Design Tools for 3D Mixed Mode Placement
作者单位：Department of Computer Science and TechnologyTsinghua University Strategic CAD LabIntelHillsboroOR 97124USA
会议名称：《2005 6th International Conference on ASIC》
会议日期：2005年
学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080203[工学-机械设计及理论] 0802[工学-机械工程]
基 金：supported by the Hi-Tech Research & Development (863)Program of China 2002AA1Z1460 the National Natural Science Foundation of China(NSFC)90407005
关 键 词：Thermal management Clustering algorithms Routing Packaging Circuits Complexity theory Nonhomogeneous media Graphical user interfaces Temperature Computer science
摘 要：正We present a set of design tools for three dimensional （3D） mixed mode placement（MMP）.The hierarchical 3D MMP design tool is composed of a hierarchical clustering package, a new 3D floorplanning tool,route planning tool,and 2D global/detailed placement *** have analyzed the performance of 3D circuit using these *** is shown that total wirelength could be reduced by 25%to 43%compared with traditional 2D design using two to four stacked *** incorporating thermal management and analysis,we also investigate the thermal scalability of 3D integration.