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Elliptical vibration cutting of large-size thin-walled curved surface parts of pure iron by using diamond tool with active cutting edge shift

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Chinese Journal of Aeronautics 2023年第6期36卷 402-419页

作者： Zhenhua JIAO renke kang Dongxing DU Jiang GUO Key Laboratory for Precision and Non-traditional Machining of Ministry of Education Dalian University of TechnologyDalian 116024China Institute of Mechanical Manufacturing Technology China Academy of Engineering PhysicsMianyang 621999China

Large-size thin-walled curved surface parts of pure iron are crucial in aerospace,national defense,energy and precision physical ***,the high machining accuracy and surface quality are difficult to achieve due to the serious tool wear and deformation when machining the parts with conventional cutting *** this paper,an elliptical vibration cutting(EVC)with active cutting edge shift(ACES)based on a long arbor vibration device is proposed for ultraprecision machining the pure iron parts by using diamond *** with cutting at a fixed cutting edge,the influence of ACES on the EVC was *** in EVC of pure iron with ACES were *** evolutions of the surface roughness,surface topography,and chip morphology with tool wear in EVC with ACES are *** reasonable parameters of ultraprecision machining the pure iron parts by EVC with ACES were *** shows that the ACES has a slight influence on the machined surface roughness and surface *** diamond tool life can be significantly prolonged in EVC of pure iron with ACES than that with a fixed cutting edge,so that high profile accuracy and surface quality could be obtained even at higher nominal cutting speed.A typical thin-walled curved surface pure iron part with diameter φ240 mm,height 122 mm,and wall thickness 2 mm was fabricated by the presented method,and its profile error and surface roughness achieved PV 2.2μm and Ra less than 50 nm,respectively.

关键词： Curved surface Diamond tool Elliptical vibration cutting Pure iron Thin-walled parts

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Recent progress of residual stress measurement methods: A review

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Chinese Journal of Aeronautics 2021年第2期34卷 54-78页

作者： Jiang GUO Haiyang FU Bo PAN renke kang Key Laboratory for Precision and Non-traditional Machining of Ministry of Education Dalian University of TechnologyDalian 116024China

Residual stress is one of the main factors affecting the mechanical properties of materials, such as their strength, plasticity and surface integrity. For instance, tensile stress conditions can adversely affect material performance or component life, while compressive stress conditions can improve material fatigue strength. During the processing of integrated aviation structures, machining deformation caused by residual stress has become one of the most prominent manufacturing problems. Therefore, it is very important to measure and evaluate the stress for real *** paper reviews the research of residual stress measurement methods over the past five years by classifying them according to the measurement methods appearing in each stage. The existing problems and difficulties of each measurement technology are summarized, and future trends are forecasted. This paper provides a reference for further in-depth study of residual stress measurement technologies.

关键词： Destructive testing Future trends Measurement Nondestructive testing Residual stress

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Microstructure studies of the grinding damage in monocrystalline silicon wafers

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Rare Metals 2007年第1期26卷 13-18页

作者： ZHANG Yinxia kang renke GUO Dongming JIN Zhuji Key Laboratory for Precision and Non-traditional Machining Technology of Chinese MinisWy of Education Dalian University of Technology Dalian116024 China

The depth and nature of the subsurface damage in a silicon wafer will limit the performance of IC components. Damage microstructures of the silicon wafers ground by the #325, #600, and #2000 grinding wheels was analyzed. The results show that many microcracks, fractures, and dislocation rosettes appear in the surface and subsurface of the wafer ground by the #325 grinding wheel. No obvious microstructure change exists. The amorphous layer with a thickness of about 100 nm, microcracks, high density dislocations, and polycrystalline silicon are observed in the subsurface of the wafer ground by the #600 grinding wheel. For the wafer ground by the #2000 grinding wheel, an amorphous layer of about 30 nm thickness, a polycrystalline silicon layer, a few dislocations, and an elastic deformation layer exist. In general, with the decrease in grit size, the material removal mode changes from micro-fracture mode to ductile mode gradually.

