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Journal of Southeast University(English Edition) 2014年第2期30卷 143-149页

作者：刘梁刘安管运涛清华大学深圳研究生院深圳518055 清华大学环境学院北京100084 清华大学国家环境保护环境微生物利用与安全控制重点实验室北京100084

An innovative approach based on water environmental capacity for non-point source NPS pollution removal rate estimation was discussed by using both univariate and multivariate data *** Shenzhen city as the study case a 67% to 74% NPS pollutant load removal rate can lead to meeting the chemical oxygen demand COD pollution control target for most *** contrast it is hardly to achieve the ammonia nitrogen NH4-N total phosphorus TP and biological oxygen demand BOD5 pollution control target by simply removing NPS pollutants. This highlights that the pollution control strategies should be taken according to different pollutant species and sources in different watersheds rather than one-size-fits-all .

关键词： environmental capacity estimation non-point source (NPS) pollution removal rate control strategy

Atmospheric Pressure Plasma Processing of Fused Silica in Different Discharge Modes

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Plasma Science and Technology 2015年第7期17卷 567-573页

作者：李娜辛强张鹏王波 Center for Precision Engineering Harbin Institute of Technology

One of the major advantages of utilizing atmospheric pressure plasma processing （APPP） technology to fabricate ultra-precision optics is that there is no subsurface damage during the process. In APPP, the removal footprint and removal rate are critical to the capability and efficiency of the figuring of the optical surface. In this paper, an atmospheric plasma torch, which can work in both remote mode and contact mode, is presented. The footprints and the removal rates of both modes are compared by profilometer measurements. The influences of process recipes and substrate thickness for both modes are investigated through a series of experiments. When the substrate is thinner than 12 mm, the removal rate in contact mode is higher. However, the removal rate and width of the footprint decrease dramatically as the substrate thickness increases in contact mode.

关键词： atmospheric pressure plasma processing remote mode contact mode removalfootprint removal rate

Mechanisms of granular activated carbon anaerobic fluidized-bed process for treating phenols wastewater

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Journal of Environmental Sciences 2002年第1期14卷 132-135页

作者： LAO Shan gen (Department of Environmental Engineering, Zhejiang University, Hangzhou 310029, China) Department of Environmental Engineering Zhejiang University Hangzhou 310029

Granular activated carbon (GAC) anaerobic fluidized bed reactor was applied to treating phenols wastewater. When influent phenol concentration was 1000 mg/L, volume loadings of phenol and COD Cr were 0 39 kg/(m 3·d) and 0 98 kg/(m 3·d), their removal rates were 99 9% and 96 4% respectively. From analyzing above results, the main mechanisms of the process are that through fluidizing GAC, its adsorption is combined with biodegradation, both activities are brought into full play, and phenol in wastewater is effectively decomposed. Meanwhile problems concerning gas liquid separation and medium plugging are well solved.

关键词： granular activated carbon (GAC) anaerobic fluidized bed phenol removal rate

Slurry components of TiO_2 thin film in chemical mechanical polishing

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Journal of Semiconductors 2014年第10期35卷 190-194页

作者：段波周建伟刘玉岭王辰伟张玉峰 Institute of Microelectronics Hebei University of Technology

A chemical mechanical polishing （CMP） process was selected to smooth TiO2 thin film surface and improve the removal rate. Meanwhile, the optimal process conditions were used in TiO2 thin film CME The effects of silica sols concentration, slurry pH, chelating agent and active agent concentration on surface roughness and material removal rate were investigated. Our experimental results indicated that we got lower surface roughness （1.26 A, the scanned area was 10 × 10 μm2） and higher polishing rate （65.6 nm/min）, the optimal parameters were： silica sols concentration 8.0%, pH value 9.0, active agent concentration 50 mL/L, chelating agent concentration 10 mL/L, respectively.

