Synergistic inhibitive effect of cysteine and iodide ions on corrosion behavior of copper in acidic sulfate solution
在酸的硫酸盐答案的铜的腐蚀行为上的半胱氨酸和碘化物离子的 Synergistic 禁止的效果作者机构:National Center for Materials Service SafetyUniversity of Science and Technology BeijingBeijing 100083China Grinm Advanced Materials Co.LtdBeijing 100088China Grirem Advanced Materials Co.LtdBeijing 100088China
出 版 物:《Rare Metals》 (稀有金属(英文版))
年 卷 期:2021年第40卷第5期
页 面:1317-1328页
核心收录:
学科分类:080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)]
基 金:financially supported by the Development and Reform Committee of PRC(People’s Republic of China)(No.YYXM-1412-0001) China Postdoctoral Science Foundation(No.2017M620612) the Fundamental Research Funds for the Central Universities(No.FRF-TP-16-040A1) the Program of the Ministry of Education of China for Introducing Talents of Discipline to Universities(111 Project)(No.B12012)
主 题:Copper Corrosion inhibitor Cysteine(Cys) Iodide ion Synergistic effect
摘 要:The synergistic inhibitive effect of cysteine(Cys)and iodide ions on the corrosion behavior of copper was examined in a 0.5 mol·L^(-1) Na_(2)SO_(4) *** polarization curve revealed that Cys acted as a mixed type inhibitor with a major effect on the cathodic process,consequently decreased the corrosion current density by a great extent and shifted the corrosion potential *** investigated results suggested that iodide ions can enhance the inhibition efficiency of *** inhibition mechanism of Cys and the synergistic effect of the two examined reagents were investigated by fitting experimental impedance data according to a projected equivalent circuit for metal/electrolyte *** analysis further confirmed that the corrosion inhibition was realized due to the adsorption of the inhibitor molecules at the metal/solution *** adsorption isotherm was proposed to describe inhibition mechanism of Cys on copper *** sites of Cys molecule were used to form inhibitor film on the copper *** of iodide ion increased its inhibition efficiency by enhancing adsorption of Cys cations through electrostatic interaction with I-pre-adsorbed on Cu surface.