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Local High-Frequency Heating in Electronics Technology

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Journal of Electronic Research and Application 2019年第4期3卷 1-6页

作者： vladimir L.lanin Electronic Technique and Technology Department Belarus State University of Informatics and RadioelectronicsMinskBelarus

Modeling and investigation of HF electromagnetic heating in induction devices with unclosed magnetic circuit has allowed to optimize heating speed in local zones of formation of soldering connections and to improve their quality due to joint action of superficial effects and electromagnetic *** all magnetic materials is nonlinear decrease in heating power depending on frequency of *** the optimal parameters of HF heating for soldering electronics modules by inductor with open-ended magnetic conductor.

关键词： Induction heating High-frequency Electronics technology

High-Frequency Heating for Soldering in Electronics

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Circuits and Systems 2012年第3期3卷 238-241页

作者： vladimir L. lanin Electronic Technique and Technology Department Belarus State University of Informatics and Radioelectronics Minsk Belarus

Processes of high-frequency (HF) heating are examined and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating are the following: selectivity by skin-effect;high density of energy;process- ing in any environment, including vacuum or inert gas;high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections. Investigation of HF electromagnetic heating has allowed to optimize heating speed in local zones of soldering connections formation and to improve their quality due to joint action of superficial effects and electromagnetic forces.

关键词： HF Heating Inductor Soldering Electronic Modules

Increase Activity Cavitations in Liquids and Melts at Ultrasonics Processing

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Open Journal of Acoustics 2013年第3期3卷 13-15页

作者： vladimir L. lanin Department of Electronic Technique and Technology University of Informatics and Radioelectronics Minsk Belarus

Increase of efficiency of cavitation processes in liquids and melts is reached by gas cavities saturation with the sizes not exceeding the resonant sizes of cavitation germs. Gas saturation of liquids and melts raises... 详细信息

关键词： Ultrasonic Cavitation Gas Cavities Liquids Melts

Increase Ultrasonics Cleaning Efficiency of Electronics Modules

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Engineering（科研） 2013年第2期5卷 191-195页

作者： vladimir L. lanin vladimir S. Tomal 不详

The new approach is offered for the cleaning applications of electronics modules. The modular systems of the distributed ultrasonics converters, which are established in chessboard order, provide the uniformity cavitation fields in ultrasonic bath. The effect of periodic deviation of ultrasonics frequency created the directed acoustic currents in the liquid, witch increase removal pollution process. The technological parameters of automated ultrasonics cleaning lines as concentration SAS, temperature of washing solutions, and ultrasonics cavitation power are optimized.

关键词： Ultrasonics Cleaning Electronics Modules Cavitation Fields

New Generation Semi-Automatic Thermosonic Wire Bonder

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Journal of Electronic Research and Application 2022年第6期6卷 1-8页

作者： Igor Petuhov vladimir lanin OJSC“Planar-SO” Minsk 220033Belarus Belorussian State University of Informatics and Radioelectronics Minsk 220013Belarus

The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are *** video camera and the pattern recognition system(PRS)of new bonder helps to provide accurate positioning of the bonding tool on the chip pads of integrated *** formation of the loop wire cycle is ensured by the synchronous movement of the bonding head along the Z axis and the working table along the XY axes based on the servo drive.A feature of the bonder is that it can bond all the wire loops of the electronic device according to the pre-recorded program without needing to align the bonding points.

关键词： High frequency ultrasonic Gold wire bonding Ball formation Bonding tool Matching parts of ultrasonic transducer

Improving the Efficiency of Induction Heating in the Air Gap of the Magnetic Circuit

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Journal of Electronic Research and Application 2020年第4期4卷 1-4页

作者： vladimir L.lanin Evgeniy Ratnikau Alexander D.Hatskevich Electronic Technique and Technology Department Belarus State University of Informatics and RadioelectronicsMinskBelarus

Improving the efficiency of induction heating of parts in the air gap of the magnetic circuit is associated with the use of surface and edge *** modeling in ANSYS Electromagnetics Suite 19.2 and experimental studies identified patterns of edge effect in the heated *** ensure the uniformity of induction heating of small parts and reduce the soldering time,the electrical switch of soldered parts is used,which with the help of device controller forms a secondary circuit with low electrical resistance and high density of eddy currents.

关键词： Induction heating The gap of the magnetic circuit Edge effect Secondary circuit