Microstructure and thermal conductivity of submicron Si_(3)N_(4) reinforced 2024Al composite

作     者：YANG Wen-shu XIU Zi-yang CHEN Guo-qin WU Gao-hui 杨文澍;修子扬;陈国钦;武高辉

作者机构：School of Materials Science and EngineeringHarbin Institute of TechnologyHarbin 150001China 

出 版 物：《Transactions of Nonferrous Metals Society of China》 (中国有色金属学报（英文版）)

年 卷 期：2009年第19卷第S02期

页      面：378-381页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：Project(2003AA305110)supported by the Hi-tech Research and Development Program of China 

主　　题：composite interface thermal conductivity calculation submicron particles 

摘      要：An 2024Al matrix composite reinforced with 36%(volume fraction)β-Si_(3)N_(4) particles was fabricated by pressure infiltration method,and its microstructure and the effect of annealing treatment on thermo-conductivity were ***_(3)N_(4) particles distribute uniformly without any particle clustering and no apparent particle porosity or significant casting defects are observed in the *** combination of particles and matrix is *** raw Si_(3)N_(4) particles are regular cylindrical polyhedron with flat surface and change to serrated surface in composite due to reactions during *** conductivity of as-cast Si_(3)N_(4)p/2024 composite is 90.125 W/(m·K)at room temperature,and increases to 94.997 W/(m·K)after annealing treatment. The calculated results of thermal conductivity of the Si_(3)N_(4p)/Al composite by Maxwell model,H-S model and PG model are lower than experimental results while that by ROM model is higher.