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Ultralow-crosstalk,strictly non-blocking microring-based optical switch

Photonics Research 2019年第2期7卷 155-161页

作者： QIXIANG CHENG LIANG YUAN DAI NATHAN C.ABRAMS YU-HAN HUNG padraic E.morrissey MADELEINE GLICK PETER O’BRIEN KEREN BERGMAN Department of Electrical Engineering Columbia UniversityNew York Tyndall National Institute University College Cork

We report on the first monolithically integrated microring-based optical switch in the switch-and-select architecture. The switch fabric delivers strictly non-blocking connectivity while completely canceling the first-order crosstalk. The 4 × 4 switching circuit consists of eight silicon microring-based spatial(de-)multiplexers interconnected by a Si/SiN dual-layer crossing-free central shuffle. Analysis of the on-state and off-state power transfer functions reveals the extinction ratios of individual ring resonators exceeding 25 dB, leading to switch crosstalk suppression of up to over 50 dB in the switch-and-select topology. Optical paths are assessed, showing losses as low as 0.1 dB per off-resonance ring and 0.5 dB per on-resonance ring. Photonic switching is actuated with integrated micro-heaters to give an ～24 GHz passband. The fully packaged device is flip-chip bonded onto a printed circuit board breakout board with a UV-curved fiber array.

关键词： Ultralow-crosstalk strictly non-blocking

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3D-printed facet-attached microlenses for advanced photonic system assembly

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Light(Advanced Manufacturing) 2023年第2期4卷 1-17页

作者： Yilin Xu Pascal Maier Mareike Trappen Philipp-Immanuel Dietrich Matthias Blaicher Rokas Jutas Achim Weber Torben Kind Colin Dankwart Jens Stephan Andreas Steffan Amin Abbasi padraic morrissey Kamil Gradkowski Brian Kelly Peter O’Brien Wolfgang Freude Christian Koos Institute of Photonics and Quantum Electronics(IPQ) Karlsruhe Institute of Technology(KIT)Engesserstr.576131 KarlsruheGermany Institute of Microstructure Technology(IMT) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Vanguard Automation GmbH Gablonzer Strasse.1076185 KarlsruheGermany ficon TEC Service GmbH Im Finigen 328832 AchimGermany II-VI Inc. Reuchlinstraße 10/1110553 BerlinGermany Photonics Research Group Ghent University-imecTechnologiepark-Zwijnaarde 126B-9052 GentBelgium Tyndall National Institute T12 R5CP CorkIreland Eblana Photonics Ltd. West Pier Business Campus3 Old Dunleary RdDún LaoghaireDublinA96 A621Ireland

Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing ***,scalable photonic packaging and system assembly still represents a major challenge that often hinders commercial adoption of PIC-based ***,chip-to-chip and fiber-to-chip connections often rely on so-called active alignment techniques,where the coupling efficiency is continuously measured and optimized during the assembly *** unavoidably leads to technically complex assembly processes and high cost,thereby eliminating most of the inherent scalability advantages of PIC-based *** this paper,we demonstrate that 3D-printed facet-attached microlenses(FaML)can overcome this problem by opening an attractive path towards highly scalable photonic system assembly,relying entirely on passive assembly techniques based on industry-standard machine vision and/or simple mechanical *** can be printed with high precision to the facets of optical components using multi-photon lithography,thereby offering the possibility to shape the emitted beams by freely designed refractive or reflective ***,the emitted beams can be collimated to a comparatively large diameter that is independent of the device-specific mode fields,thereby relaxing both axial and lateral alignment ***,the FaML concept allows to insert discrete optical elements such as optical isolators into the free-space beam paths between PIC *** show the viability and the versatility of the scheme in a series of selected experiments of high technical relevance,comprising pluggable fiber-chip interfaces,the combination of PIC with discrete micro-optical elements such as polarization beam splitters,as well as coupling with ultra-low back-reflection based on non-planar beam paths that only comprise tilted optical *** on our re

关键词： Photonic integration Photonic assembly Photonic packaging Additive laser manufacturing Multi-photon lithography Facet-attached microlenses Optical alignment tolerances Fiber-chip coupling Hybrid multi-chip modules

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Integrated silicon ohotonic MEMS

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Microsystems & Nanoengineering 2023年第2期9卷 227-248页

作者： Niels Quack Alain Yuji Takabayashi Hamed Sttari Pieirre Edinger Gaehun Jo Simon JBleker Carlos Errando-Herranz Kristinn BGylfason Frank Niklaus Umar Khan Peter Verheyen Arun Kumar Malik Jun Su Lee Moises Jezzini padraic morrissey Cleitus Antony Peter O'Brien Wim Bogaertso Ecole Polytechnique Federale de Lausanne(EPFL) 1015 LausanneSwitzerland school of Aerospace Mechanical and Mechatronic EngineeringThe University of SydneyCamperdownNSW 2006Australia swiss Center for Electronics and Microtechnology(CSEM) 2002 NeuchatelSwitzerland Division of Micro and Nanosystems KTH Royal Institute of Technology11428 StockholmSweden Department of Information Technology Photonics Research GroupGhent University-IMECTechnologiepark-Zwijnaarde 1269052 GentBelgium imec vzw.3DSIP Department Si Photonics GroupKapeldreef 753001 LeuvenBelgium Tyndall National Institute Lee Maltings Complex Dyke ParadeCork T12 R5CPIreland

Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications,including very high data rate optical communications,distance sensing for autonomous vehicles,photonic-accelerated computing,and quantum information *** success of silicon photonics has been enabled by the unique combination of performance,high yield,and high-volume capacity that can only be achieved by standardizing manufacturing ***,standardized silicon photonics technology platforms implemented by foundries provide access to optimized library components,including low-loss optical routing,fast modulation,continuous tuning,high-speed germanium photodiodes,and high-effciency optical and electrical ***,silicon's relatively weak electro-optic effects result in modulators with a significant footprint and thermo-optic tuning devices that require high power consumption,which are substantial impediments for very large-scale integration in silicon *** systems(MEMS)technology can enhance silicon photonics with building blocks that are compact,low-loss,broadband,fast and require very low power ***,we introduce a silicon photonic MEMS platform consisting of high-performance nano-opto-electromechanical devices fully integrated alongside standard silicon photonics foundry components,with wafer-level sealing for long-term reliability,flip-chip bonding to redistribution interposers,and fibre-array attachment for high port count optical and electrical *** experimental demonstration of fundamental silicon photonic MEMS circuit elements,including power couplers,phase shifters and wavelength-division multiplexing devices using standardized technology lifts previous impediments to enable scaling to very large photonic integrated circuits for applications in telecommunications,neuromorphic computing,sensing,programmable photonics,and quantum computing.

关键词： tuning sealing photonics

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