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Chinese Journal of Polymer Science 2024年第3期42卷 352-363,I0008页

作者： Yuan Ji Shi-Da Han Hong Wu Shao-Yun Guo Feng-Shun Zhang Jian-Hui Qiu The State Key Laboratory of Polymer materials Engineering Sichuan Provincial Engineering Laboratory of Plastic/Rubber Complex Processing TechnologyPolymer Research InstituteSichuan UniversityChengdu 610065China Institute of Chemical materials China Academy of Engineering PhysicsMianyang 621900China Department of Mechanical Engineering Faculty of Systems Science and TechnologyAkita Prefectural UniversityAkita 015-0055Japan

Silicone rubber(SR) composites are most widely used as thermal interface materials(TIMs) for electronics heat dissipation. thermal impedance as the main bottleneck limiting the performance of TIMs is usually neglected. Herein, the thermal impedance of SR composites loaded with different levels of hexagonal boron nitride(h-BN) as TIMs was elaborated for the first time by the ASTM D 5470 standard test and finite element analysis. It was found that elastic modulus and surface roughness of SR composites increased with the increase of h-BN content, indicating that the conformity was reduced. When the assembly pressure was 0.69 MPa, there existed an optimal h-BN content at which the contact resistance was minimum(0.39 K·cm^(2)·W^(-1)). Although the decreased bond line thickness(BLT) by increasing the assembly pressure was beneficial to reduce the thermal impedance, the proper assembly pressure should be selected to prevent the warpage of the contact surfaces and the increase in contact resistance, according to the compression properties of the SR composites. This study provides valuable insights into fabrication of high-performance TIMs for modern electronic device applications.

关键词： thermal interface materials Hexagonal boron nitride thermal impedance Surfaces

Ultralow Interfacial thermal Resistance of Graphene thermal interface materials with Surface Metal Liquefaction

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Nano-Micro Letters 2023年第1期15卷 183-196页

作者： Wen Dai Xing-Jie Ren Qingwei Yan Shengding Wang Mingyang Yang Le Lv Junfeng Ying Lu Chen Peidi Tao Liwen Sun Chen Xue Jinhong Yu Chengyi Song Kazuhito Nishimura Nan Jiang Cheng-Te Lin Key Laboratory of Marine materials and Related Technologies Zhejiang Key Laboratory of Marine Materials and Protective TechnologiesNingbo Institute of Materials Technology and Engineering(NIMTE)Chinese Academy of SciencesNingbo 315201People’s Republic of China Center of materials Science and Optoelectronics Engineering University of Chinese Academy of SciencesBeijing 100049People’s Republic of China Institute of Advanced Technology Shandong UniversityJinan 250100People’s Republic of China Ningbo Institute of materials Technology and Engineering(NIMTE) Chinese Academy of SciencesNingbo 315201People’s Republic of China The State Key Laboratory of Metal Matrix Composites School of Materials Science and EngineeringShanghai Jiao Tong University800 Dong Chuan RoadShanghai 200240People’s Republic of China Advanced Nano-Processing Engineering Lab Mechanical Systems EngineeringKogakuin UniversityTokyo 192-0015Japan

Developing advanced thermal interface materials(TIMs)to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of high-power semiconductor devices.Based on the ultra-high basal-plane thermal conductivity,graphene is an ideal candidate for preparing high-performance TIMs,preferably to form a vertically aligned structure so that the basal-plane of graphene is consistent with the heat transfer direction of TIM.However,the actual interfacial heat transfer efficiency of currently reported vertically aligned graphene TIMs is far from satisfactory.In addition to the fact that the thermal conductivity of the vertically aligned TIMs can be further improved,another critical factor is the limited actual contact area leading to relatively high contact thermal resistance(20-30 K mm^(2) W^(−1))of the“solid-solid”mating interface formed by the vertical graphene and the rough chip/heat sink.To solve this common problem faced by vertically aligned graphene,in this work,we combined mechanical orientation and surface modification strategy to construct a three-tiered TIM composed of mainly vertically aligned graphene in the middle and micrometer-thick liquid metal as a cap layer on upper and lower surfaces.Based on rational graphene orientation regulation in the middle tier,the resultant graphene-based TIM exhibited an ultra-high thermal conductivity of 176 W m^(−1) K^(−1).Additionally,we demonstrated that the liquid metal cap layer in contact with the chip/heat sink forms a“liquid-solid”mating interface,significantly increasing the effective heat transfer area and giving a low contact thermal con-ductivity of 4-6 K mm^(2) W^(−1) under packaging conditions.This finding provides valuable guidance for the design of high-performance TIMs based on two-dimensional materials and improves the possibility of their practical application in electronic thermal management.

