Deposition and characterization for high-quality Ti-Ni-Cu thin films with higher Cu content

作     者：Jun Li Xiao-Yang Yi Yu Zheng Jing Wang Hai-Zhen Wang Xiang-Long Meng Zhi-Yong Gao Yue-Hui Ma Jun Li;Xiao-Yang Yi;Yu Zheng;Jing Wang;Hai-Zhen Wang;Xiang-Long Meng;Zhi-Yong Gao;Yue-Hui Ma

作者机构：College of Mechanical and Electrical EngineeringNortheast Forestry University150001HarbinChina School of Materials Science and EngineeringHarbin Institute of Technology150001HarbinChina Lanzhou Seemine SMA Co.Ltd730010LanzhouChina 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2021年第40卷第8期

页      面：2127-2133页

核心收录：

学科分类：08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：financially supported by the National Natural Science Foundation of China(Nos.51801023,51871080 and 51571073) the Industrial Transformation&Upgrading of Strong Base Project of China(No.TC150B5C0/03) 

主　　题：Ti-Ni-Cu thin film DC magnetron sputtering Sputtering parameters Chemical composition Surface morphology 

摘      要：In order to attain high-quality Ti-Ni-Cu film,the surface morphologies,chemical compositions and mechanical properties of Ti-Ni-Cu thin films prepared by direct current(DC)magnetron sputtering at various processes were characterized by scanning electron microscopy(SEM),X-ray diffractometer(XRD)and tensile *** type of substrates,Ar pressure and sputtering power had significant effects on the quality and chemical composition of Ti-Ni-Cu thin *** with Si and SiO_(2) slides,it was easier to obtain freestanding films by adopting glass or piezoid slide as *** Ti-Ni-Cu thin film deposited at lower pressure(0.10 Pa)had a better *** surface was featured with porous structure in the Ti-Ni-Cu thin film prepared by higher Ar pressure of 0.36 *** addition,both the tensile strength and strain of annealed Ti-Ni-Cu thin film continuously increased with Ar pressure *** density contributed to the superior mechanical *** deposition rate firstly increased and then decreased with Ar pressure and sputtering power *** composition of deposited Ti-Ni-Cu film can be tailored by changing sputter *** deposited Ti-Ni-Cu thin films at different processing parameters were in amorphous *** short,the present study offered the important theoretical basis for the preparation of Ti-Ni-Cu thin film with higher quality and performance.