检索结果-南通市图书馆

Journal of Materiomics 2023年第5期9卷 899-909页

作者： Nuur Syahidah Sabran Iman Aris Fadzallah Mohd Faizul Mohd Sabri takahito ono Department of Mechanical Engineering Faculty of EngineeringUniversiti Malaya50603Kuala LumpurMalaysia Centre for Energy Sciences Universiti Malaya50603Kuala LumpurMalaysia Department of Mechanical System Engineering Graduate School of EngineeringTohoku UniversitySendai980-8579Japan

Doped/filled skutterudites are much studied materials due to their excellent thermoelectric ***,their synthesis and preparation is *** work synthesized indium(In)doped cobalt triantimonide(CoSb_(3))skutterudite thick films using a facile electrochemical deposition technique through chronoamperometric steps for 2 *** nominal composition of In element is found in the range of 0.55e0.23 for a stoichiometric condition of In doped CoSb_(3)thick *** early crystal growth of In doped films shows instantaneous nucleation and is controlled by the charge transfer process with diffusion coefficient,D of 10^(-5)cm^(2)/*** incorporation of In into the interstitial sites of CoSb_(3)cages is evident from the lattice constant(a)expansion as observed in *** optimum Seeback coefficient(S)of the 0.5 mmol In doped CoSb_(3)thick film is89.84 mV/K at 282 K,due to an increase in the carrier concentration(n~10^(20)cm^(-3)).The negative S is due to the electron donor behaviour of the ***,high electrical conductivity,s value(14.26 kS/m)contributes to a power factor(S2s)increment of 115.11 mW/(m$K2).The result shows a promising thermoelectric property of doped skutterudite synthesized by electrochemical deposition technique.

关键词： Indium Electrochemical deposition Thermoelectric Thick film Skutterudites

Micro-nano electromechanical system by bulk silicon micromachining

在线全文

维普期刊数据库

学校读者我要写书评

暂无评论

光学精密工程 2002年第6期10卷 608-613页

作者： Masayoshi Esashi takahito ono New Industry Creation Hatchery Center (NICHe) Graduate School of EngineeringTohoku University Sendai Tohoku University 980-8579

MEMS (micro Electro Mechanical System) based on semiconductor microfabrication plays important roles for example in the periphery of IT systems. NEMS (Nano ElectroMechanical System) contains nano-scale structures. Sophisticated and high performance systems based on the MEMS and the NEMS have been developed. Packaging and electrical interconnection play an important role in realizing practically applicable systems.

关键词：微纳电械系统 MEMS 体硅微加工工艺

维普期刊数据库

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

在线全文

学校读者我要写书评

暂无评论

Microsystems & Nanoengineering 2023年第2期9卷 1-22页

作者： Zihao Dong Qipei He Dawei Shen Zheng Gong Deyuan Zhang Wenqiang Zhang takahito ono Yonggang Jiang Institute of Bionic and Micronano Systems School of Mechanical Engineering and AutomationBeihang UniversityBeijing 100191China College of Engineering China Agricultural UniversityBejing 100083China Graduate School of Engineering Tohoku University6-6-01 Aramaki-Aza-AobaAoba-kuSendai980-8579Japan

Polyimides are widely used in the MEMS and flexible electronics fields due to their combined physicochemical properties,including high thermal stability,mechanical strength,and chemical resistance *** the past decade,rapid progress has been made in the microfabrication of ***,enabling technologies,such as laser-induced graphene on polyimide,photosensitive polyimide micropatterning,and 3D polyimide microstructure assembly,have not been reviewed from the perspective of polyimide *** aims of this review are to systematically discuss polyimide microfabrication techniques,which cover flm formation,material conversion,micropatterning,3D microfabrication,and their *** an emphasis on polyimide-based flexible MEMS devices,we discuss the remaining technological challenges in polyimide fabrication and possible technological innovations in this field.

