Two-stage Hall-Petch relationship in Cu with recrystallized structure

作     者：Y.Z.Tian Y.P.Ren S.Gao R.X.Zheng J.H.Wang H.C.Pan Z.F.Zhang N.Tsuji G.W.Qin Y.Z.Tian;Y.P.Ren;S.Gao;R.X.Zheng;J.H.Wang;H.C.Pan;Z.F.Zhang;N.Tsuji;G.W.Qin

作者机构：Key Laboratory for Anisotropy and Texture of Materials(Ministry of Education)School of Materials Science and EngineeringNortheastern UniversityShenyang 110819China State Key Laboratory of Rolling and AutomationNortheastern UniversityShenyang 110819China Department of Materials Science and EngineeringKyoto UniversityYoshida-honmachiSakyo-kuKyoto 606-8501Japan Elements Strategy Initiative for Structural Materials(ESISM)Kyoto UniversityYoshida-honmachiSakyo-kuKyoto606-8501Japan Key Laboratory of Aerospace Advanced Materials and Performance of Ministry of EducationSchool of Materials Science and EngineeringBeihang UniversityBeijing 100191China State Grid Urban and Rural Electric Power Design Research(Beijing)Co.LtdBeijing 100078China Laboratory of Fatigue and Fracture for MaterialsInstitute of Metal ResearchChinese Academy of SciencesShenyang 110016China School of Materials Science and EngineeringUniversity of Science and Technology of ChinaHefei 230026China 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2020年第47卷第13期

页      面：31-35页

核心收录：

学科分类：08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：supported financially by the Fundamental Research Funds for the Central Universities(No.N180204015) supported by Chinese Academy of Sciences(CAS)and Japan Society for the Promotion of Science(JSPS)through the Bilateral Program(No.GJHZ1774) supported by Ministry of Education,Culture,Sports,Science and Technology(MEXT),Japan,through the Elements Strategy Initiative for Structural Materials(ESISM)Project and the Grant-in-Aid for Scientific Research(S)(No.15H05767) 

主　　题：Cu Yield strength Hall-Petch relationship Ultrafine grain Recrystallization 

摘      要：Although Cu was studied extensively,the Hall-Petch relationship was mainly reported in the coarsegrained *** this work,fully recrystallized Cu specimens with a wide grain size regime of 0.51–14.93μm manifest a two-stage Hall-Petch *** is a critical grain size of 3μm that divides stagesⅠandⅡwhere the Hall-Petch slope k value are quite *** stageⅡis supposed to be validified down to 100 nm at least by comparing with a Cu-Ag *** critical grain size varies in different materials systems,and the underline mechanisms are discussed based on the dislocation glide modes.