关键词： silicon wafers grinding subsurface damage microstructure

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Fabrication and Characterization of FeNiCr Matrix-TiC Composite for Polishing CVD Diamond Film

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Journal of Materials Science & Technology 2009年第3期25卷 319-324页

作者： Zhuji Jin Zewei Yuan renke kang Boxian Dong Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education Dalian University of Technology Dalian 116024 China

Dynamic friction polishing （DFP） is one of the most promising methods appropriate for polishing CVD diamond film with high efficiency and low cost. By this method CVD diamond film is polished through being simply pressed against a metal disc rotating at a high speed utilizing the thermochemical reaction occurring as a result of dynamic friction between them in the atmosphere. However, the relatively soft materials such as stainless steel, cast iron and nickel alloy widely used for polishing CVD diamond film are easy to wear and adhere to diamond film surface, which may further lead to low efficiency and poor polishing quality. In this paper, FeNiCr matrix-TiC composite used as grinding wheel for polishing CVD diamond film was obtained by combination of mechanical alloying （MA） and spark plasma sintering （SPS）. The process of ball milling, composition, density, hardness, high-temperature oxidation resistance and wear resistance of the sintered piece were analyzed. The results show that TiC was introduced in MA-SPS process and had good combination with FeNiCr matrix and even distribution in the matrix. The density of composite can be improved by mechanical alloying. The FeNiCr matrix-TiC composite obtained at 1273 K was found to be superior to at 1173 K sinterin8 in hardness, high-temperature oxidation resistance and wearability. These properties are more favorable than SUS304 for the preparation of high-performance grinding wheel for polishing CVD diamond film.

关键词： CVD diamond film FeNiCr matrix-TiC composite Spark plasma sintering Mechanical alloying

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Effect of mechanical anisotropy on material removal rate and surface quality during polishing CdZnTe wafers

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Rare Metals 2011年第4期30卷 381-386页

作者： LI Yan JIE Wanqi kang renke GAO Hang State Key laboratory of Solidification Processing Northwestern Polytechnical University Xi＇an 710072 China Key Laboratory for Precision and Non-Traditional Machining Technology （Ministry of Education of China） Dalian University of Technology Dalian 116024 China

The mechanical characters of CdZnTe crystal were investigated by nanoscratch tests, and the effects of mechanical anisotropy on the material removal rate and surface quality were studied by polishing tests. There is a peak of frictional coefficient at the early stage of scratch, and increasing the vertical force will result in the increase of peak value correspondingly. The fluctuation phenomenon of frictional coefficient is generated at high vertical force. The lateral forces show the apparent twofold and threefold symmetries on （110） and （111） planes, respectively. To obtain high surface quality, low polishing pressure and hard direction （〈 T10 〉 directions on （110） plane and 〈 112 〉 directions on （111） plane） should be selected, and to achieve high material removal rate, high polishing pressure and soft direction （〈001〉 directions on （110） plane and 〈 121 〉 directions on （111） plane） should be selected.

关键词： cadmium compounds single crystals nanoscratch tests frictional coefficient material removal rate surface quality anisotropy

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Residual stress analysis on silicon wafer surface layers induced by ultraprecision grinding

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Rare Metals 2011年第3期30卷 278-281页

作者： ZHANG Yinxia WANG Dong GAO Wei kang renke School of Mechanical Engineering Zhengzhou University Zhengzhou 450001 China Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education Dalian University of Technology Dalian 116024 China

Grinding residual stresses of silicon wafers affect the performance of IC circuits. Based on the wafer rotation ultra-precision grinding ma-chine, the residual stress distribution along grinding marks and ground surface layer depth of the ground wafers are investigated using Raman microspectroscopy. The results show that the ground wafer surfaces mainly present compressive stress. The vicinity of pile-ups between two grinding marks presents higher a compressive stress. The stress value of the rough ground wafer is the least because the material is removed by the brittle fracture mode. The stress of the semi-fine ground wafer is the largest because the wafer surface presents stronger phase trans-formations and elastic-plastic deformation. The stress of the fine ground wafer is between the above two. The strained layer depths for the rough, semi-fine, and fine ground wafers are about 7.6 m, 2.6 m, and 1.1 m, respectively. The main reasons for generation of residual stresses are phase transformations and elastic-plastic deformation.

