 mm3/min,and the surface roughness convergence rate could reach 62.9%.

关键词： fluid jet polishing(FJP) computational fluid dynamics(CFD) material removal mechanism surface roughness theoretical model

material removal rate in chemical-mechanical polishing of wafers based on particle trajectories

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Journal of Semiconductors 2010年第5期31卷 145-150页

作者：苏建修陈锡渠杜家熙康仁科 Henan Institute of Science and Technology Key Laboratory for Precision and Non-Traditional Machining of Ministry of Education Dalian University of Technology

Distribution forms of abrasives in the chemical mechanical polishing（CMP） process are analyzed based on experimental *** the relationships between the wafer,the abrasive and the polishing pad are analyzed based on kinematics and contact *** to the track length of abrasives on the wafer surface,the relationships between the material removal rate and the polishing velocity are *** analysis results are in accord with the experimental *** conclusion provides a theoretical guide for further understanding the material removal mechanism of wafers in CMP.

关键词： chemical mechanical polishing material removal mechanism abrasive material removal rate

material removal model of magnetorheological finishing based on dense granular flow theory

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Light(Advanced Manufacturing) 2022年第4期3卷 4-13页

作者： Yang Bai Xuejun Zhang Chao Yang Longxiang Li Xiao Luo Key Laboratory of Optical System Advanced Manufacturing Technology Changchun Institute of OpticsFine Mechanics and PhysicsChinese Academy of SciencesChangchun 130033China Changchun University of Science and Technology ChangchunJi Lin130022China

Magnetorheological finishing(MRF)technology is widely used in the fabrication of high-precision optical *** material removal mechanism of MRF has not been fully understood because MRF technology involves the integration of electromagnetics,contact mechanics,and materials *** this study,the rheological properties of the MR polishing fluid in oscillation model have been *** propose that the shear-thinned MR polishing fluid over the polishing area should be considered a dense granular flow,based on which a new contact model of MRF over the polishing area has been *** function and processing force test experiments were conducted under different working *** normal pressure and effective friction equations over the polishing area were built based on the continuous medium and dense granular flow ***,a novel MRF material removal model was established.A comparison of the results of the theoretical model with actual polishing results demonstrated the accuracy of the established *** novel model proposed herein reveals the generation mechanism of shear force over a polished workpiece and realizes effective decoupling of the main processing parameters that influence the material removal of *** results of this study will provide new and effective theoretical guidance for the process optimization and technology improvement of MRF.

关键词： Magnetorheological finishing material removal mechanism Dense granular flow removal function Optical fabrication

Molecular dynamics simulation of the material removal in the scratching of 4H-SiC and 6H-SiC substrates

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International Journal of Extreme Manufacturing 2020年第4期2卷 86-100页

作者： Zige Tian Xun Chen Xipeng Xu Institute of Manufacturing Engineering Huaqiao UniversityXiamenFujian ProvincePeople’s Republic of China Faculty of Engineering and Technology Liverpool John Moores UniversityLiverpoolUnited Kingdom

Single crystal silicon carbide(SiC)is widely used for optoelectronics *** to the anisotropic characteristics of single crystal materials,the C face and Si face of single crystal SiC have different physical properties,which may fit for particular application *** paper presents an investigation of the material removal and associated subsurface defects in a set of scratching tests on the C face and Si face of 4H-SiC and 6H-SiC materials using molecular dynamics *** investigation reveals that the sample material deformation consists of plastic,amorphous transformations and dislocation slips that may be prone to brittle *** results showed that the material removal at the C face is more effective with less amorphous deformation than that at the Si *** a phenomenon in scratching relates to the dislocations on the basal plane(0001)of the SiC *** defects were reduced by applying scratching cut depths equal to integer multiples of a half molecular lattice thickness,which formed a foundation for selecting machining control parameters for the best surface quality.

关键词： material removal mechanism molecular dynamics simulation subsurface defects scratching 4H-SiC and 6H-SiC

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Fiber orientation effects on grinding characteristics and removal mechanism of 2.5D C_(f)/SiC composites

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Chinese Journal of Aeronautics 2023年第12期36卷 425-441页

作者： Cheng CAO Qinghua SONG Hui FU Hansong JI Zhanqiang LIU Liping JIANG Key Laboratory of High Efficiency and Clean Mechanical Manufacture Ministry of EducationSchool of Mechanical EngineeringShandong UniversityJinan 250061China National Demonstration Center for Experimental Mechanical Engineering Education Shandong UniversityJinan 250061China Shandong Industrial Ceramic Research&Design Institute Zibo 255020China

Carbon fiber reinforced silicon carbide(C_(f)/SiC)composites are widely used in aerospace for their excellent mechanical ***,the quality of the machined surface is poor and unpredictable due to the material heterogeneity induced by complex removal *** clarify the effects of fiber orientation on the grinding characteristics and removal mechanism,single grit scratch experiments under different fiber orientations are conducted and a three-phase numerical modelling method for 2.5D C_(f)/SiC composites is *** fiber cutting modes i.e.,transverse,normal and longitudinal,are defined by fiber orientation and three machining directions i.e.,MA(longitudinal and normal),MB(longitudinal and transverse)and MC(normal and transverse),are selected to investigate the effect of fiber orientation on grinding force and ***,a three-phase cutting model of 2.5D C_(f)/SiC composites considering the mechanical properties of the matrix,fiber and interface is *** simulations are performed to reveal the micro-mechanism of crack initiation and extension as well as the material removal mechanism under different fiber *** results indicate that the scratching forces fluctuate periodically,and the order of mean forces is MA>MC>*** tend to grow along the fiber axis,which results in the largest damage layer for transverse fibers and the smallest for longitudinal *** removal modes of transverse fibers are worn,fracture and peel-off,in which normal fibers are pullout and outcrop and the longitudinal fibers are worn and *** the stable cutting condition,the change of contact area between fiber and grit leads to different removal modes of fiber in the same cutting mode,and the increase of contact area results in the aggravation of fiber fracture.

