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Optimizing Factory Performance for Unit Cost in semiconductor manufacturing

Open Journal of Optimization 2023年第2期12卷 61-71页

作者： Adar A. Kalir manufacturing Science at Intel Corp. Qiriat-Gat Israel Ruppin Academic Center Ben-Gurion University Beersheba Israel

The integrated circuit (IC) manufacturing process is capital intensive and complex. The production process of unit product (or die, as it is commonly referred to) takes several weeks. semiconductor factories (fabs) continuously attempt to improve their productivity, as measured in output and cycle time (or mean flow time). The conflicting objective of producing maximum units at minimal production cycle time and at the highest quality, as measured by die yield, is discussed in this paper. The inter-related effects are characterized, and a model is proposed to address this multi-objective function. We then show that, with this model, die cost can be optimized for any given operating conditions of a fab. A numerical example is provided to illustrate the practicality of the model and the proposed optimization method.

关键词： semiconductor manufacturing Cycle Time Die Cost Unit Cost Yield Optimization Productivity

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A Survey of Run-to-Run Control Algorithms for High-mix semiconductor manufacturing Processes

A Survey of Run-to-Run Control Algorithms for High-mix Semic...

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第三十届中国控制会议

作者： MA Ming-Da,ZENG Xian-Lin,DUAN Guang-Ren 1.Center for Control and Guidance Technology,Harbin Institute of Technology,Harbin 150001,P.R.China

The modeling and control of high-mix production system in semiconductor manufacturing impose great challenge for process *** different methods have been proposed to improve control performance of the high-mix *** this paper,an overview of the recent control algorithms for high-mix system is *** thread-based methods and the non-threaded state estimation methods which are studied and practiced widely in semiconductor manufacturing are discussed in *** research directions for the run-to-run control of mixed product system are pointed out based on the extensive study of current literatures.

关键词： Run-to-run control semiconductor manufacturing High-mix process Control Threads State Estimation

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Scheduling a Single-Arm Multi-Cluster Tool With a Condition-Based Cleaning Operation

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自动化学报:英文版 2023年第10期10卷 1965-1983页

作者： Qinghua Zhu Hongpeng Li Cong Wang Yan Hou School of Computer Science and Technology Guangdong University of TechnologyGuangzhou 510006China Department of Electrical and Computer Engineering New Jersey Institute of TechnologyNewarkNJ 07102-1982 USA

As wafer circuit widths shrink less than 10 nm,stringent quality control is imposed on the wafer fabrication processes. Therefore, wafer residency time constraints and chamber cleaning operations are widely required in chemical vapor deposition, coating processes, etc. They increase scheduling complexity in cluster tools. In this paper, we focus on scheduling single-arm multi-cluster tools with chamber cleaning operations subject to wafer residency time constraints. When a chamber is being cleaned, it can be viewed as processing a virtual wafer. In this way, chamber cleaning operations can be performed while wafer residency time constraints for real wafers are not violated. Based on such a method, we present the necessary and sufficient conditions to analytically check whether a single-arm multi-cluster tool can be scheduled with a chamber cleaning operation and wafer residency time constraints. An algorithm is proposed to adjust the cycle time for a cleaning operation that lasts a long cleaning ***, algorithms for a feasible schedule are also *** an algorithm is presented for operating a multi-cluster tool back to a steady state after the cleaning. Illustrative examples are given to show the application and effectiveness of the proposed method.

关键词： Chamber cleaning multi-cluster tools scheduling semiconductor manufacturing

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DTFab:A Digital Twin based Approach for Optimal Reticle Management in semiconductor Photolithography

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Journal of Systems Science and Systems Engineering 2023年第3期32卷 320-351页

作者： Chandrasekhar Komaralingam Sivasubramanian Robert Dodge Aditya Ramani David Bayba Mani Janakiram Eric Butcher Joseph Gonzales Giulia Pedrielli School of Computing and Augmented Inteligence Arizona State UniversityTempeAZUSA Intel Corporation ChandlerAZUSA

Photolithography is among the key phases in chip *** is also among the most expensive with manufacturing equipment valued at the hundreds of millions of *** is paramount that the process is ran efficiently,guaranteeing high resource utilization and low product cycle times.A key element in the operation of a photolithography system is the effective management of the reticles that are responsible for the imprinting of the circuit path on the *** reticles means determining which are appropriate to mount on the very expensive scanners as a function of the product types being released to the *** the importance of the problem,several heuristic policies have been developed in the industry practice in an attempt to guarantee that the expensive tools are never ***,such policies have difficulties reacting to unforeseen events(e.g.,unplanned failures,unavailability of reticles).On the other hand,the technological advance of the semiconductor industry in sensing at system and process level should be harnessed to improve on these"expert policies".In this manuscript,we develop a system for the real time reticle management that not only is able to retrieve information from the real system,but also is able to embed commonly used policies to improve upon *** develop a new digital twin for the photolithography process that efficiently and accurately predicts the system performance,thus allowing our system to make predictions for future behaviors as a function of possible *** results demonstrate the validity of the developed model,and the feasibility of the overall approach demonstrating a statistically significant improvement of performance as compared to the current policy.

