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Failure Modes of Lead Free Solder Bumps Formed by Induction Spontaneous Heating Reflow

Journal of Materials Science & Technology 2007年第1期23卷 61-67页

作者： Mingyu LI Hongbo XU jongmyung kim Hongbae kim Shenzhen Graduate School Harbin Institute of Technology Shenzhen 518055 China Jeonnam Provincial College Jeonnam 517-802 Korea

The shear failure modes and respective failure mechanism of Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder bumping on Au/Ni/Cu metallization formed by induction spontaneous heating reflow process have been investigated through the shear test after aging at 120℃ for 0, 1, 4, 9 and 16 d. Different typical shear failure behaviors have been found in the loading curves （shear force vs displacement）. From the results of interracial morphology analysis of the fracture surfaces and cross-sections, two main typical failure modes have been identified. The probabilities of the failure modes occurrence are inconsistent when the joints were aged for different times. The evolution of the brittle NiaSn4 and Cu-Ni-Au-Sn layers and the grains coarsening of the solder bulk are the basic reasons for the change of shear failure modes.

关键词： Induction spontaneous heating reflow Lead free solder Shear test Failure mode

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The State and Eminent Monks in Medieval Korea

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Fudan Journal of the Humanities and Social Sciences 2014年第4期7卷 653-672页

作者： jongmyung kim The Academy of Korean Studies 323 Haogae-ro Bundang-gu Seongnam-si 463-791 Republic of Korea

The purpose of this paper was to examine the relationship between the state and eminent monks in medieval Korea （918-1392） on the basis of various primary sources and to highlight the need of the re-examination of the nature of Korean Buddhism, and by extension, that of East Asian Buddhism. To this end, this research examines the position of Buddhism, the state Buddhist policies, the roles of monks in response to the policies, and the identity of monks in medieval Korea. The conclusion is that medieval Korea took carrot-and-stick approach to Buddhism and in response, playing as political advisors, subjects to the ruler, thaumaturgies, entrepreneurs, and even warriors, power-oriented monks ingratiated themselves with the state Buddhist policies for their sustenance on practical considerations, often violating the basic teachings of the Buddha and creating issues regarding their identity as monks. This Korean tradition in a larger part appears to be a product of the Sinicized Buddhism, thus highlighting the need of further in-depth research on the nature of Korean Buddhism in particular and that of East Asian Buddhism in general.

关键词： Eminent monks Korean Buddhism Medieval Korea State Sinicized Buddhism

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Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging

Texture evolution and its effects on growth of intermetallic...

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2016中国高端SMT学术会议

作者： Ming Yang Mingyu Li jongmyung kim Shenzhen Graduate School Harbin Institute of Technology

The growth orientation of CuSn intermetallic compounds(IMCs) formed at the eutectic Sn37Pb/polycrystalline Cu interface during solid-state aging was investigated. The results indicate that the interfacial CuSn grains exhibit textured growth under solid-state conditions, and their preferred orientations are affected by the initial joint preparation conditions. Cu6Sn5 grains in the [0001] direction normal to the interface are stable in solid and molten Sn37 Pb solder at 200 ℃, but are rapidly consumed at 280 ℃. This effect leads to the formation of different textures in the CuSn layer during the solid-state aging treatment of joints formed at 200 and 280℃. In addition, the influence of texture evolution on the growth of interfacial IMCs was evaluated. The results indicate that Sn diffusion is faster along the [0001] direction of the CuSn crystal than along an angle of 25-45° to the [0001] direction;therefore, more IMCs are generated at the interface of the joints formed at 200 ℃ than at those formed at 280 ℃ under the same solid-state reaction conditions.

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Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints

Cu6Sn5 Morphology Transition and Its Effect on Mechanical Pr...

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2016中国高端SMT学术会议

作者： MING YANG MINGYU LI LING WANG YONGGAO FU jongmyung kim LVQIAN WENG State Key Laboratory of Advanced Welding Production Technology Shenzhen Graduate School Harbin Institute of Technology China National Electric Apparatus Research Institute

The morphologies of CuSn grains formed at the interface between Sn-3.5Ag(wt.% unless otherwise specified) and Cu substrates were studied in this work. Reflow experiments were performed for 60 s at peak temperatures of 513 K,533 K, 543 K, and 553 K. Two morphologies of interfacial CuSn grains wereobserved in wetting reactions: prism type, above 543 K, and scallop type,below 533 K. During aging, the two morphologies gradually transitioned to layer type. These three morphologies could be transformed into each other as long as the corresponding condition changed. The morphology transition of CuSn in the wetting reaction was explained by the change in Jackson’s parameter with temperature. In addition, the effect of the Cu content in molten solder on interfacial CuSn grains was examined. Significant differences in shear strength were observed for solder joints with different interfacial CuSn morphologies in the case of a lower shear height. Joint strength is discussed in terms of the microstructure of the solder matrix and the morphology of interfacial CuSn grains.

关键词： Cu6Sn5 morphology transition lead-free solder shear strength

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Sn3．5Ag0．75Cu钎料与Au／Ni／Cu焊盘接头老化过程中IMC组织的演变

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现代表面贴装资讯 2007年第2期6卷 42-44页

作者：秦毅李明雨 kim jongmyung kim Daewon 哈尔滨工业大学深圳研究生院 Jeonnam Provincial College

通过SEM（Scanning Electron Microscope）背散射照片和EDX（Energy Dispersive X-Ray Spectroscopy）成分分析研究了无铅钎料Sn3．5Ag0．75Cu与Au／Ni／Cu焊盘接头在老化过程中其界面金属间化合物（IMC）的生长演变过程；在175℃温度... 详细信息

通过SEM（Scanning Electron Microscope）背散射照片和EDX（Energy Dispersive X-Ray Spectroscopy）成分分析研究了无铅钎料Sn3．5Ag0．75Cu与Au／Ni／Cu焊盘接头在老化过程中其界面金属间化合物（IMC）的生长演变过程；在175℃温度条件下老化72h后发现Cu可以穿过Ni层参与形成界面金属间化合物（Au，Ni，Cu）Sn4和（Au，Ni，Cu）6Sn5；基于金属间化合物生长动力学理论计自得该焊点结构中AuSn4生长的活化能为53．78KJ／mol。

关键词：金属间化合物无铅钎料活化能

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