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Ultra-broadband polarisation beam splitters and rotators based on 3D-printed waveguides

Light(Advanced Manufacturing) 2023年第3期4卷 251-262页

作者： Aleksandar Nesic matthias blaicher Pablo Marin-Palomo Christoph Füllner Sebastian Randel Wolfgang Freude Christian Koos Institute of Photonics and Quantum Electronics(IPQ) Karlsruhe Institute of Technology(KIT)KarlsruheGermany Institute of Microstructure Technology(IMT) Karlsruhe Institute of Technology(KIT)Eggenstein-LeopoldshafenGermany Vanguard Automation GmbH KarlsruheGermany

Multi-photon lithography has emerged as a powerful tool for photonic integration,allowing to complement planar photonic circuits by 3D-printed freeform structures such as waveguides or micro-optical *** structures can be fabricated with a high precision on the facets of optical devices and enable highly efficient package-level chip-chip connections in photonic ***,plain light transport and efficient coupling is far from exploiting the full geometrical design freedom offered by 3D laser ***,we extended the functionality of 3D-printed optical structures to manipulation of optical polarisation *** demonstrate compact ultra-broadband polarisation beam splitters(PBSs)that can be combined with polarisation rotators and mode-field adapters into a monolithic 3D-printed structure,fabricated directly on the facets of optical *** a proof-of-concept experiment,we demonstrate measured polarisation extinction ratios beyond 11 dB over a bandwidth of 350 nm at near-infrared telecommunication wavelengths around 1550 *** demonstrate the viability of the device by receiving a 640 Gbit/s dual-polarisation data signal using 16-state quadrature amplitude modulation(16QAM),without any measurable optical-signal-to-noise-ratio penalty compared to a commercial PBS.

关键词： Photonic integration Additive laser manufacturing Multi-photon lithography Polarisation splitter/rotator

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Hybrid multi-chip assembly of optical communication engines by in situ 3D nanolithography

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Light(Science & Applications) 2020年第1期9卷 1340-1350页

作者： matthias blaicher Muhammad Rodlin Billah Juned Kemal Tobias Hoose Pablo Marin-Palomo Andreas Hofmann Yasar Kutuvantavida Clemens Kieninger Philipp-Immanuel Dietrich matthias Lauermann Stefan Wolf Ute Troppenz Martin Moehrle Florian Merget Sebastian Skacel Jeremy Witzens Sebastian Randel Wolfgang Freude Christian Koos Institute of Photonics and Quantum Electronics(IPQ) Karlsruhe Institute of Technology(KIT)Engesserstraße 576131 KarlsruheGermany Institute for Microstructure Technology(IMT) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Institute for Automation and Applied Informatics(IAI) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Vanguard Automation GmbH Gablonzer StraBe 1076185 KarlsruheGermany Fraunhofer Institute for Telecommunications Heinrich Hertz Institute(HHI)Einsteinufer 3710587 BerlinGermany Institute of Integrated Photonics(IPH) RWTH AachenSommerfeldstraße 18/2452074 AachenGermany

Three-dimensional(3D)nano-printing of freeform optical waveguides,also referred to as photonic wire bonding,allows for efficient coupling between photonic chips and can greatly simplify optical system *** a key advantage,the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips,thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision ***,while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments,it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability *** this paper,we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode *** a first experiment,we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation.A second experiment is dedicated to a four-channel coherent transmitter,operating at a net data rate of 732.7 Gbit/s-a record for coherent silicon photonic transmitters with co-packaged *** dedicated test chips,we further demonstrate automated mass production of photonic wire bonds with insertion losses of(0.7±0.15)dB,and we show their resilience in environmental-stability tests and at high optical *** results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

关键词： communication lithography bonding

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3D-printed facet-attached microlenses for advanced photonic system assembly

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Light(Advanced Manufacturing) 2023年第2期4卷 1-17页

作者： Yilin Xu Pascal Maier Mareike Trappen Philipp-Immanuel Dietrich matthias blaicher Rokas Jutas Achim Weber Torben Kind Colin Dankwart Jens Stephan Andreas Steffan Amin Abbasi Padraic Morrissey Kamil Gradkowski Brian Kelly Peter O’Brien Wolfgang Freude Christian Koos Institute of Photonics and Quantum Electronics(IPQ) Karlsruhe Institute of Technology(KIT)Engesserstr.576131 KarlsruheGermany Institute of Microstructure Technology(IMT) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Vanguard Automation GmbH Gablonzer Strasse.1076185 KarlsruheGermany ficon TEC Service GmbH Im Finigen 328832 AchimGermany II-VI Inc. Reuchlinstraße 10/1110553 BerlinGermany Photonics Research Group Ghent University-imecTechnologiepark-Zwijnaarde 126B-9052 GentBelgium Tyndall National Institute T12 R5CP CorkIreland Eblana Photonics Ltd. West Pier Business Campus3 Old Dunleary RdDún LaoghaireDublinA96 A621Ireland

Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing ***,scalable photonic packaging and system assembly still represents a major challenge that often hinders commercial adoption of PIC-based ***,chip-to-chip and fiber-to-chip connections often rely on so-called active alignment techniques,where the coupling efficiency is continuously measured and optimized during the assembly *** unavoidably leads to technically complex assembly processes and high cost,thereby eliminating most of the inherent scalability advantages of PIC-based *** this paper,we demonstrate that 3D-printed facet-attached microlenses(FaML)can overcome this problem by opening an attractive path towards highly scalable photonic system assembly,relying entirely on passive assembly techniques based on industry-standard machine vision and/or simple mechanical *** can be printed with high precision to the facets of optical components using multi-photon lithography,thereby offering the possibility to shape the emitted beams by freely designed refractive or reflective ***,the emitted beams can be collimated to a comparatively large diameter that is independent of the device-specific mode fields,thereby relaxing both axial and lateral alignment ***,the FaML concept allows to insert discrete optical elements such as optical isolators into the free-space beam paths between PIC *** show the viability and the versatility of the scheme in a series of selected experiments of high technical relevance,comprising pluggable fiber-chip interfaces,the combination of PIC with discrete micro-optical elements such as polarization beam splitters,as well as coupling with ultra-low back-reflection based on non-planar beam paths that only comprise tilted optical *** on our re

关键词： Photonic integration Photonic assembly Photonic packaging Additive laser manufacturing Multi-photon lithography Facet-attached microlenses Optical alignment tolerances Fiber-chip coupling Hybrid multi-chip modules

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存活5年以上恶性胶质瘤患者的状况

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世界核心医学期刊文摘(神经病学分册) 2006年第11期 50-51页

作者： Steinbach J.P blaicher H.-P Herrlinger U 郭俊 Department of General Neurology University of Tübingen Medical School Hoppe-Seyler-Strasse 3 72076 Tübingen Germany Dr

The authors performed a comprehensive analysis of the functional outcome of 10 patients who had survived 5 years from a diagnosis of glioblastoma. Neurologic deficits were mild in most patients, but neuropsychological testing demonstrated cognitive deficits in all patients. Depression and anxiety were common. Although most patients thought that their social functioning and work ability were impaired, little reduction in overall quality of life was perceived.

关键词：恶性胶质瘤患者

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