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Material Removal Characteristics of single-crystal 4H-SiC Based on Varied-Load Nanoscratch Tests

Chinese Journal of Mechanical Engineering 2023年第4期36卷 125-138页

作者： Kun Tang Wangping Ou Cong Mao Jie Liang Moke Zhang Mingjun Zhang Yongle Hu Hunan Provincial Key Laboratory of Intelligent Manufacturing Technology for High-performance Mechanical Equipment Changsha University of Science and TechnologyChangsha 410114China

single-crystal silicon carbide(SiC)has been widely applied in the military and civil fields because of its excellent physical and chemical ***,as is typical in hard-to-machine materials,the good mechanical properties result in surface defects and subsurface damage during precision or ultraprecision *** this study,single-and double-varied-load nanoscratch tests were systematically performed on single-crystal 4H-SiC using a nanoindenter system with a Berkovich *** material removal characteristics and cracks under different planes,indenter directions,normal loading rates,and scratch intervals were analyzed using SEM,FIB,and a 3D profilometer,and the mechanisms of material removal and crack propagation were *** results showed that the Si-plane of the single-crystal 4H-SiC and edge forward indenter direction are most suitable for material removal and *** normal loading rate had little effect on the scratch depth,but a lower loading rate increased the ductile region and critical depth of ***,the crack interaction and fluctuation of the depth-distance curves of the second scratch weakened with an increase in the scratch interval,the status of scratches and chips changed,and the comprehensive effects of the propagation and interaction of the three cracks resulted in material fractures and chip *** calculated and experimental values of the median crack depth also showed good consistency and ***,this study provides an important reference for the high-efficiency and precision machining of single-crystal SiC to ensure high accuracy and a long service life.

关键词： single crystal silicon carbides Varied-load nanoscratch Material removal Crack propagation

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