关键词： field polyimide fabrication

Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications

在线全文

维普期刊数据库

学校读者我要写书评

暂无评论

Microsystems & Nanoengineering 2019年第1期5卷 481-491页

作者： Zhonglie An Jinhua Li Akio Kikuchi Zhuqing Wang Yonggang Jiang takahito ono Graduate School of Engineering Tohoku UniversityAramaki-Aza-Aoba 6-6-01Aoba-kuSendai 980-8579Japan Research Institute for Engineering and Technology Tohoku Gakuin UniversityTagajo 985-8537Japan School of Mechanical Engineering and Automation Beihang UniversityBeijing 100191PR China Department of Mechanical Systems Engineering Tokyo University of Agriculture and TechnologyKoganei 184-8588Japan

High-density integration technologies with copper(Cu)through-silicon via(TSV)have emerged as viable alternatives for achieving the requisite integration densities for the portable electronics and micro-electro-mechanical systems(MEMSs)***,significant thermo-mechanical stresses can be introduced in integrated structures during the manufacturing process due to mismatches of thermal expansion and the mechanical properties between Cu and silicon(Si).The high-density integration demands an interconnection material with a strong mechanical strength and small thermal expansion *** this study,a novel electroplating method is developed for the synthesis of a graphene-copper(G-Cu)composite with electrochemically exfoliated *** fabrication and evaluation of the G-Cu composite microstructures,including the microcantilevers and micromirrors supported by the composite,are *** evaluated not only the micromechanical properties of the G-Cu composite based on in-situ mechanical resonant frequency measurements using a laser Doppler vibrometer but also the coefficients of thermal expansion(CTE)of the composite based on curvature radius measurements at a temperature range of 20–200℃.The Young’s modulus and shear modulus of the composite are approximately 123 and 51 GPa,which are 1.25 times greater and 1.22 times greater,respectively,than those of pure Cu due to the reinforcement of *** G-Cu composite exhibits a 23%lower CTE than Cu without sacrificing electrical *** results show that the mechanically strengthened G-Cu composite with reduced thermal expansion is an ideal and reliable interconnection material instead of Cu for complex integration structures.

关键词： composite expansion thermal

基于电磁驱动及磁电/电容检测的硅谐振式双轴角速率传感器设计和测试(英文)

在线全文

维普期刊数据库

学校读者我要写书评

暂无评论

纳米技术与精密工程 2013年第5期11卷 430-435页

作者：罗彪 Esashi Masayoshi Ikeue Naokatsu Tanaka Shuji ono takahito 吴英日本东北大学工学部

本文介绍了一种MEMS角速率传感器的设计、制作和测试.该传感器采用硅梁作为支撑和震动的结构.电磁力在驱动模式中被用来激励质量块做往复运动.驱动模式的频率被设计为5 955.38 Hz.针对另外两个轴向的角速率检测,设计检测模式的频率分别... 详细信息

本文介绍了一种MEMS角速率传感器的设计、制作和测试.该传感器采用硅梁作为支撑和震动的结构.电磁力在驱动模式中被用来激励质量块做往复运动.驱动模式的频率被设计为5 955.38 Hz.针对另外两个轴向的角速率检测,设计检测模式的频率分别为6 151.01 Hz和6 591 Hz.质量块在驱动模式下的最大位移被设计为20μm.在器件的制作过程中使用了湿法刻蚀、电子束蒸发、阳极键合、等离子体增强化学气相沉淀(PECVD)、lift-off、感应耦合等离子体活性离子蚀刻(ICP-RIE)等MEMS工艺.质量块的尺寸是1 440μm×1 400μm×33.6μm,硅梁的设计尺寸分别为10μm×562.5μm×33.6μm,10μm×532.5μm×33.6μm,芯片的外形尺寸是3 127μm×3 069μm.为了进行器件测试,搭建了真空测试平台.测试结果表明,驱动模式下器件的谐响应频率为9 609 Hz,使用磁电检测的模式其谐响应频率为9 605 Hz.器件中电容检测需要特殊的电路,该电路目前正在搭建中.分析发现实测结果与模拟仿真结果的差异在于加工过程中产生的误差.

