Failure Modes of Lead Free Solder Bumps Formed by Induction Spontaneous Heating Reflow

作     者：Mingyu LI Hongbo XU Jongmyung KIM Hongbae KIM 

作者机构：Shenzhen Graduate School Harbin Institute of Technology Shenzhen 518055 China Jeonnam Provincial College Jeonnam 517-802 Korea 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2007年第23卷第1期

页      面：61-67页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：国家自然科学基金 NURI Project, Korea 

主　　题：Induction spontaneous heating reflow Lead free solder Shear test Failure mode 

摘      要：The shear failure modes and respective failure mechanism of Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder bumping on Au/Ni/Cu metallization formed by induction spontaneous heating reflow process have been investigated through the shear test after aging at 120℃ for 0, 1, 4, 9 and 16 d. Different typical shear failure behaviors have been found in the loading curves （shear force vs displacement）. From the results of interracial morphology analysis of the fracture surfaces and cross-sections, two main typical failure modes have been identified. The probabilities of the failure modes occurrence are inconsistent when the joints were aged for different times. The evolution of the brittle NiaSn4 and Cu-Ni-Au-Sn layers and the grains coarsening of the solder bulk are the basic reasons for the change of shear failure modes.