关键词： TiO2 thin film slurry components surface roughness removal rate

Alkaline barrier slurry applied in TSV chemical mechanical planarization

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Journal of Semiconductors 2014年第2期35卷 137-140页

作者：马锁辉王胜利刘玉岭王辰伟杨琰 Institute of Microelectronics Hebei University of Technology Hebei University of Technology

We have proposed a TSV （through-silicon-via） alkaline barrier slurry without any inhibitors for barrier CMP （chemical mechanical planarization） and investigated its CMP performance. The characteristics of removal rate and selectivity of Ti/SiO2/Cu were investigated under the same process conditions. The results obtained from 6.2 mm copper, titanium and silica show that copper has a low removal rate during barrier CMP by using this slurry, and Ti and SiO2 have high removal rate selectivity to Cu. Thus it may be helpful to modify the dishing. The TSV wafer results reveal that the alkaline barrier slurry has an obvious effect on surface topography correction, and can be applied in TSV barrier CME

关键词： TSV alkaline barrier slurry removal rate selectivity dishing

Simulation Study on Purification Efficiency for Nitrogen in Different Types of Wetlands in Sanjiang Plain, China

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Chinese Geographical Science 2010年第3期20卷 252-257页

作者： GUO Yue JIANG Ming LU Xianguo Northeast Institute of Geography and Agroecology Chinese Academy of Sciences Changchun 130012 China Graduate University of the Chinese Academy of Sciences Beijing 100049 China

The purification law of nitrogen in Deyeuxia angustifolia, Carex lasiocarpa and Deyeuxia angustifolia-Carex lasiocarpa combined wetland systems in the Sanjiang Plain, China was studied by field simulation experiment. The results indicate that the removal rates of TN, NH4^＋-N and NO3^--N in above three types of wetlands present an obvious logarithm growth trend along with the time. There are evident removal effects for NH4＋-N and NOa--N in water bodies of wetlands after the 30th day of experiment, with the removal rates over 80.0%, but the removal rate of TN is slightly low, being 63.1%-74.3%. NO3 -N is most quickly removed by the combined wetland, and NH4^＋-N by Deyeuxia angustifolia wetland. The removal speeds of TN by the three wetland systems are comparatively slow, of which the Deyeuxia angustifolia wetland is the fastest. In consideration of plant growth season, Deyeuxia angustifolia wetland has much more practical application value in purifying nitrogen. These results can provide references for the study on the purification function of wetlands and the control of non-point source pollution in Northeast China.

关键词： wetland Deyeuxia angustifolia Carex lasiocarpa nitrogen removal rate Sanjiang plain

Micro-precision surface finishing using magneto-rheological fluid

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Science China(Technological Sciences) 2012年第1期55卷 56-61页

作者： CHOI SeungBok LEE DeukWon LEE ChulHee Department of Mechanical Engineering Inha UniversityIncheon 402-751Korea

In order to improve the surface quality of machining workpiece, this paper studied a micro-precision surface finishing method by applying magneto-rheological fluid to the machined surface. A pin-on-disc testing apparatus was used to carry out surface finishing experiment of steel under different magnetic fields. Magneto-rheological fluid is colloidal suspension and stiffens in- to semi-solid when subjected to a magnetic field. Thus, the surface roughness of the finished surface could be controlled by magneto-rheological fluid under the different magnetic fields. Several sets of tests were performed with various normal loads, finishing speeds and magnetic fields. removal rate was calculated by the removal loss monitored by testing apparatus, while microstmctures of the finished surface of pin and disk were observed by scanning electron microscope. The micro-precision roughness of finished surface was analyzed by surface profilorneter. The obtained test results showed different surface charac- teristics of the test material under different magnetic fields and proved the feasibility of this micro-precision surface finishing method to reduce the surface roughness of machining workpiece efficiently. At the same time, the effects of the various ap- plied normal loads and rotating speeds on the finishing surface by rnagneto-rheological fluid were investigated.

