3D-printed facet-attached microlenses for advanced photonic system assembly

作     者：Yilin Xu Pascal Maier Mareike Trappen Philipp-Immanuel Dietrich Matthias Blaicher Rokas Jutas Achim Weber Torben Kind Colin Dankwart Jens Stephan Andreas Steffan Amin Abbasi Padraic Morrissey Kamil Gradkowski Brian Kelly Peter O’Brien Wolfgang Freude Christian Koos 

作者机构：Institute of Photonics and Quantum Electronics(IPQ)Karlsruhe Institute of Technology(KIT)Engesserstr.576131 KarlsruheGermany Institute of Microstructure Technology(IMT)KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Vanguard Automation GmbHGablonzer Strasse.1076185 KarlsruheGermany ficon TEC Service GmbHIm Finigen 328832 AchimGermany II-VI Inc.Reuchlinstraße 10/1110553 BerlinGermany Photonics Research GroupGhent University-imecTechnologiepark-Zwijnaarde 126B-9052 GentBelgium Tyndall National InstituteT12 R5CP CorkIreland Eblana Photonics Ltd.West Pier Business Campus3 Old Dunleary RdDún LaoghaireDublinA96 A621Ireland 

出 版 物：《Light(Advanced Manufacturing)》 (光（先进制造）（英文）)

年 卷 期：2023年第4卷第2期

页      面：1-17页

学科分类：070207[理学-光学] 07[理学] 08[工学] 0803[工学-光学工程] 0702[理学-物理学] 

基　　金：the Deutsche Forschungsgemeinschaft(DFG,German Research Foundation)under Germany’s Excellence Strategy via the Excellence Cluster 3D Matter Made to Order(EXC-2082/1-390761711) the Collaborative Research Center WavePhenomena(CRC 1173) by the Bundesministerium für Bildung und Forschung(BMBF)via the projects PRIMA(#13N14630),DiFeMiS(#16ES0948) which is part of the programme“Forschungslabore Mikroelektronik Deutschland(ForLab),and Open6GHub(#16KISK010) by the European Research Council(ERC Consolidator Grant‘TeraSHAPE’ #773248),by the H2020 Photonic Packaging Pilot Line PIXAPP(#731954) by the Alfried Krupp von Bohlen und Halbach Foundation,and by the Karlsruhe School of Optics and Photonics(KSOP) 

主　　题：Photonic integration Photonic assembly Photonic packaging Additive laser manufacturing Multi-photon lithography Facet-attached microlenses Optical alignment tolerances Fiber-chip coupling Hybrid multi-chip modules 

摘      要：Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing ***,scalable photonic packaging and system assembly still represents a major challenge that often hinders commercial adoption of PIC-based ***,chip-to-chip and fiber-to-chip connections often rely on so-called active alignment techniques,where the coupling efficiency is continuously measured and optimized during the assembly *** unavoidably leads to technically complex assembly processes and high cost,thereby eliminating most of the inherent scalability advantages of PIC-based *** this paper,we demonstrate that 3D-printed facet-attached microlenses(FaML)can overcome this problem by opening an attractive path towards highly scalable photonic system assembly,relying entirely on passive assembly techniques based on industry-standard machine vision and/or simple mechanical *** can be printed with high precision to the facets of optical components using multi-photon lithography,thereby offering the possibility to shape the emitted beams by freely designed refractive or reflective ***,the emitted beams can be collimated to a comparatively large diameter that is independent of the device-specific mode fields,thereby relaxing both axial and lateral alignment ***,the FaML concept allows to insert discrete optical elements such as optical isolators into the free-space beam paths between PIC *** show the viability and the versatility of the scheme in a series of selected experiments of high technical relevance,comprising pluggable fiber-chip interfaces,the combination of PIC with discrete micro-optical elements such as polarization beam splitters,as well as coupling with ultra-low back-reflection based on non-planar beam paths that only comprise tilted optical *** on our re