关键词： semiconductor manufacturing reinforcement learning reticle management digital twin

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Polynomial Approach to Optimal One-wafer Cyclic Scheduling of Treelike Hybrid Multi-Cluster Tools via Petri Nets

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IEEE/CAA Journal of Automatica Sinica 2018年第1期5卷 270-280页

作者： Fajun Yang Naiqi Wu Yan Qiao Rong Su Department of Industrial Engineering School of Electro-Mechanical Engineering Guangdong University of Technology Guangzhou 510006 China School of Electrical and Electronic Engineering at Nanyang Technological University 639798 Singapore Institute of Systems Engineering Macao University of Science and Technology Taipa Macao 999078 China school of Electro-Mechanical Engineering Guangdong University of Technology Guangzhou 510006 China IEEE

A treelike hybrid multi-cluster tool is composed of both single-arm and dual-arm cluster tools with a treelike topology. Scheduling such a tool is challenging. For a hybrid treelike multi-cluster tool whose bottleneck individual tool is process-bound, this work aims at finding its optimal one-wafer cyclic schedule. It is modeled with Petri nets such that a onewafer cyclic schedule is parameterized as its robots' waiting *** on the model, this work proves the existence of its onewafer cyclic schedule that features with the ease of industrial implementation. Then, computationally efficient algorithms are proposed to find the minimal cycle time and optimal onewafer cyclic schedule. Multi-cluster tool examples are given to illustrate the proposed approach. The use of the found schedules enables industrial multi-cluster tools to operate with their highest productivity.

关键词： Multi-cluster tool Petri nets scheduling semiconductor manufacturing

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Cycle Time Analysis for Wafer Revisiting Process in Scheduling of Single-arm Cluster Tools

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International Journal of Automation and computing 2011年第4期8卷 437-444页

作者： Yu-Xi Sun Nai-Qi Wu School of Mechatronics Engineering Guangdong University of Technology Guangzhou 510006 PRC

Some wafer fabrication processes performed by cluster tools require revisiting. With wafer revisiting, a cluster tool is very difficult to be scheduled due to a large number of possible schedules for the revisiting process. Atomic layer deposition （ALD） is a typical process with wafer revisiting that should be performed by cluster tools. This paper discusses the scheduling problem of single-arm cluster tools for the ALD process. In scheduling such a system, the most difficult part is to schedule the revisiting process such that the cycle time is minimized. Thus, this paper studies the revisiting process of ALD with revisiting times k = 3, 4, and 5, and analytical expressions are obtained to calculate the cycle time for the k possible schedules. Then, the schedule with the minimal cycle time is the optimal one. In this way, the scheduling problem of such a revisiting process becomes very simple and this is a significant improvement in scheduling cluster tools with wafer revisiting. Illustrative example is presented to show the application of the proposed method.

关键词： Scheduling semiconductor manufacturing cluster tools Petri net automated manufacturing systems.

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ELEVATE COMPANY-WIDE PRODUCTIVITY VIA BUSINESS PROCESS REENGINEERING

ELEVATE COMPANY-WIDE PRODUCTIVITY VIA BUSINESS PROCESS REENG...

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第十二届工业工程和工程管理国际会议

作者： Darryl Liang John Kao Jacky Kuo Alex Hsu Kp Lee Albert Chang Business Process Reengineering Department Taiwan semiconductor manufacturing Company HsinchuTaiwan

This paper illustrates how Taiwan semiconductor manufacturing Company ( TSMC) implements business process reengineering( BPR) techniques to enhance operation efficiency. Since the approach is not a new concept and a lot have been written about it,this paper focuses on the experience sharing and lessons *** remain world’s best dedicated IC foundry company and to face the global competitors,all the functional areas of the company need to be properly integrated, with each understanding the importance of cross functional *** paper concludes that even BPR has been introduced for more than a decade,organizations can still benefit from it. Real cases,including a Nation Quality Award winning case,are given to show the processes and results.

关键词： Efficiency Business process reengineering semiconductor manufacturing

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Simulation Based Correlation Analysis on Performance Issues of semiconductor Wafer Fabrication Facilities

Simulation Based Correlation Analysis on Performance Issues ...

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第26届中国控制与决策会议

作者： Xingwei Pan Li Li Zhongbo Chen Pengde Jia College of Electronics and Information Engineering Tongji University

ISBN: (纸本)9781479937097

There are many performance issues concerned in a semiconductor wafer fabrication facility（fab）, such as move, queue length, utility, cycle time, throughput and on-time delivery rate. However, it is difficult to demonstrate their relations to each other. In this paper, the correlation coefficient method is utilized to analyze their relations from plentiful simulation results and obtain some meaningful conclusions. Firstly, these performance issues are classified into three categories, i.e., machine related, fab-wide related and job related ones. Secondly, a mass of simulation data related to performance issues are obtained with a variety of simulations with different workload levels（under-loading, heavy-loading and over-loading） and decision criterions（FIFO, EDD, SPT, LS and CR）. Thirdly, correlation coefficient method is used to identify the correlations among these performance issues from simulation data. Finally, we obtain a performance system of fabs.

关键词： Performance Correlation Coefficient Analysis semiconductor manufacturing

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