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氮气氛下LTCC基板Cu共烧金属化研究

稀有金属材料与工程 2007年第A2期36卷 446-448页

作者：王岩刘杨马莒生清华大学材料科学与工程系北京100084

从PMma型LTCC素坯膜的制备和PMma的排胶机理两方面,研究了LTCC基板Cu共烧金属化。结果表明,采用PMma作为粘结剂的流延浆料具有剪切变稀行为,所得的流延坯膜微观组织均匀,叠压后坯体内部无分层现象。热失重、差热和傅立叶红外光谱联用分... 详细信息

从PMma型LTCC素坯膜的制备和PMma的排胶机理两方面,研究了LTCC基板Cu共烧金属化。结果表明,采用PMma作为粘结剂的流延浆料具有剪切变稀行为,所得的流延坯膜微观组织均匀,叠压后坯体内部无分层现象。热失重、差热和傅立叶红外光谱联用分析结果表明高纯N_2气氛中PMma以解聚机理热解,热解后释放的主要产物为丙烯酸甲酯。在高纯N_2气氛中LTCC与Cu共烧后Cu金属化膜平整、致密,连通良好。经测试,基板表面Cu导体方阻小于5mΩ/□。

关键词： Cu金属化 LTCC 共烧工艺

HIGH TEMPERATURE OXIDATION AND STRUCTURE OF SCALE AND WHISKERS FOR Fe-Ni-Cr SEALING ALLOYS

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Acta Metallurgica Sinica(English Letters) 1993年第8期6卷 147-150页

作者： DONG Zhili ma jusheng TANG Xiangyun YOU Liang Tsinghua University,Beijing,China lecturer Department of materials Science and Engineering,Tsinghua University,Beijing 100084,China Tsinghua Univ Beijing China

The oxidation rate,the growth,morphology and structure of oxide scale and whiskers for Fe-Ni-Cr sealing alloys in H_2-H_2O atmosphere at high temperatures have been studied. The growth rate of scale is controlled by *... 详细信息

关键词： oxidation oxide scale oxide whisker Fe-Ni-Cr sealing alloy

Sn-Zn-Bi-In-P新型无铅焊料压缩力学性能分析及ANAND本构方程参数确定

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稀有金属材料与工程 2014年第10期43卷 2383-2388页

作者：于红娇张弓马莒生清华大学北京100084

在gleeble1500力学试验机上,对Sn-4.5Zn-2Bi-In-P,Sn-9Zn-2.5Bi-In-P,Sn-8Zn-3Bi 3种无铅焊料进行系列恒温恒应变速率的压缩试验,实验系列由3种实验温度(20,60,100℃)和5种应变速率(101,100,10-1,10-2,10-3)正交组成。结果表明:3种无铅焊料的饱和应力随应变速率的增加而增加,随温度的升高而减小;在所有实验系列中,Sn-8Zn-3Bi合金的饱和应力最大,Sn-4.5Zn-2Bi-In-P最小;应用非线性拟合方法分别确定了描述3种无铅焊料非弹性率相关性的Anand粘塑性本构方程的9个材料常数;通过实验数据与Anand模型预测数据的对比分析,表明Anand模型能有效描述3种新型无铅焊料的粘塑性行为,为3种无铅焊料焊点的可靠性模拟和失效分析提供模型支持。

关键词：新型无铅焊料压缩试验 Anand模型参数

Effects of the addition of In,Bi to Sn-Ag-Cu lead-free solders

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Effects of the addition of In,Bi to Sn-Ag-Cu lead-free solde...

