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Numerical Investigation on Thermal Performance of Two-Phase immersion cooling Method for High-Power Electronics

Frontiers in Heat and Mass Transfer 2024年第1期22卷 157-173页

作者： Liqun Zhou Weilin Yang Chaojie Li Shi Lin College of Petrochemical Engineering Lanzhou University of TechnologyLanzhou730050China College of Environment and Safety Engineering Qingdao University of Science and TechnologyQingdao266042China College of Artificial Intelligence Yango UniversityFuzhou350015China

The power density of electronic components grows continuously,and the subsequent heat accumulation and temperature increase inevitably affect electronic equipment’s stability,reliability and service ***,achieving efficient cooling in limited space has become a key problem in updating electronic devices with high performance and high ***-phase immersion is a novel cooling *** computational fluid dynamics(CFD)method is used to investigate the cooling performance of two-phase immersion cooling on high-power *** two-dimensional CFD model is utilized by the volume of fluid(VOF)method and Reynolds ***’s model was employed to calculate the phase change *** heat transfer coefficient along the heatedwalls and the shear-lift force on bubbles are *** simulation data are verified with the literature *** cooling performance of different coolants has been *** results indicate that the boiling heat transfer coefficient can be enhanced by using a low boiling point *** methanol is used as the cooling medium for further *** addition,the mass flow rate and inlet temperature are investigated to assess the thermal performance of twophase immersion *** average temperature of the high-power electronics is 80℃,and the temperature difference can be constrained to 8℃.Meanwhile,the convective heat transfer coefficient reaches 2740 W/(m2・℃)when the inlet temperature is 50℃,and the mass flow rate is 0.3 kg/*** conclusion,the results demonstrated that two-phase immersion cooling has provided an effective method for the thermal management of high-power electronics.

关键词： immersion cooling operating condition high-power electronics thermal management

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The Use of Single-Phase immersion cooling by Using Two Types of Dielectric Fluid for Data Center Energy Savings

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Energy Engineering 2022年第1期119卷 275-286页

作者： Nugroho Agung Pambudi Awibi Muhamad Yusuf Alfan Sarifudin Energy and Society Laboratory Mechanical Engineering EducationUniversitas Sebelas MaretSurakarta57126Indonesia

Data centers are recognized as one of the most important aspects of the fourth industrial revolution since conventional data centers are inefficient and have dependency on high energy consumption,in which the cooling is responsible for 40%of the ***,this research proposes the immersion cooling method to solving the high energy consumption of data centers by cooling its component using two types of dielectric *** stages of experimentalmethods are used,such as fluid types,cooling effectiveness,optimization,and ***,benchmark software is used to measure the CPU maximum work with the temperature data performed for 24 *** results of this study show that the immersion cooling reduces 13℃ lower temperature than the conventional cooling method which means it saves more energy consumption in the data *** most optimum variable used to decrease the temperature is 1.5 lpm of flow rate and 800 rpm of fan ***,the cooling performance of the dielectric fluids shows that the mineral oil(MO)is better than the virgin coconut oil(VCO).In durability experiment,there are no components damage after five months immersed in the fluid.

关键词： Single-phase immersion cooling data center dielectric fluid mineral oil virgin coconut oil

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面向异构集成应用的“片上”嵌入式冷却技术的研究进展

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Engineering 2023年第7期26卷 185-197,I0007,I0008页

作者： Srikanth Rangarajan Scott N.Schiffres Bahgat Sammakia Watson School of Engineering Binghamton UniversityBinghamtonNY 13902USA Office of the V.P.for Research Binghamton UniversityBinghamtonNY 13902USA

The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated *** integration(HI)can be at the chip level(a single chip with multiple hotspots),in multi-chip modules,or in vertically stacked three-dimensional(3D)integrated *** values have increased exponentially with a simultaneous reduction in chip size and a significant increase in performance,leading to increased heat *** electronics industry and the academic research community have examined various solutions to tackle skyrocketing thermal-management *** cooling eliminates most sequential conduction resistance from the chip to the ambient,unlike separable cold plates/heat *** embedding the cooling solution onto an electronic chip results in a high heat transfer potential,technological risks and complexity are still associated with the implementation of these technologies and with uncertainty regarding which technologies will be *** manuscript discusses recent advances in embedded cooling,fluid selection considerations,and conventional,immersion,and additive manufacturing-based embedded cooling technologies.

关键词： Electronic cooling Embedded cooling immersion cooling

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