CMP Service for Prototyping and Low Volume Production
作者单位：CMP46 Avenue Felix VIALLET38031 Grenoble CedexFrance
会议名称：《2005 6th International Conference on ASIC》
会议日期：2005年
学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学]
关 键 词：Prototypes Production BiCMOS integrated circuits Gallium arsenide HEMTs Micromechanical devices Educational institutions Laboratories Textile industry Silicon germanium
摘 要：正CMP aims at providing Universities, Research Laboratories and Industries with the possibility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently,users are serviced for CMOS double layer poly/double layer metal（DLP/DLM） 0.8,DLM/TLM 0.6μ,DLP/4LM 0.35μ,SLP/6LM 0.18μ,SLP/6LM 0.13μ,SLP/7LM 90nm,BiCMOS DLP/DLM 0.8μ, SiGe 0.35μSLP/5LM,SiGe.C 0.25μSLP/5LM and GaAs HEMT 0.2μ.About 40 multi-project runs are offered per year. Micro Electro Mechanical Systems（MEMS） are also provided in standard CMP runs in CMOS DLP/DLM 0.8μ0.6μ,BiCMOS DLP/DLM 0.8μand HEMT GaAs 0.2μ,using compatible front-side bulk micromachining. MUMPS processes are offered as surface micro-machining allowing integrating MEMS only microstructures.