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检索条件"主题词=Through silicon via and wire-bonding"
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The development and application of the test system for the silicon pixel modules in HEPS-BPIX
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Radiation Detection Technology and Methods 2021年 第1期5卷 53-60页
作者: Ye Ding Jie Zhang Wei Wei Zhen-jie Li Hang-xu Li Xiao-lu Ji Yan Zhang Xiao-shan Jiang Ke-jun Zhu Peng Liu Yuan-bo Chen Qiu-ju Li Wei-fan Sheng State Key Laboratory of Particle Detection and Electronics Institute of High Energy PhysicsChinese Academy of Sciences(CAS)Beijing 100049China Institute of High Energy Physics Chinese Academy of Sciences19 B Yuquan RdShijingshan DistrictBeijingChina University of Chinese Academy of Sciences(UCAS) Beijing 100049China
Background HEPS-BPIX is a prototype of photon counting pixel detector developed for the High Energy Photon *** consists of 16 silicon pixel modules which should be tested individually to ensure the function and *** Du... 详细信息
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