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Femtosecond laser additive and subtractive micro-processing:enabling a high-channeldensity silica interposer for multicore fibre to silicon-photonic packaging

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International Journal of Extreme Manufacturing 2019年第4期1卷 24-32页

作者： Gligor Djogo Jianzhao Li Stephen Ho Moez Haque Erden Ertorer Jun Liu Xiaolu Song Jing Suoand Peter R Herman The Edward S Rogers Sr Department of Electrical&Computer Engineering University of TorontoTorontoCanada Transmission&Access Research Department Huawei Technologies Co.LtdDongguanPeople’s Republic of China

Great strides have been made over the past decade to establish femtosecond lasers in advanced manufacturing systems for enabling new forms of non-contact processing of transparent *** advances have shown that a myriad of additive and subtractive techniques is now possible for flexible 2D and 3D structuring of such materials with micro-and nano-scale *** this paper,these techniques have been refined and scaled up to demonstrate the potential for 3D writing of high-density optical packaging components,specifically addressing the major bottleneck for efficiently connecting optical fibres to silicon photonic(SiP)processors for use in telecom and data *** 84-channel fused silica interposer was introduced for high-density edge coupling of multicore fibres(MCFs)to a SiP *** laser irradiation followed by chemical etching was further harnessed to open alignment sockets,permitting rapid assembly with precise locking of MCF positions for efficient coupling to laser written optical waveguides in the interposer.A 3D waveguide fanout design provided an attractive balancing of low losses,modematching,high channel density,compact footprint,and low *** 3D additive and subtractive processes thus demonstrated the potential for higher scale integration and rapid photonic assembly and packaging of micro-optic components for telecom interconnects,with possible broader applications in integrated biophotonic chips or micro-displays.

关键词： femtosecond laser micro-processing photonic packaging waveguide fanout fibre socket multicore fibre space-division multiplexing silicon photonics interposer

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Two-photon lithography for integrated photonic packaging

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Light(Advanced Manufacturing) 2023年第4期4卷 150-166页

作者： Shaoliang Yu Qingyang Du Cleber Renato Mendonca Luigi Ranno Tian Gu Juejun Hu Zhejiang Laboratory Hangzhou 311100China Department of Materials Science and Engineering Massachusetts Institute of TechnologyCambridgeMA 02139USA Sao Carlos Institute of Physics University of Sao PauloSao CarlosSP 13560-970Brazil Materials Research Laboratory Massachusetts Institute of TechnologyCambridgeMA 02139USA

photonic integrated circuits(PICs)have long been considered as disruptive platforms that revolutionize *** on the mature industrial foundry infrastructure for electronic integrated circuit fabrication,the manufacturing of PICs has made remarkable ***,the packaging of PICs has often become a major barrier impeding their scalable deployment owing to their tight optical alignment tolerance,and hence,the requirement for specialty packaging ***-photon lithography(TPL),a laser direct-write three-dimensional(3-D)patterning technique with deep subwavelength resolution,has emerged as a promising solution for integrated photonics *** study provides an overview of the technology,emphasizing the latest advances in TPL-enabled packaging schemes and their prospects for adoption in the mainstream photonic industry.

关键词： photonic packaging Two-photon lithography photonic wire bonding Microoptics Integrated photonics

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3D-printed facet-attached microlenses for advanced photonic system assembly

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Light(Advanced Manufacturing) 2023年第2期4卷 1-17页

作者： Yilin Xu Pascal Maier Mareike Trappen Philipp-Immanuel Dietrich Matthias Blaicher Rokas Jutas Achim Weber Torben Kind Colin Dankwart Jens Stephan Andreas Steffan Amin Abbasi Padraic Morrissey Kamil Gradkowski Brian Kelly Peter O’Brien Wolfgang Freude Christian Koos Institute of photonics and Quantum Electronics(IPQ) Karlsruhe Institute of Technology(KIT)Engesserstr.576131 KarlsruheGermany Institute of Microstructure Technology(IMT) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Vanguard Automation GmbH Gablonzer Strasse.1076185 KarlsruheGermany ficon TEC Service GmbH Im Finigen 328832 AchimGermany II-VI Inc. Reuchlinstraße 10/1110553 BerlinGermany photonics Research Group Ghent University-imecTechnologiepark-Zwijnaarde 126B-9052 GentBelgium Tyndall National Institute T12 R5CP CorkIreland Eblana photonics Ltd. West Pier Business Campus3 Old Dunleary RdDún LaoghaireDublinA96 A621Ireland

Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing ***,scalable photonic packaging and system assembly still represents a major challenge that often hinders commercial adoption of PIC-based ***,chip-to-chip and fiber-to-chip connections often rely on so-called active alignment techniques,where the coupling efficiency is continuously measured and optimized during the assembly *** unavoidably leads to technically complex assembly processes and high cost,thereby eliminating most of the inherent scalability advantages of PIC-based *** this paper,we demonstrate that 3D-printed facet-attached microlenses(FaML)can overcome this problem by opening an attractive path towards highly scalable photonic system assembly,relying entirely on passive assembly techniques based on industry-standard machine vision and/or simple mechanical *** can be printed with high precision to the facets of optical components using multi-photon lithography,thereby offering the possibility to shape the emitted beams by freely designed refractive or reflective ***,the emitted beams can be collimated to a comparatively large diameter that is independent of the device-specific mode fields,thereby relaxing both axial and lateral alignment ***,the FaML concept allows to insert discrete optical elements such as optical isolators into the free-space beam paths between PIC *** show the viability and the versatility of the scheme in a series of selected experiments of high technical relevance,comprising pluggable fiber-chip interfaces,the combination of PIC with discrete micro-optical elements such as polarization beam splitters,as well as coupling with ultra-low back-reflection based on non-planar beam paths that only comprise tilted optical *** on our re

关键词： photonic integration photonic assembly photonic packaging Additive laser manufacturing Multi-photon lithography Facet-attached microlenses Optical alignment tolerances Fiber-chip coupling Hybrid multi-chip modules

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