关键词： silicon wafers grinding residual stresses Raman spectroscopy

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Effects of Chloride Ion on the Texture of Copper and Cu-ZrB_(2) Coatings Electrodeposited from Copper Nitrate Solution in Different Plating Modes

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Journal of Materials Science & Technology 2006年第5期22卷 643-646页

作者： Dongming GUO Min ZHANG Zhuji JIN renke kang Key laboratory for Precision ＆ Non-traditional Machining of Ministry of Education Dalian University of TechnologyDalian 116023 China

For the first time, the texture of copper and Cu-ZrB2 coatings produced from copper nitrate solution was studied. Chloride ion shows different effects on the deposit texture under direct current （DC） and pulse current （PC） conditions. Copper deposits are strongly 〈220〉 textured in DC plating with and without chloride ion. While in PC condition, the predominant texture shifts from 〈220〉 to 〈200〉 as the chloride ion concentration exceeds 20 mg/l. The addition of ZrB2 particles enhances the cathodic polarization of copper deposition, which improves the growth of （111） plane. However, this improvement can be eliminated by further addition of chloride ion.

关键词： Texture Chloride ion Pulse plating Coatings

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Recent progress in flexible supporting technology for aerospace thin-walled parts:A review

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Chinese Journal of Aeronautics 2022年第3期35卷 10-26页

作者： Yan BAO Bin WANG Zengxu HE renke kang Jiang GUO Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education Dalian University of TechnologyDaliann 116024China

Thin-walled parts are widely used in the aerospace industry owing to their light weight and high specific ***,due to the low rigidity of thin-walled parts,elastic deformation and chatter easily occur,which seriously affect the machining accuracy and workpiece surface *** solve this problem,several supporting technologies have been reported in recent *** paper reviews the recent research progress of flexible supporting technologies in the aerospace field by classifying them based on different principles and *** principle,progress,advantages,and limitations of the technologies are expounded by systematic comparison and ***,the challenges and future development trends of flexible supporting technology,which will provide guidelines for further research,are discussed.

关键词： Aerospace Chatter Deformation Flexible support Low rigidity Thin-walled

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Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond

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Friction 2024年第6期12卷 1119-1132页

作者： Song YUAN Xiaoguang GUO Hao WANG renke kang Shang GAO State Key Laboratory of High-performance Precision Manufacturing Dalian University of TechnologyDalian 116024China

The roughness of the contact surface exerts a vital role in *** is still a significant challenge to understand the microscopic contact of the rough surface at the atomic ***,the rough surface with a special root mean square(RMS)value is constructed by multivariate Weierstrass–Mandelbrot(W–M)function and the rubbing process during that the chemical mechanical polishing(CMP)process of diamond is mimicked utilizing the reactive force field molecular dynamics(ReaxFF MD)*** is found that the contact area A/A0 is positively related with the load,and the friction force F depends on the number of interfacial bridge *** the surface roughness will increase the friction force and friction *** model with low roughness and high lubrication has less friction force,and the presence of polishing liquid molecules can decrease the friction force and friction *** RMS value and the degree of damage show a functional relationship with the applied load and lubrication,i.e.,the RMS value decreases more under larger load and higher lubrication,and the diamond substrate occurs severer damage under larger load and lower *** work will generate fresh insight into the understanding of the microscopic contact of the rough surface at the atomic level.

关键词： diamond random roughness reactive force field molecular dynamics(ReaxFF MD) friction Weierstrass-Mandelbrot(W-M)function chemical mechanical polishing(CMP)

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Pulse Plating of Copper-ZrB_(2) Composite Coatings

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Journal of Materials Science & Technology 2006年第4期22卷 514-518页

作者： Dongming GUO Min ZHANG Zhuji JIN renke kang Key laboratory for Precision ＆ Non-traditional Machining of Ministry of Education Dalian University of Technology Dalian 116023 China

Copper-zirconium diboride （ZrB2） composite coatings were fabricated using pulse plating technique to acquire a new type of EDM （electro-discharge machining） electrode material. The effects of pulse parameters, i.e., the average current density, the frequency and the duty cycle, on the incorporation of ZrB2 particles in the copper matrix were investigated. The amount＇of codeposited ZrB2 particles had a maximum at average current density of 3 A/din2 and increased with decreasing duty cycle as well as current frequency of the pulse current used for deposition. The hardness of the coatings increased with increasing ZrB2 percentage, whereas the incorporation of ZrB2 particles had little effect on the resistivity of the composites.

关键词： Pulse plating Codeposition Composite coatings

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