Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond
作者机构：State Key Laboratory of High-performance Precision ManufacturingDalian University of TechnologyDalian 116024China
出 版 物：《Friction》 (摩擦（英文版）)
年 卷 期：2024年第12卷第6期
页 面：1119-1132页
核心收录：
学科分类：08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程]
基 金：the National Key R&D Program of China(2022YFB3404304) the National Natural Science Foundation of China(No.5217052183)
主 题：diamond random roughness reactive force field molecular dynamics(ReaxFF MD) friction Weierstrass-Mandelbrot(W-M)function chemical mechanical polishing(CMP)
摘 要：The roughness of the contact surface exerts a vital role in *** is still a significant challenge to understand the microscopic contact of the rough surface at the atomic ***,the rough surface with a special root mean square(RMS)value is constructed by multivariate Weierstrass–Mandelbrot(W–M)function and the rubbing process during that the chemical mechanical polishing(CMP)process of diamond is mimicked utilizing the reactive force field molecular dynamics(ReaxFF MD)*** is found that the contact area A/A0 is positively related with the load,and the friction force F depends on the number of interfacial bridge *** the surface roughness will increase the friction force and friction *** model with low roughness and high lubrication has less friction force,and the presence of polishing liquid molecules can decrease the friction force and friction *** RMS value and the degree of damage show a functional relationship with the applied load and lubrication,i.e.,the RMS value decreases more under larger load and higher lubrication,and the diamond substrate occurs severer damage under larger load and lower *** work will generate fresh insight into the understanding of the microscopic contact of the rough surface at the atomic level.
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