Highly switchable and reversible dry adhesion for transfer printing

作     者：Yonggang Huang Yonggang Huang

作者机构：Departments of Civil and Environmental Engineering Mechanical Engineering and Materials Science and Engineering Center for Bio-Integrated Electronics Northwestern University 

出 版 物：《National Science Review》 (国家科学评论(英文版))

年 卷 期：2020年第7卷第3期

页      面：558-559页

核心收录：

学科分类：08[工学] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

主　　题：Highly switchable and reversible dry adhesion for transfer printing 

摘      要：As an emerging assembly technique to transfer micro/nano-objects (***) from donor substrate to receiver substrate using soft polymeric stamps,transfer printing has become increasingly popular in the last decade due to its unique capability of integrating diverse materials in various structural layouts.A growing number of applications are