关键词： 2.5D C_(f)/SiC composites material removal mechanism Numerical modelling Single grit scratch experiments Surface morphology

Collaborative manufacturing technologies of structure shape and surface integrity for complex thin-walled components of aero-engine:Status,challenge and tendency

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Chinese Journal of Aeronautics 2023年第7期36卷 1-24页

作者： Biao ZHAO Wenfeng DING Zhongde SHAN Jun WANG Changfeng YAO Zhengcai ZHAO Jia LIU Shihong XIAO Yue DING Xiaowei TANG Xingchao WANG Yufeng WANG Xin WANG College of Mechanical and Electrical Engineering Nanjing University of Aeronautics and AstronauticsNanjing 210016China School of Mechanical Engineering Northwestern Polytechnical UniversityXi’an 710072China AVIC Manufacturing Technology Institute Beijing 100024China School of Mechanical Science and Engineering Huazhong University of Science and TechnologyWuhan 430074China AECC Shenyang Liming Aero-engine Co. LTD.Shenyang 110000China

Presently,the service performance of new-generation high-tech equipment is directly affected by the manufacturing quality of complex thin-walled components.A high-efficiency and quality manufacturing of these complex thin-walled components creates a bottleneck that needs to be solved urgently in machinery *** address this problem,the collaborative manufacturing of structure shape and surface integrity has emerged as a new process that can shorten processing cycles,improve machining qualities,and reduce *** paper summarises the research status on the material removal mechanism,precision control of structure shape,machined surface integrity control and intelligent process control technology of complex thin-walled *** solutions and technical approaches are then put forward to solve the critical problems in the high-performance manufacturing of complex thin-wall *** development status,challenge and tendency of collaborative manufacturing technologies in the high-efficiency and quality manufacturing of complex thin-wall components is also discussed.

关键词： Collaborative manufacturing of shape and performance Complex thin-walled component Intelligent process control material removal mechanism Surface integrity

Precision Grinding of Reaction Bonded Silicon Carbide Using Coarse Grain Size Diamond Wheels

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Chinese Journal of Mechanical Engineering 2010年第3期23卷 269-275页

作者： ZHAO Qingliang CHEN Junyun BRINKSMEIER E Centre for Precision Engineering Harbin Institute of Technology Harbin 150001 China Laboratory for Precision Machining University of Bremen Bremen D-28359 Germany

Reaction bonded SiC（RBSiC） is attractive for optical application because of its favorable properties and low fabrication cost. However, the difficultness and cost involved in RBSiC grinding limit its application. The investigation on high efficient and low-cost machining with good grinding quality is desired. Generally, high efficient machining for RBSiC is realized by using coarse grain size grinding wheels, but serious grinding damage is inevitable. In this paper, monolayer nickel electroplated coarse grain size diamond grinding wheels with grain sizes of 46 μm, 91 μm, and 151 μm were applied to the grinding of RBSiC. An electrolytic in-process dressing（ELID） assisted conditioning technique was first developed by using cup shape copper bonded conditioning wheels with grain sizes of 15 μm and 91 μm to generate the conditioned coarse grain size wheels with minimized wheel run-out error within 2 μm, constant wheel peripheral envelop as well as top-flattened diamond grains. Then, the grinding experiments on RBSiC were carried out to investigate the grinding performance and material removal mechanism. The experimental results indicate that the developed conditioning technique is applicable and feasible to condition the coarse grain size diamond wheels under optimal conditioning parameters, and the material removal mechanism involved in RBSiC grinding is the combination of brittle fracture and ductile deformation to generate smooth ground surface. This research is significant for the high efficient and low-cost precision grinding of RBSiC with good ground surface quality.

关键词： precision grinding SiC coarse grain size diamond wheel ELID assisted conditioning material removal mechanism

Energy beam-based direct and assisted polishing techniques for diamond:A review

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International Journal of Extreme Manufacturing 2024年第1期6卷 93-124页

作者： Zhuo Li Feng Jiang Zhengyi Jiang Zige Tian Tian Qiu Tao Zhang Qiuling Wen Xizhao Lu Jing Lu Hui Huang Institute of Manufacturing Engineering Huaqiao UniversityXiamen 361021People’s Republic of China School of Mechanical MaterialsMechatronic and Biomedical EngineeringUniversity of WollongongWollongongNSW 2522Australia College of Mechanical Engineering and Automation Huaqiao UniversityXiamen 361021People’s Republic of China State Key Laboratory of High Performance Tools Huaqiao UniversityXiamen 361021People’s Republic of China

Diamond is a highly valuable material with diverse industrial applications,particularly in the fields of semiconductor,optics,and high-power ***,its high hardness and chemical stability make it difficult to realize high-efficiency and ultra-low damage machining of *** address these challenges,several polishing methods have been developed for both single crystal diamond(SCD)and polycrystalline diamond(PCD),including mechanical,chemical,laser,and ion beam processing *** this review,the characteristics and application scope of various polishing technologies for SCD and PCD are ***,various energy beam-based direct and assisted polishing technologies,such as laser polishing,ion beam polishing,plasma-assisted polishing,and laser-assisted polishing,are *** current research progress,material removal mechanism,and infuencing factors of each polishing technology are *** some of these methods can achieve high material removal rates or reduce surface roughness,no single method can meet all the ***,the future development prospects and application directions of different polishing technologies are presented.

关键词： single crystal diamond polycrystalline diamond energy beam polishing technology material removal mechanism influencing factors