Effect of HT on the Interface Diffusion and Microstructure of Cu-Nb Micro-composites

作     者：Liang Ming, Lu Yafeng, Sun Lufei, Li Chengshan, Yan Guo Northwest Institute for Nonferrous Metal Research, Xi’an 710016, China 

作者机构：NW Inst Nonferrous Met Res Superconducting Mat Res Ctr Xian 710016 Peoples R China 

出 版 物：《稀有金属材料与工程》 (Rare Metal Materials and Engineering)

年 卷 期：2011年第40卷第S3期

页      面：376-379页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：Key Program of National Natural Science Foundation of China (51031002) 

主　　题：Cu-Nb heat treatment microstructure diffusion 

摘      要：We have fabricated high strength and conductivity Cu-Nb micro-composites by bundling and drawing process. The interface diffusion and microstructure of Cu-17vol% Nb composites experienced severe plastic deformation at different heat treatment conditions are investigated. Diffusion at Cu/Nb interface of Nb filaments is observed by scanning electron microscopy and energy dispersive X-ray spectroscopy. The interface characteristic and edge spheroidization of Nb filaments are discussed.