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Scalable orthogonal delay-division multiplexed OEO artificial neural network trained for TI-ADC equalization

Photonics Research 2024年第1期12卷 85-105页

作者： ANDREA ZAZZI ARKA DIPTA DAS LUKAS HüSSEN RENATO NEGRA jeremy witzens Institute of Integrated Photonics RWTH Aachen University52074 AachenGermany Chair of High-Frequency Electronics RWTH Aachen University52074 AachenGermany

We propose a new signaling scheme for on-chip optical-electrical-optical artificial neural networks that utilizes orthogonal delay-division multiplexing and pilot-tone-based self-homodyne *** scheme offers a more efficient scaling of the optical power budget with increasing network *** simulations,based on220 nm silicon-on-insulator silicon photonics technology,suggest that the network can support 31×31 neurons,with 961 links and freely programmable weights,using a single 500 m W optical comb and a signal-to-noise ratio of 21.3 d B per ***,it features a low sensitivity to temperature fluctuations,ensuring that it can be operated outside of a laboratory *** demonstrate the network’s effectiveness in nonlinear equalization tasks by training it to equalize a time-interleaved analog-to-digital converter(ADC)architecture,achieving an effective number of bits over 4 over the entire 75 GHz ADC *** anticipate that this network architecture will enable broadband and low latency nonlinear signal processing in practical settings such as ultra-broadband data converters and real-time control systems.

关键词： network delay artificial

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Modeling of a SiGeSn quantum well laser

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Photonics Research 2021年第7期9卷 1234-1254页

作者： BAHAREH MARZBAN DANIELA STANGE DENIS RAINKO ZORAN IKONIC DAN BUCA jeremy witzens Institute of Integrated Photonics RWTH Aachen University52074 AachenGermany Jülich-Aachen Research Alliance(JARA) Fundamentals of Future Information TechnologiesGermany Peter Grünberg Institute 52428 JulichGermany University of Leeds School of Electronic and Electrical EngineeringWoodhouseLeeds LS29JTUK

We present comprehensive modeling of a Si GeSn multi-quantum well laser that has been previously experimentally shown to feature an order of magnitude reduction in the optical pump threshold compared to bulk *** combine experimental material data obtained over the last few years with k·p theory to adapt transport,optical gain,and optical loss models to this material system (drift-diffusion,thermionic emission,gain calculations,free carrier absorption,and intervalence band absorption). Good consistency is obtained with experimental data,and the main mechanisms limiting the laser performance are discussed. In particular,modeling results indicate a low non-radiative lifetime,in the 100 ps range for the investigated material stack,and lower than expectedΓ-L energy separation and/or carrier confinement to play a dominant role in the device properties. Moreover,they further indicate that this laser emits in transverse magnetic polarization at higher temperatures due to lower intervalence band absorption losses. To the best of our knowledge,this is the first comprehensive modeling of experimentally realized Si GeSn lasers,taking the wealth of experimental material data accumulated over the past years into account. The methods described in this paper pave the way to predictive modeling of new (Si)GeSn laser device concepts.

关键词： laser polarization pump

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Hybrid multi-chip assembly of optical communication engines by in situ 3D nanolithography

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Light(Science & Applications) 2020年第1期9卷 1340-1350页

作者： Matthias Blaicher Muhammad Rodlin Billah Juned Kemal Tobias Hoose Pablo Marin-Palomo Andreas Hofmann Yasar Kutuvantavida Clemens Kieninger Philipp-Immanuel Dietrich Matthias Lauermann Stefan Wolf Ute Troppenz Martin Moehrle Florian Merget Sebastian Skacel jeremy witzens Sebastian Randel Wolfgang Freude Christian Koos Institute of Photonics and Quantum Electronics(IPQ) Karlsruhe Institute of Technology(KIT)Engesserstraße 576131 KarlsruheGermany Institute for Microstructure Technology(IMT) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Institute for Automation and Applied Informatics(IAI) KITHermann-von-Helmholtz-Platz 176344 Eggenstein-LeopoldshafenGermany Vanguard Automation GmbH Gablonzer StraBe 1076185 KarlsruheGermany Fraunhofer Institute for Telecommunications Heinrich Hertz Institute(HHI)Einsteinufer 3710587 BerlinGermany Institute of Integrated Photonics(IPH) RWTH AachenSommerfeldstraße 18/2452074 AachenGermany

Three-dimensional(3D)nano-printing of freeform optical waveguides,also referred to as photonic wire bonding,allows for efficient coupling between photonic chips and can greatly simplify optical system *** a key advantage,the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips,thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision ***,while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments,it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability *** this paper,we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode *** a first experiment,we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation.A second experiment is dedicated to a four-channel coherent transmitter,operating at a net data rate of 732.7 Gbit/s-a record for coherent silicon photonic transmitters with co-packaged *** dedicated test chips,we further demonstrate automated mass production of photonic wire bonds with insertion losses of(0.7±0.15)dB,and we show their resilience in environmental-stability tests and at high optical *** results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

关键词： communication lithography bonding

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