关键词： Vertically aligned graphene Liquid metal Surface modification thermal interface materials

thermal Performance of Low-Melting-Temperature Alloy thermal interface materials

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Acta Metallurgica Sinica(English Letters) 2014年第2期27卷 290-294页

作者： E.Yang Hongyan Guo Jingdong Guo Jianku Shang Mingguang Wang Shenyang National Laboratory for materials Science Institute of Metal ResearchChinese Academy of Sciences College of Sciences Northeastern University Department of materials Science and Engineering University of Illinois at Urbana-Champaign

thermal resistance of low-melting-temperature alloy （LMTA） thermal interface materials （TIMs） was measured by laser flash method before and after different stages of heating. The results showed that the thermal performance of the LMTA TIMs was degraded during the heating process. It is suggested that the degradation may mainly be attributed to the interfacial reaction between the Cu and the molten LMTAs. Due to the fast growth rate of intermetallic compound （IMC） at the solid-liquid interface, a thick brittle IMC is layer formed at the interface, which makes cracks easy to initiate and expand. Otherwise, the losses of indium and tin contents in the LMTA during the interfacial reaction will make the melting point of the TIM layer increase, and so, the TIM layer will not melt at the operating temperature.

关键词： thermal interface materials Low melting point alloy thermal resistance

High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip

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Chip 2022年第2期1卷 27-34页

作者： Sheng-Chang Ding Jian-Feng Fan Dong-Yi He Lin-Feng Cai Xiang-Liang Zeng Lin-Lin Ren Guo-Ping Du Xiao-Liang Zeng Rong Sun Shenzhen Institute of Advanced Electronic materials Shenzhen Institute of Ad-vanced TechnologyChinese Academy of SciencesShenzhen518055China School of Physics and materials Science Nanchang UniversityNanchang 330031China

The emerging applications of composite gels as thermal interface ma-terials(TIMs)for chip heat dissipation in intelligent vehicle and wear-able devices require high thermal conductivity and remarkable damp-ing properties.However,thermal conductivity and damping proper-ties are usually correlated and coupled each other.Here,inspired by Maxwell theory and adhesion mechanism of gecko’s setae,we present a strategy to fabricate polydimethylsiloxane-based composite gels in-tegrating high thermal conductivity and remarkable damping prop-erties over a broad frequency and temperature range.The multiple relaxation modes of dangling chains and the dynamic interaction be-tween the dangling chains and aluminum fillers can efficiently dis-sipate the vibration energy,endowing the composite gels with ultra-high damping property(tanδ>0.3)over a broad frequency(0.01-100 Hz)and temperature range(-50-150°C),which exceeds typi-cal state-of-the-art damping materials.The dangling chains also com-fort to the interfaces between polymer matrix and aluminum via van der Waals interaction,resulting in high thermal conductivity(4.72±0.04 W m-1 K-1).Using the polydimethylsiloxane-based composite gel as TIMs,we demonstrate effective heat dissipation in chip oper-ating under vigorous vibrations.We believe that our strategy could be applied to a wide range of composite gels and lead to the devel-opment of high-performance composite gels as TIMs for chip heat dissipation.

关键词： thermal interface materials Composite gels Damping Ther-mal conductivity Dangling chains

Emerging low-density polyethylene/paraffin wax/aluminum composite as a form-stable phase change thermal interface material

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International Journal of Minerals,Metallurgy and materials 2023年第4期30卷 772-781页

作者： Chuanchang Li Weixuan Wang Xiaoliang Zeng Chunxuan Liu Rong Sun School of Energy and Power Engineering Changsha University of Science and TechnologyChangsha 410114China Shenzhen Institute of Advanced Electronic materials Shenzhen Institute of Advanced TechnologyChinese Academy of SciencesShenzhen 518055China Hunan Xiangtou Light Material Technology Co. Ltd.Changsha 410012China

thermal interface materials(TIMs) play a vital role in the thermal management of electronic devices and can significantly reduce thermal contact resistance(TCR). The TCR between the solid–liquid contact surface is much smaller than that of the solid–solid contact surface, but conventional solid–liquid phase change materials are likely to cause serious leakage. Therefore, this work has prepared a new formstable phase change thermal interface material. Through the melt blending of paraffin wax(PW) and low-density polyethylene(LDPE), the stability is improved and it has an excellent coating effect on PW. The addition of aluminum(Al) powder improves the low thermal conductivity of PW/LDPE, and the addition of 15wt% Al powder improves the thermal conductivity of the internal structure of the matrix by 67%. In addition, the influence of the addition of Al powder on the internal structure, thermal properties, and phase change behavior of the PW/LDPE matrix was systematically studied. The results confirmed that the addition of Al powder improved the thermal conductivity of the material without a significant impact on other properties, and the thermal conductivity increased with the increase of Al addition. Therefore, morphologically stable PW/LDPE/Al is an important development direction for TIMs.

