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Nonlinear temperature characteristic of thermal expansion of Grf/Mg composites

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Transactions of Nonferrous Metals Society of China 2009年第S02期19卷 382-386页

作者： SONG Mei-hui xiu zi-yang WU Gao-hui CHEN Guo-qin School of Materials Science and Engineering Harbin Institute of TechnologyHarbin 150001China

Graphite fiber reinforced magnesium matrix(Grf/Mg)composites were fabricated by squeeze casting technology.M40 graphite fibers were reinforced to AZ91D and ZM6,their thermal expansion behaviors of M40/AZ91D and M40/ZM6 composites in the temperature range from 20 to 490℃were *** results show that the interfacial species and thermal stress have significant influence on the thermal expansion behavior of the ***,the longitudinal coefficient of thermal expansion of Grf/Mg composites are affected by the thermal stress,interfacial species and yield strength of matrix alloy,it also decreases with increasing temperature and descending rate of longitudinal coefficient of thermal expansion(CTEs)of Grf/Mg composites changed in different temperature *** terms of different descending rates,the curve of coefficient of thermal expansion vs temperature can be divided into three *** matrix alloys M40/AZ91D and M40/ZM6 yield at 170 and 155℃in the thermal expansion,respectively.

关键词： magnesium matrix composites thermal expansion interface thermal stress

Effects of extrusion deformation on mechanical properties of sub-micron Si_(3)N_(4p)/2024 composite

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Transactions of Nonferrous Metals Society of China 2009年第S02期19卷 373-377页

作者： xiu zi-yang CHEN Guo-qin LIU Yan-mei yang Wen-shu WU Gao-hui Academy of Fundamental and Interdisciplinary Sciences Harbin Institute of TechnologyHarbin 150001China School of Materials Science and Engineering Harbin Institute of TechnologyHarbin 150001China

Si_(3)N_(4p)/2024Al composite was fabricated by squeeze casting method and treated by extrusion *** analyses indicate that Si_(3)N_(4) particles in the composite are in cylindrical polyhedron *** deformation is beneficial to uniform distribution of Si_(3)N_(4) particles and improves the relative density of Si_(3)N_(4p)/2024Al *** strength of Si_(3)N_(4p)/2024Al composite increases by 76.6%after T6 treatment,and after extrusion and T6 treatment it is by 57.6%more than T6 treatment *** modulus of Si_(3)N_(4p)/2024Al composite increases a little after T6 treatment but increases by 33.5%after extrusion deformation.

关键词： Si_(3)N_(4p)/2024Al composite extrusion deformation mechanical properties

Fabrication and thermo-physical properties of TiB_(2p)/Cu composites for electronic packaging applications

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Transactions of Nonferrous Metals Society of China 2009年第S02期19卷 448-452页

作者： CHEN Guo-qin xiu zi-yang MENG Song-he WU Gao-hui ZHU De-zhi School of Materials Science and Engineering Harbin Institute of TechnologyHarbin 150001China Academy of Fundamental and Interdisciplinary Sciences Harbin Institute of TechnologyHarbin 150001China Center for Composite Materials Harbin Institute of TechnologyHarbin 150001China

TiB_(2p)/Cu composites with high reinforcement content(φ_(p)=50%,58%and 65%)for electronic packaging applications were fabricated by squeeze casting *** microstructures and thermo-physical properties of the TiB_(2p)/Cu composites were *** results show that TiB2 particles are homogeneous and distribute uniformly,and the TiB2-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers,the densifications of the TiB_(2p)/Cu composites are higher than 98.2%. The mean linear coefficients of thermal expansion at 20-100℃for TiB_(2p)/Cu composites range from 8.3×10^(-6)to 10.8×10^(-6)/K and decrease with increasing volume fraction of *** experimental coefficients of thermal expansion agree well with the predicted values based on Turner’s *** thermal conductivities of TiB_(2p)/Cu composites range from 167.3 to 215.4 W/(m·K),decreasing with increasing volume fraction TiB2.

关键词： TiB_(2p)/Cu composites densification coefficient of thermal expansion thermal conductivity

Properties of the Environmental-Friendly Si/Al Composite for Electronic Packages Fabricated by Squeeze Casting Technology

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上海交通大学学报 2007年第S2期41卷 144-149页

作者：武高辉修子扬张强 School of Materials Science and Eng. Harbin Institute of Technology

High reinforcement-content aluminum matrix composite,with a high thermal conductivity,the adjustable coefficient of thermal expansion(CTE),low density and costs,have been extensively applied in electronic *** Sip/Al composites were fabricated by squeeze casting *** microstructure observation showed that the composites were dense and macroscopically homogeneous,with no micro-holes and obvious *** linear CTEs of Sip/Al composites lay between(7.6～8.1)×10^-6 ℃^-1,and the thermal conductivity was larger than 100 W/(m·℃).The composites also had lower density(2.4 g/cm^3),higher special strength and special *** electroless nickel method was used to deposit a continuous and uniform layer on the composites surface,which can meet the reliability testing demands of the diodes with Sip/Al composite baseplate.