关键词：角速率传感器电磁电容检测 MEMS制作

维普期刊数据库

A preliminary study on rectal dose reduction associated with hyaluronic acid implantation in brachytherapy for prostate cancer

在线全文

学校读者我要写书评

暂无评论

Asian Journal of Urology 2024年第2期11卷 286-293页

作者： Tairo Kashihara Yuka Urago Hiroyuki Okamoto Mihiro Takemori Hiroki Nakayama Shohei Mikasa Tetsu Nakaichi Kotaro Iijima takahito Chiba Junichi Kuwahara Satoshi Nakamura Weishan Chang Yoshiyuki Matsui Hiroshi Igaki Department of Radiation Oncology National Cancer Center Hospital5-1-1 TsukijiChuo-kuTokyoJapan Radiation Safety and Quality Assurance Division National Cancer Center Hospital5-1-1 TsukijiChuo-kuTokyoJapan Department of Radiological Sciences Graduate School of Human Health SciencesTokyo Metropolitan University7-2-10 Higashi-OguArakawa-kuTokyoJapan Department of Radiological Technology National Cancer Center Hospital5-1-1 TsukijiChuo-kuTokyoJapan Department of Urological Oncology National Cancer Center Hospital5-1-1 TsukijiChuo-kuTokyoJapan

Objectives: Hydrogel spacer (HS) was developed to reduce rectal toxicities caused by radiotherapy, but has been reported to cause major adverse events. Our institute has attempted to introduce a hyaluronic acid (HA) as an alternative spacer. This study aimed to compare rectal doses and geometric distributions between the HS and HA implantation in prostate ***: HS and HA were inserted in 20 and 18 patients undergoing high-dose brachytherapy, respectively. The rectum spacer volumes injected were 10 mL and 22 mL, respectively. In the treatment planning system, 13.5 Gy was administered with common catheter positions. The rectal dose indices were assessed between the spacer groups for dosimetry evaluation. Distances between the prostate and rectum and configurations of the spacers were ***: The mean doses irradiated to 0.1 and 2 mL of the rectum were 10.45 Gy and 6.71 Gy for HS, and 6.73 Gy and 4.90 Gy for HA (p<0.001). The mean minimum distances between the prostate and rectum were 1.23 cm and 1.79 cm for HS and HA, respectively (p<0.05). Geometrical configuration comparisons revealed that HA has a higher ability to expand the space than ***: The rectal dose reduction ability of HA is significantly greater than that of HS, suggesting its potential as a new spacer.

关键词： Brachytherapy Hyaluronicacid Hydrogel Prostaticneoplasm Radiotherapy

在线全文

维普期刊数据库

学校读者我要写书评

暂无评论

MRI微型RF接收线圈的设计与制作

半导体光电 2006年第5期27卷 556-559页

作者：吴英江永清周兆英田中小野江刺正喜重庆科技学院重庆光电技术研究所东北大学工学部

基于MEMS深刻蚀技术和微电镀工艺,介绍了一种用于核磁共振成像(MRI)系统的微型射频(RF)接收线圈的设计与微加工制作方法,研制出了线圈内径为100μm,线圈厚度200μm,线圈宽度30μm,深宽比大于6,品质因数为4的微型金属螺旋线圈。实验结果... 详细信息

基于MEMS深刻蚀技术和微电镀工艺,介绍了一种用于核磁共振成像(MRI)系统的微型射频(RF)接收线圈的设计与微加工制作方法,研制出了线圈内径为100μm,线圈厚度200μm,线圈宽度30μm,深宽比大于6,品质因数为4的微型金属螺旋线圈。实验结果表明,该制作工艺可为高深宽比的金属微结构的研制和核磁共振成像系统微型化提供新的方法和支持。

关键词：微型RF接收线圈核磁共振成像传感器高深宽比微机电系统

在线全文

同方期刊数据库

学校读者我要写书评

暂无评论

金属三维微结构加工技术的研究

仪表技术与传感器 2006年第1期 8-9+20页

作者：吴英周兆英江永清向毅小野崇人清华大学精密测试技术及仪器国家重点实验室中电集团电子44所 3. 重庆科技学院 4. 日本东北大学工学部机械知能系

三维微结构制作技术是MEMS加工的关键技术之一。现有的三维微细加工技术主要有利用SU-8等光刻胶形成的以IC工艺为基础的硅三维微结构制作技术和以同步辐射X射线曝光为基础的LIGA技术。但是,在传统的去胶液中,SU-8光刻胶会膨胀变形,从而... 详细信息

