DNA origami mediated electrically connected metal–semiconductor junctions
DNA origami 电子上调停了连接 metalsemiconductor 连接作者机构：Department of Chemistry and BiochemistryBrigham Young UniversityProvoUT 84602USA Department of Chemical EngineeringBrigham Young UniversityProvoUT 84602USA Department of Physics and AstronomyBrigham Young UniversityProvoUT 84602USA
出 版 物：《Nano Research》 (纳米研究（英文版）)
年 卷 期：2020年第13卷第5期
页 面：1419-1426页
核心收录：
学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学]
主 题：current-voltage measurement DNA nanofabrication electroless plating gold nanorods nanoelectronics tellurium nanorods
摘 要：DNA-based nanofabrication of inorganic nanostructures has potential application in electronics,catalysis,and *** DNA metallization has generated conductive DNA-assembled nanostructures;however,the use of semiconductors and the development of well-connected nanoscale metal-semiconductor junctions on DNA nanostructures are still at an early ***,we report the first fabrication of multiple electrically connected metal-semiconductor junctions on individual DNA origami by location-specific binding of gold and tellurium *** attachment to DNA origami was via DNA hybridization for Au and by electrostatic interaction for *** gold plating was used to create nanoscale metal-semiconductor interfaces by filling the gaps between Au and Te ***-point electrical characterization indicated that the Au-Te-Au junctions were electrically connected,with current-voltage properties consistent with a Schottky ***-based nanofabrication of metal-semiconductor junctions opens up potential opportunities in nanoelectronics,demonstrating the power of this bottom-up approach.
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