关键词： Si particles aluminum matrix composite thermal expansion thermal conductivity

环境友好型Si_p/LD11复合材料的显微组织及性能

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中南大学学报（自然科学版） 2006年第6期37卷 1060-1064页

作者：修子扬武高辉张强宋美慧哈尔滨工业大学材料科学与工程学院黑龙江哈尔滨150001

选用粒径为20μm的高纯Si粉,采用挤压铸造方法制备Si体积分数为65%的Sip/LD11复合材料。研究结果表明:复合材料组织致密,颗粒分布均匀;透射电镜观察发现,在Si颗粒内部存在高密度的层错,同时还存在孪晶和位错;Si-Al界面结合状况良好,无... 详细信息

选用粒径为20μm的高纯Si粉,采用挤压铸造方法制备Si体积分数为65%的Sip/LD11复合材料。研究结果表明:复合材料组织致密,颗粒分布均匀;透射电镜观察发现,在Si颗粒内部存在高密度的层错,同时还存在孪晶和位错;Si-Al界面结合状况良好,无界面反应物;LD11铝合金中存在位错和析出的共晶Si;复合材料具有低密度(2.4 g/cm3),低热膨胀系数(8.1×10-6/K),高热导率(161.3 W/(m.K))的特性,可以通过退火处理进一步降低其热膨胀系数,提高热导率。该材料具有较好的力学性能。

关键词： Si/Al复合材料显微组织热膨胀热导率力学性能

Sip／Al复合材料中的界面和硅相形貌的演变

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中国有色金属学报 2009年第3期19卷 477-483页

作者：王小锋武高辉修子扬彭超群中南大学材料科学与工程学院长沙410083 哈尔滨工业大学材料科学与工程学院哈尔滨150001

采用金相显微镜、透射电子显微镜和高分辨电镜等手段,研究不同高温真空热处理工艺条件下,高体积分数Sip/Al复合材料(φ(Si)=65%)中硅铝界面特征与硅相形貌的演变过程。结果表明:热处理过程中硅相形貌演变为尖角钝化的颗粒状、球化的孤... 详细信息

采用金相显微镜、透射电子显微镜和高分辨电镜等手段,研究不同高温真空热处理工艺条件下,高体积分数Sip/Al复合材料(φ(Si)=65%)中硅铝界面特征与硅相形貌的演变过程。结果表明:热处理过程中硅相形貌演变为尖角钝化的颗粒状、球化的孤岛颗粒状和三维网络结构状。基于扩散理论将硅相形貌的演变分为3个阶段:不规则形状硅颗粒的尖角逐渐溶解到铝合金中,发生颗粒的钝化现象;较小硅颗粒周围逐渐溶解在铝合金中的硅在浓度梯度的作用下,通过扩散逐渐在较大硅颗粒周围析出并长大;长大的硅颗粒互相接触联结,形成网状结构。铸态Sip/Al复合材料中Si-Al界面平直,干净,无析出物,同时存在大量位错;高温热处理后的Si-Al界面变得圆滑,界面附近有细小的硅相析出物存在,几乎不存在位错。

关键词： Sip/Al复合材料硅相形貌演变界面析出相

Clinicopathological differences between patients with schistosomal appendicitis and non schistosomal appendicitis:A retrospectively study of past ten years

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World Journal of Clinical Cases 2025年第2期13卷 24-32页

作者： Xiao-Yi Wang Yao Hao zi-Jian Wang xiu-Liang Xu Jiang-Hua yang Department of Infectious Diseases The First Affiliated of Wannan Medical CollegeWuhu 241001Anhui ProvinceChina

