Stress Analysis of Curved Joints with Non-uniform Bondline Thickness

作     者：Liyong Tong and Xiannian Sun Department of Aeronautical Engineering University of Sydney NSW 2006 AUSTRALIA 

会议名称：《第十三届国际复合材料会议》

会议日期：2001年

学科分类：081702[工学-化学工艺] 08[工学] 0817[工学-化学工程与技术] 

关 键 词：bonded joints curvature non-uniform bondline thickness stress adhesive element 

摘      要：正Adhesive bonding has been used to join metallic and composite structural components to achieve their designated structural stiffness and strengths. Current analysis methods and empirical databases for composite bonded joint design are limited to flat joint with uniform thickness of adhesive layer. However, it is practical that the adhesive layer in a bonded joint is often non-uniform due to primarily lack of technologies for accurate control of bondline thickness in manufacturing structural components, especially for a curved joint. The effect of non-uniform adhesive layer thickness on stress in bonded joint is still unknown. In this paper,