Interfacial microstructure of Cu Cr/1Cr18Ni9Ti bi-metal materials and its effect on bonding strength

作     者：ZHANG Qiao LIANG ShuHua ZOU JunTao YANG Qing 

作者机构：Shaanxi Province Key Laboratory of Electrical Materials and Infiltration Technology Xi'an University of Technology 

出 版 物：《Science China(Technological Sciences)》 (中国科学（技术科学英文版）)

年 卷 期：2015年第58卷第5期

页      面：825-831页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：supported by the National Natural Science Foundation of China(Grant No.51371139) Science and Technique Innovation Program of Shaanxi Province(Grant No.2012KTCQ01-14) Pivot Innovation Team of Shaanxi Electric Materials and the Infiltration Technique(Grant No.2012KCT-25) Shaanxi Provincial Project of Special Foundation of Key Disciplines 

主　　题：bonding modulus tensile interfacial SAED hardness closing polymerization Figure bonded 

摘      要：The Cu Cr/1Cr18Ni9 Ti bi-metal materials were prepared by the solid-liquid bonding method. The microstructures, mechanical properties and formation mechanism of the bonding interface were studied. The results show that there exists a serrated transition layer with a certain width at the interface of Cu Cr/1Cr18Ni9 Ti bi-metal materials, and the transition layer consists of Fe-based and Cu-based solid solutions. The elastic modulus and hardness reach the maximum values at the interface closing to the 1Cr18Ni9 Ti zone. The bonding temperature has a significant effect on the width and morphology of the transition layer. The interfacial bonding strength is at least 30% higher than that of the Cu Cr alloy, and the tensile fracture occurs at the side of the Cu Cr alloy rather than at the bonding interface.