关键词： magnetorheological fluid surface fmishing removal rate surface roughness

A new kind of chelating agent with low pH value applied in the TSV CMP slurry

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Journal of Semiconductors 2015年第12期36卷 143-146页

作者：洪姣刘玉岭张保国牛新环韩力英 School of Electronic Information Engineering Hebei University of Technology Tianjin Key Laboratory of Electronic Materials and Devices

TSV（through silicon via） is an emerging technology, which can realize micromation compared with the conventional packaging and extend Moore＇s law. Chemical mechanical polishing（CMP） is one of the most important steps in the process of TSV manufacture, and it is an enabling technology to extend Moore＇s law in the past two decades. Low pressure, low abrasive and low p H value are the main requirements for copper *** this paper, the effect of different kinds of TSV slurry with FA/OⅡ or FA/O IV type chelating agent on CMP are studied. All kinds of slurry used in this study are alkaline with no added inhibitors. From the experiment results, it can be seen that the copper removal rate and surface roughness achieved by using the FA/OⅣ type chelating agent with a low p H value is superior to using the FA/OⅡ type chelating agent.

关键词： low pH value alkaline slurry removal rate roughness

Influence of pH on short-cut denitrifying phosphorus removal

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Water Science and Engineering 2018年第1期11卷 17-22页

作者： Wei Li Hui-yan Zhang Hui-zhi Sun Fei Zeng Yu-nan Gao Lei Zhu School of Municipal and Environmental Engineering Shenyang Jianzhu UniversityShenyang 110168China Shenyang Academy of Environmental Sciences Shenyang 110167China

Through a series of experiments using denitrifying phosphorus-accumulating sludge in sequencing batch reactors （SBRs）, the variations of the intracellular polymers during the anaerobic phosphorus release process at different pH values were compared, the probable reasons for different performances of phosphorus removal were examined, and system operations in a typical cycle were investigated. The results show that the phosphorus removal rate was positively correlated with pH values in a range of 6.5-8.5. When the pH value was 8.0, the anaerobic phosphorus release rate and anoxic phosphorus uptake rate of the activated sludge were 20.95 mg/（g, h） and 23.29 mg/（g, h）, respectively; the mass fraction of poly-13-hydroxybutyrate （PHB） increased to 62.87 mg/g under anaerobic conditions; the mass fraction of polyphosphate was 92.67 mg/g under anoxic conditions; and the effluent concentration of total phosphorus （TP） was 1.47 mg/L. With the increase of pH, the mass fraction of acetic acid and PHB also increased, and the absorption rate of acetic acid was equal to the disintegration rate of polyphosphate. When the pH value was above 8.0, biological phosphorus removal was achieved by chemical phosphorus precipitation, and the phosphorus removal rate decreased.

关键词： Denitrifying phosphorus removal pH removal rate PHB

Effect of novel alkaline copper slurry on 300 mm copper global planarization

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Journal of Semiconductors 2014年第9期35卷 171-174页

作者：刘伟娟刘玉岭王辰伟陈国栋蒋勐婷袁浩博程鹏飞 Institute of Microelectronics Hebei University of Technology

The copper removal rate and uniformity of two types copper slurries were investigated, which was performed on the 300 mm chemical mechanical planarization （CMP） platform. The experiment results illustrate that the removal rate of the two slurries is nearly the same. Slurry A is mainly composed ofa FA/OI1 type chelating agent and the uniformity reaches to 88.32%. While the uniformity of slurry B is 96.68%, which is mainly composed of a FA/OV type chelating agent. This phenomenon demonstrates that under the same process conditions, the uniformity of different slurries is vastly different. The CMP performance was evaluated in terms of the dishing and erosion values. In this paper, the relationship between the uniformity and the planarization was deeply analyzed, which is mainly based on the endpoint detection mechanism. The experiment results reveal that the slurry with good uniformity has low dishing and erosion. The slurry with bad uniformity, by contract, increases Cu dishing significantly and causes copper loss in the recessed region. Therefore, the following conclusions are drawn： slurry B can improve the wafer leveling efficiently and minimize the resistance and current density along the line, which is helpful to improve the device yield and product reliability. This investigation provides a guide to improve the uniformity and achieve the global and local planarization. It is very significant to meet the requirements for 22 nm technology nodes and control the dishing and erosion efficiently.

关键词： CMP removal rate uniformity dishing erosion endpoint detection