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Deposition and characterization for high-quality ti-ni-cu thin films with higher cu content

Rare Metals 2021年第8期40卷 2127-2133页

作者： Jun Li Xiao-Yang Yi Yu Zheng Jing Wang Hai-Zhen Wang Xiang-Long Meng Zhi-Yong Gao Yue-Hui Ma College of Mechanical and Electrical Engineering Northeast Forestry University150001HarbinChina School of Materials Science and Engineering Harbin Institute of Technology150001HarbinChina Lanzhou Seemine SMA Co.Ltd 730010LanzhouChina

In order to attain high-quality ti-ni-cu film,the surface morphologies,chemical compositions and mechanical properties of ti-ni-cu thin films prepared by direct current(DC)magnetron sputtering at various processes were characterized by scanning electron microscopy(SEM),X-ray diffractometer(XRD)and tensile *** type of substrates,Ar pressure and sputtering power had significant effects on the quality and chemical composition of ti-ni-cu thin *** with Si and SiO_(2) slides,it was easier to obtain freestanding films by adopting glass or piezoid slide as *** ti-ni-cu thin film deposited at lower pressure(0.10 Pa)had a better *** surface was featured with porous structure in the ti-ni-cu thin film prepared by higher Ar pressure of 0.36 *** addition,both the tensile strength and strain of annealed ti-ni-cu thin film continuously increased with Ar pressure *** density contributed to the superior mechanical *** deposition rate firstly increased and then decreased with Ar pressure and sputtering power *** composition of deposited ti-ni-cu film can be tailored by changing sputter *** deposited ti-ni-cu thin films at different processing parameters were in amorphous *** short,the present study offered the important theoretical basis for the preparation of ti-ni-cu thin film with higher quality and performance.

关键词： ti-ni-cu thin film DC magnetron sputtering Sputtering parameters Chemical composition Surface morphology

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