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Predicting and controlling interfacial microstructure of magnesium/aluminum bimetallic structures for improved interfacial bonding

Predicting and controlling interfacial microstructure of magnesium/aluminum bimetallic structures for improved interfacial bonding

作     者:Ziang Zhu Renhai Shi Andrew D.Klarner Alan A.Luo Yiqing Chen Ziang Zhu;Renhai Shi;Andrew D.Klarner;Alan A.Luo;Yiqing Chen

作者机构:Materials Science and EngineeringThe Ohio State UniversityColumbusOHUSA Materials Science and EngineeringHefei University of TechnologyHefeiAnhuiChina Integrated Systems EngineeringThe Ohio State UniversityColumbusOHUSA now at M Cubed TechnologiesNewarkDEUSA 

出 版 物:《Journal of Magnesium and Alloys》 (镁合金学报(英文))

年 卷 期:2020年第8卷第3期

页      面:578-586页

核心收录:

学科分类:0806[工学-冶金工程] 08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学] 0703[理学-化学] 0801[工学-力学(可授工学、理学学位)] 

基  金:the National Natural Science Foundation of China[grant number 51571080] 

主  题:Bimetallic structure Interfacial bonding CALPHAD and diffusion modeling Aluminum alloys Magnesium alloys. 

摘      要:In this study,an overcasting process followed by a low-temperature(200°C)annealing schedule has been developed to bond magnesium to aluminum *** software was used to optimize the process parameters during the overcasting process which lead to Mg/Al bimetallic structures to be successfully produced without formation of Mg-Al intermetallic *** microstructure evolution during annealing,including the formation and growth of Al-Mg interdiffusion layer and intermetallic phases(Al12Mg17 and Al3Mg2),was experimentally observed for the first time with direct evidence,and predicted using Calculation of Phase Diagrams(CALPHAD)*** interfacial strength was achieved when the interdiffusion layer formed at the Mg/Al interface reached a maximum thickness the without formation of brittle intermetallic *** precise diffusion modeling of the Mg/Al interface provides an efficient way to optimize and control the interfacial microstructure of Mg/Al bimetallic structures for improved interfacial bonding.

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