Machining of Single‑Crystal Sapphire with Polysaccharide‑Bonded Abrasive Tool

作     者：WU Zhe ZHU Yanfei CHEN Junpeng ZHU Zichao LIU Zhifeng YUAN Julong YAO Weifeng 吴喆;朱衍飞;陈俊鹏;朱自超;刘志峰;袁巨龙;姚蔚峰

作者机构：School of Mechanical EngineeringHefei University of TechnologyHefei 230009P.R.China Ultra⁃precision Machining CenterZhejiang University of TechnologyHangzhou 310014P.R.China College of Mechanical and Electrical EngineeringShaoxing UniversityShaoxing 312000P.R.China 

出 版 物：《Transactions of Nanjing University of Aeronautics and Astronautics》 (南京航空航天大学学报（英文版）)

年 卷 期：2020年第37卷第3期

页      面：360-369页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：supported by the National Science Foundation of China (Nos.51605129,51705330) China Postdoctoral Science Foundation (No. 2015M581977) Anhui Provincial Natural Science Foundation(No.1708085ME109) 

主　　题：polysaccharide binder microwave treatment single-crystal sapphire green manufacturing 

摘      要：A novel polysaccharide-bonded abrasive tool is proposed for the green machining of single-crystal *** prescription and manufacturing process of the proposed tool is designed,and the gelation property of polysaccharide by microwave treatment is *** tool samples are fabricated,and a machining experiment on a single-crystal sapphire is *** is found that the crystallinity of polysaccharide gel decreases as the proportion of cross-linked polysaccharide *** tool samples with cross-linked polysaccharide present higher surface *** the new abrasive tool,the surface quality of sapphire wafer can be significantly *** new tool with an abrasive to binder ratio of 2∶1 attains a material removal rate of 0.68μm/*** is found that increasing the abrasive to binder ratio leads to better self-dressing performance but worse material removal ability and greater loss of abrasive tool *** validity of polysaccharide as an abrasive tool binder is preliminarily verified.