第四届电子封装国际研讨会

作者： Jing Zhao Le Huang jusheng ma Department of materials Science and Engineering Tsinghua University

＜正＞The mechanical properties of the Sn-Ag-Cu lead-free solders been proved to be excellent though the melting point is *** this work,10 lead-free solders,divided into two groups,are *** has been shown that the addition of In to Sn-Ag-Cu brings a decrease of the melting point and an increase of *** addition of the Bi to Sn-Ag-Cu brings a decrease of the melting point and the solderability,though the *** enhanced

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The Changes of Mechanical Properties and Microstructure of Sn-Ag4 Solder Joints during the thermal cycling

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The Changes of Mechanical Properties and Microstructure of S...

第四届电子封装国际研讨会

作者： Guohai Chen Jianguo Cui Le Huang jusheng ma Dept.of materials Science and Engineering Tsinghua University

＜正＞The method of mount strain gages is used to measure the stress/strain hysteresis loops the solder joints under thermal *** different solders have different loops;the shapes of the loops will turn smaller and disappear at *** results of SEM show that during the thermal cycling,the microstructure of solder joints coarsens and the thickness of the intermetallic compound（IMC） layers *** changes will cause the failure of the solder joints eventually. The high sensitivity moire interometry method has been used to measure the residual thermal strain distribution and the maximum accumulated residual strain（accumulated plastic strain） of solder joints during the thermal *** experimental results showed that the strain distribution is not *** uneven distribution of residual strain shows that the uneven distribution of damage *** areas with biggest damage will failure *** results correspond with the first method well.

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The influence of dimension and graph on etching alloy

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The influence of dimension and graph on etching alloy

第四届电子封装国际研讨会

作者： Lu Chao ma jusheng Huang Le Huang Hui Dept.of materials Science & Engineering Tsinghua University

To ensure etching the Copper alloy lead frame by FeCl solution and different graphics(such as circle、square、angel) with high precision,some factors which effect the etch process like graph and dimension are discussed in a certain extent ***,when the etching solution,the temperature of experiment and other conditions are fixed,a mathematical model of the standard etching graph database which only describes the influence of graph and dimension is set *** to it we made a moulding board for the later photochemical *** the standard etching graph database of three sorts of copper alloy are set *** etching graphics includes the lines and the gaps with different dimensions、the different angels and the circles with different diameter,because they are the most common graphics of lead frame.

关键词：

Effects of Bonding Temperature on the Bonding Strength

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Effects of Bonding Temperature on the Bonding Strength

第四届电子封装国际研讨会

作者： Yudong Liu Gang Zhang Jiman Zhu Jianguo Chui jusheng ma Department of materials Science and Engineering Tsinghua University North China Research Institute of Opto-electronic Technology

＜正＞Improving In bump strength is a key problem for the interconnection reliability using In *** paper studies the effect of bonding temperature on the bonding strength,and found that the higher the bonding temperat...

关键词：

VISCOSITY OPTImaZATION OF LOW TEMPERATRUE COFIRED CERAMICS TAPE CASTING SLURRY

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VISCOSITY OPTIMAZATION OF LOW TEMPERATRUE COFIRED CERAMICS T...

第四届电子封装国际研讨会

作者： Zhenyu Han jusheng ma Honglong Ning Fuxiang Huang Guangneng Zhang Dept.of materials Science ＆ Engineering Tsinghua University

＜正＞The rheology features of tape casting of low temperature cofired ceramics have been *** show that the viscosity is proportion to solvents,the ratio of plasticizer to binder,or the slurry *** it decrease with increasing of *** the viscosity analysis,Results show the pseudoplasticity slurry is most suitable to tape casting in this case,and viscosity optimization of the slurry is given so as to give a stable suspensions and a smooth、uniform green sheet.

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硅微型惯性加速度计中敏感头的研究

新技术新工艺 2000年第3期 11-13页

作者：王谦蔡坚马莒生清华大学材料系 100084

设计了硅微型惯性加速度计的敏感头并应用激光加工和化学蚀刻相结合的工艺方法制造得到了满意的结构 ,应用激光光纤测振仪检测了悬臂梁振动特性。

关键词：敏感头激光化学蚀刻加速度计惯性仪表