Effects of the addition of In,Bi to Sn-Ag-Cu lead-free solders
作者单位：Department of Materials Science and EngineeringTsinghua University
会议名称：《第四届电子封装国际研讨会》
会议日期：2001年
学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化]
基 金：supported by National Natural Science Foundation of P.R.China Contract No.:69836030
摘 要：正The mechanical properties of the Sn-Ag-Cu lead-free solders been proved to be excellent though the melting point is *** this work,10 lead-free solders,divided into two groups,are *** has been shown that the addition of In to Sn-Ag-Cu brings a decrease of the melting point and an increase of *** addition of the Bi to Sn-Ag-Cu brings a decrease of the melting point and the solderability,though the *** enhanced