Experimental and finite element analysis on determining the fatigue life of pb-free solder joint(Sn-0.5Cu-3Bi-1Ag)used in electronic packages under harmonic loads

作     者：Jayesh S Jacob Elias 

作者机构：Department of Mechanical Engineering School of EngineeringCochin University of Science and Technology KochiKerala-682022India 

出 版 物：《International Journal of Modeling, Simulation, and Scientific Computing》 (建模、仿真和科学计算国际期刊（英文）)

年 卷 期：2020年第11卷第3期

页      面：60-67页

核心收录：

学科分类：08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

主　　题：PCB lead free solder joint FEA PBGA S-N curve 

摘      要：Electronic packages that are used these days are exposed to different types of vibration loadings in their usage *** vibration exposure can be categorized as harmonic and random *** reliability assessment of modern electronic systems is considered,vibration loading has an important role to *** of the biggest challenges facing today is the accurate and rapid assessment of fatigue life under the vibration *** solder joints were made of lead-tin *** to many environment legislations and rules,lead is prohibited as an ingredient in the solder *** reason for the prohibition of the usage of the lead is that it poisons the *** this study,Sn-0.5Cu-3Bi-1Ag is used as the lead-free solder *** life prediction of electronic package containing SAC405 is conducted with the aid of vibration testing and Finite element analysis under harmonic vibration loading.A specially designed Plastic Ball Grid Array Package(PBGA)component is mounted on Printed Circuit Board(PCB).It is taken as a test vehicle for the vibration *** test vehicle is excited by a sinusoidal *** frequency of this excitation equals the fundamental frequency of the test vehicle and it is continued till the component *** the solder balls are very small for direct measurement,Finite Element analysis(FEA)is used for noting down the *** stress versus failures cycles(S-N)curve is made by relating both the stresses on the solder balls obtained and the number of failure cycles from vibration *** fatigue life of the component can be estimated from the generated S-N *** is analyzed that the methodology is effective in predicting the component’s ***,the reliability of electronic package can be improved.