BACKGROUND Chronic schistosomiasis causes multiple organ and multiple system diseases,especially the digestive *** eggs are mainly deposited in the stomach,liver and colorectal,but a few eggs are deposited in the appendix and cause *** present,there are few studies on schistosomal *** To explore the differences in epidemiological,clinical and pathological characteristics between schistosomal appendicitis and non-schistosomal appendicitis over the past decade in order to assess the impact of schistosomiasis on *** The differences of general data,clinical data and laboratory examination data of patients with appendicitis from October 2013 to October 2023 were retrospectively *** patients were divided into two groups for *** were 136 patients in schistosomal appendicitis group and 5418 patients in non-schistosomal appendicitis *** Schistosomal appendicitis accounted for 2.45%of all patients with appendicitis,and the annual proportion in the past decade was 2.2%,2.9%,1.8%,1.9%,3.4%,3.1%,1.9%,1.6%,3%,2.6%,*** prevalence of schistosomal appendicitis was middle-aged and elderly males,with an average age of 61.73±15.335 *** main population of non-schistosomal appendicitis was middle-aged men,with an average age of 35.8±24.013 years(P<0.001).The distribution of pathological types of appendicitis was different between the two groups(P<0.001).The incidence of acute suppurative appendicitis in non-schistosomal appendicitis was higher than that in schistosomal appendicitis[odds ratio(OR)=0.504;95%confidence interval(CI):0.349-0.728;P<0.001].The proportion of acute attack of chronic appendicitis in schistosomal appendicitis was higher than that in non-schistosomal appendicitis(OR=2.614;95%CI:1.815-3.763;P<0.001).The proportion of schistosomal appendicitis patients complicated with colorectal cancer was higher than that of nonschistosomal appendicitis patients(OR=5.087;95%CI:1.427-

关键词： Schistosomal appendicitis Schistosomiasis Appendix Colorectal cancer Clinicopathological characteristics

增强体含量对Si_p/LD11复合材料热物理性能影响

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材料科学与工艺 2005年第2期13卷 171-174页

作者：修子扬宋美慧孙东立张强武高辉哈尔滨工业大学材料科学与工程学院黑龙江哈尔滨150001

为研究增强体含量对电子封装用Si颗粒增强铝基复合材料热物理性能的影响,采用挤压铸造法制备了以高纯Si粉为增强体,LD11铝合金为基体,体积分数分别为55%、60%和65%的3种复合材料.利用金相显微镜、热膨胀分析仪、热导率测试仪等多种手段... 详细信息

为研究增强体含量对电子封装用Si颗粒增强铝基复合材料热物理性能的影响,采用挤压铸造法制备了以高纯Si粉为增强体,LD11铝合金为基体,体积分数分别为55%、60%和65%的3种复合材料.利用金相显微镜、热膨胀分析仪、热导率测试仪等多种手段对复合材料的微观组织及热物理性能进行了研究,并对试验结果进行数值模拟.显微组织观察表明,复合材料的铸态组织均匀、致密.通过改变复合材料增强体的含量,复合材料的热膨胀系数介于(8.1～12)×10-6/℃之间可调,热导率大干87.7W/m·℃,满足电子封装用材料的要求.Sip/LD11复合材料的热膨胀系数介于Rom模型和Turnet模型之间,Kerner模型能够更好地预测Sip/LD11复合材料的热膨胀系数.热导率计算结果均大于测试值.

关键词： Si颗粒铝基复合材料热膨胀热导率电子封装

环保型电子封装用Sip/Al复合材料性能研究

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材料科学与工艺 2006年第3期14卷 244-246,250页

作者：武高辉修子扬孙东立张强宋美慧哈尔滨工业大学材料科学与工程学院黑龙江哈尔滨150001

为研究电子封装用Sip／Al复合材料热物理及力学性能，利用挤压铸造方法制备了体积分数为65％的Sip／LDll（A1—12％Si）可回收环保型复合材料．采用TEM观察、膨胀仪、激光导热综合测试仪以及万能电子拉伸试验机等设备及技术对复合材料... 详细信息

为研究电子封装用Sip／Al复合材料热物理及力学性能，利用挤压铸造方法制备了体积分数为65％的Sip／LDll（A1—12％Si）可回收环保型复合材料．采用TEM观察、膨胀仪、激光导热综合测试仪以及万能电子拉伸试验机等设备及技术对复合材料进行研究．结果表明：Sip／LDll复合材料组织致密，材料中未观察到孔洞和缺陷；20～50℃时复合材料的热膨胀系数为8．1X10^-6／℃，并随着温度的升高而增加，退火处理能够降低复合材料的热膨胀系数；Sip／LDll复合材料铸造状态和热处理状态的热导率分别为132．9、160．1w／m·℃，复合材料的弯曲强度和比模量较高；可以采用化学镀方法在复合材料表面涂覆M层，镀层结合强度良好，是一种优异的电子封装用复合材料．

关键词： Si 铝基复合材料热导率热膨胀电子封装