High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip

作     者：Sheng-Chang Ding Jian-Feng Fan Dong-Yi He Lin-Feng Cai Xiang-Liang Zeng Lin-Lin Ren Guo-Ping Du Xiao-Liang Zeng Rong Sun 

作者机构：Shenzhen Institute of Advanced Electronic MaterialsShenzhen Institute of Ad-vanced TechnologyChinese Academy of SciencesShenzhen518055China School of Physics and Materials ScienceNanchang UniversityNanchang 330031China 

出 版 物：《Chip》 (芯片（英文）)

年 卷 期：2022年第1卷第2期

页      面：27-34页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：This work was supported by the National Key Research and Development Program of China(No.2020YFB040176) National Natural Science Foundation of China(No.52073300 and 62104161) the Youth Innovation Promotion Association of the Chinese Academy of Sciences(2019354) Guangdong Province Key Field R&D Program Project(No.2020B010190004),Shenzhen Science and Technology Research Funding(No.JCYJ20200109114401708) Key Project of Science and Technol-ogy of Changsha(kq2102005) Guangdong Provincial Key Laboratory(2014B030301014) 

主　　题：Thermal interface materials Composite gels Damping Ther-mal conductivity Dangling chains 

摘      要：The emerging applications of composite gels as thermal interface ma-terials(TIMs)for chip heat dissipation in intelligent vehicle and wear-able devices require high thermal conductivity and remarkable damp-ing ***,thermal conductivity and damping proper-ties are usually correlated and coupled each ***,inspired by Maxwell theory and adhesion mechanism of gecko’s setae,we present a strategy to fabricate polydimethylsiloxane-based composite gels in-tegrating high thermal conductivity and remarkable damping prop-erties over a broad frequency and temperature *** multiple relaxation modes of dangling chains and the dynamic interaction be-tween the dangling chains and aluminum fillers can efficiently dis-sipate the vibration energy,endowing the composite gels with ultra-high damping property(tanδ0.3)over a broad frequency(0.01-100 Hz)and temperature range(-50-150°C),which exceeds typi-cal state-of-the-art damping *** dangling chains also com-fort to the interfaces between polymer matrix and aluminum via van der Waals interaction,resulting in high thermal conductivity(4.72±0.04 W m-1 K-1).Using the polydimethylsiloxane-based composite gel as TIMs,we demonstrate effective heat dissipation in chip oper-ating under vigorous *** believe that our strategy could be applied to a wide range of composite gels and lead to the devel-opment of high-performance composite gels as TIMs for chip heat dissipation.