New Generation Semi-Automatic Thermosonic Wire Bonder

作     者：Igor Petuhov Vladimir Lanin 

作者机构：OJSC“Planar-SO”Minsk 220033Belarus Belorussian State University of Informatics and RadioelectronicsMinsk 220013Belarus 

出 版 物：《Journal of Electronic Research and Application》 (电子研究与应用)

年 卷 期：2022年第6卷第6期

页      面：1-8页

学科分类：08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：The 2019 Ministry of Education industry-university cooperation collaborative education project“Research on the Construction of Economics and Management Professional Data Analysis Laboratory”(Project number:201902077020) 

主　　题：High frequency ultrasonic Gold wire bonding Ball formation Bonding tool Matching parts of ultrasonic transducer 

摘      要：The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are *** video camera and the pattern recognition system(PRS)of new bonder helps to provide accurate positioning of the bonding tool on the chip pads of integrated *** formation of the loop wire cycle is ensured by the synchronous movement of the bonding head along the Z axis and the working table along the XY axes based on the servo drive.A feature of the bonder is that it can bond all the wire loops of the electronic device according to the pre-recorded program without needing to align the bonding points.