关键词： paraffin wax low-density polyethylene phase change materials thermal interface materials form stability

Efficient Preconstruction of Three‑Dimensional Graphene Networks for thermally Conductive Polymer Composites

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Nano-Micro Letters 2022年第8期14卷 72-111页

作者： Hao‑Yu Zhao Ming‑Yuan Yu Ji Liu Xiaofeng Li Peng Min Zhong‑Zhen Yu Beijing Key Laboratory of Advanced Functional Polymer Composites Beijing University of Chemical TechnologyBeijing 100029People’s Republic of China College of materials Science and Engineering Beijing University of Chemical TechnologyBeijing 100029People’s Republic of China School of Chemistry CRANN and AMBERTrinity College DublinDublinIreland

Electronic devices generate heat during operation and require efficient thermal management to extend the lifetime and prevent performance degradation.Featured by its exceptional thermal conductivity,graphene is an ideal functional filler for fabricating thermally conductive polymer composites to provide efficient thermal management.Extensive studies have been focusing on constructing graphene networks in polymer composites to achieve high thermal conductivities.Compared with conventional composite fabrications by directly mixing graphene with polymers,preconstruction of three-dimensional graphene networks followed by backfilling polymers represents a promising way to produce composites with higher performances,enabling high manufacturing flexibility and controllability.In this review,we first summarize the factors that affect thermal conductivity of graphene composites and strategies for fabricating highly thermally conductive graphene/polymer composites.Subsequently,we give the reasoning behind using preconstructed three-dimensional graphene networks for fabricating thermally conductive polymer composites and highlight their potential applications.Finally,our insight into the existing bottlenecks and opportunities is provided for developing preconstructed porous architectures of graphene and their thermally conductive composites.

关键词： Graphene networks thermal conductivity thermal interface materials Phase change composites Anisotropic aerogels

Enhancing through-plane thermal conductivity of fluoropolymer composite by developing in situ nano-urethane linkage at graphene–graphene interface

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Nano Research 2020年第10期13卷 2741-2748页

作者： Muhammad Maqbool Haichang Guo Akbar Bashir Ali Usman Adeel YAbid Guansong He Yanjuan Ren Zeeshan Ali Shulin Bai Department of materials Science and Engineering Key Laboratory of High Eenergy Density Physics Simulation(HEDPS)Center of Applied Physics and Technology(CAPT)/Laboratory of Turbulence and Complex System(LTCS)Key Laboratory of Polymer Chemistry and Physics of Ministry of EducationCollege of EngineeringPeking UniversityBejing 100871China Institute of Chemical materials Chinese Academy of Engineering Physics(CA EP)Mianyang 621900China School of Chemical and materials Engineering(SCME) National University of Sciences and Technology(NUST)Islamabad 4000Pakistan

Attributed to the intense development and complexity in electronic devices,energy dissipation is becoming more essential nowadays.The carbonaceous materials particularly graphene(Gr)-based thermal interface materials(TIMs)are exceptional in heat management.However,because of the anisotropic behavior of Gr in composites,the TIMs having outstanding through-plane thermal conductivity(┴TC)are needed to fulfill the upcoming innovation in numerous devices.In order to achieve this,herein,nano-urethane linkage-based modified Gr and carbon fibers architecture termed as nanourethane linkage(NUL)-Gr/carbon fibers(CFs)is fabricated.Wherein,toluene diisocyanate is utilized to develop a novel but simple NUL to shape a new interface between graphene sheets.Interestingly,the prepared composite of NUL-Gr/CFs with polyvinylidene fluoride matrix shows outstanding performance in heat management.Owing to the unique structure of NUL-Gr/CFs,an unprecedented value of┴TC(~7.96 W·m^–1·K^–1)is achieved at a low filler fraction of 13.8 wt.%which translates into an improvement of^3,980%of pristine polymer.The achieved outcomes elucidate the significance of the covalent interaction between graphene sheets as well as strong bonding among graphene and matrix in the composites and manifest the potential of proposed NUL-Gr/CFs architecture for practical applications.

关键词： graphene thermal interface materials polymer composites

Advances of CNT-based systems in thermal management

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Nano Research 2021年第8期14卷 2471-2490页

作者： Wei Yu Changhong Liu Shoushan Fan Tsinghua-Foxconn Nanotechnology Research Center and Department of Physics Tsinghua UniversityBeijing 100084China

Effective thermal management has become extremely urgent for electronics due to the massive heat originated from the ever-rising power density.With the merits of high thermal conductivity,good chemical stability and desirable mechanical properties,carbon nanotubes(CNTs)are considered to have great potential to be widely used in heat dissipation devices.This article describes the progress on thermal conductivity of CNT-reinforced composites,aligned CNT materials(aligned CNT arrays,films/buckypapers and fibers)as high thermal conductors,experimental and theoretical results of CNT-substrate interface resistance,and utilizations of CNTs in the passive heat dissipation(natural convection,heat radiation,and phase-change heat transfer).Finally,the challenges and prospects are discussed to provide some hints in the future studies.It is believed that CNTs can play an important role in thermal management of electronics,especially in the portable electronic devices.

关键词： carbon nanotubes thermal management passive heat dissipation thermal interface materials thermal interface resistance