三维微结构制作技术是MEMS加工的关键技术之一。现有的三维微细加工技术主要有利用SU-8等光刻胶形成的以IC工艺为基础的硅三维微结构制作技术和以同步辐射X射线曝光为基础的LIGA技术。但是,在传统的去胶液中,SU-8光刻胶会膨胀变形,从而可能导致图形的失败。而LIGA技术需要昂贵的同步辐射光源和特制的LIGA掩模板,加工周期长。为此,基于反应离子深刻蚀技术,结合电镀工艺,提出了一种金属微结构的微加工制作方法,并进行了相应的实验。结果表明,该方法不仅可以制造出深宽比为6的微型金属螺旋线圈,还可以为其他非硅三维微结构的加工提供一定的技术支持。

关键词： MEMS 微加工反应离子刻蚀电镀金属微结构

Small-scale analysis of brittle-to-ductile transition behavior in pure tungsten

在线全文

同方期刊数据库

学校读者我要写书评

暂无评论

Journal of Materials Science & Technology 2022年第10期105卷 242-258页

作者： Yeonju Oh Won-Seok Ko Nojun Kwak Jae-il Jang takahito Ohmura Heung Nam Han Department of Materials Science and Engineering&Research Institute of Advanced Materials Seoul National UniversitySeoul 08826South Korea School of Materials Science and Engineering University of UlsanUlsan 44610South Korea Division of Materials Science and Engineering Hanyang UniversitySeoul04763South Korea National Institute for Materials Science 1-2-1 SengenTsukubaIbaraki 305-0047Japan

Tungsten as a material exhibits broad and increasingly important applications;however,the characterization of its ductile-to-brittle transition(BDT)is currently limited to large-scale scenarios and destructive *** this study,we overcome this challenge by implementing small-scale techniques to provide a comprehensive understanding of the BDT behavior of pure *** order to predict the failure mode at various temperature ranges,the practical fracture analysis diagram has been proposed to describe the resistance to shear flow and cracking behavior with *** temperature nano-indentation tests have provided the inherent mechanical responses corresponding to the maximum shear stress at various temperatures,which is required for dislocation activities in an atomic scaled activation *** one hand,atomistic simulations have provided the temperature dependence of brittle fracture stress,where the atomic bonds break due to intergranular or intragranular *** considered four tungsten specimens having various microstructures prepared using different processing conditions of cold-rolling and post-annealing,and their BDT ranges were inferred using the obtained fracture analysis diagram with the statistical data *** fracture analysis diagram of each specimen obtained were compared with the direct observation of fracture responses in macroscopic mechanical tests,which conclusively indicated that the small-scale inherent mechanical properties are greatly relevant to the macroscopic BDT behavior in pure *** on the BDT estimations by small-scale characterization,we provided further insights into the factors affecting the BDT behavior of tungsten,focusing on the contributions of different types of dislocations.

关键词： Brittle-to-ductile transition Nano-indentation Molecular dynamics Dislocation Tungsten

维普期刊数据库

Negative refraction of deep water waves through water channel network

在线全文

学校读者我要写书评

暂无评论

Journal of Hydrodynamics 2019年第4期31卷 840-847页

作者： takahito Iida Masashi Kashiwagi Department of Naval Architecture and Ocean Engineering Osaka University Suita Osaka 5650871 Japan Research Fellow of Japan Society for the Promotion of Science Chiyoda-ku Tokyo 1020083 Japan

A design method of a negative refractive index for free surface water waves in deep water is presented. To obtain a condition of a negative index, an analogy between water waves in a water channel and electric waves in an electric circuit is employed. An analytical solution of waves around a periodic array of rectangular columns is obtained by a circuit analysis. Attention is not focused on columns but a space among columns, and then the space is regarded as the water channel. Therefore, the circuit analysis can be applied to water waves. One channel is treated as a unit structure and a number of channels are periodically cascaded as a network. The negative refraction and backward waves by a network of the water channels are shown. Since the negative refraction might occur even around simple periodic structures, it is meaningful to understand wave phenomenon around offshore structures and develop innovative technology.

关键词： Negative refractive index backward wave water channel network equivalent circuit deep water