APPLICATION OF MODELLING FOR THE OPTIMIZATION OF THE BPSG DEPOSITION PROCESS
作者单位：Inst.of Electron Technol.al.Lotnik6w 32-4602-668 WarsawPoland IMIOWarsaw Technical Universityul.Koszykowa 7500-662 WarsawPoland
会议名称：《The Second International Conference on Solid State and Integrated Circuit Technology》
会议日期：1989年
学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学]
摘 要：正From among various surface planarization methods,BPSG-deposition and reflow has been widely accepted in the case of shallow junction VLSI technology to ensure;continuity and uniformity of metal interconnects over steps and dry etched vertical contact walls. From the point of view of subsequent processing results and finally of yield the most important properties of the BPSG.